公开(公告)号：US20120073747A1

公开(公告)日：2012-03-29

申请号：US13214009

申请日：2011-08-19

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： B32B37/00

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

公开(公告)号：US20110099779A1

公开(公告)日：2011-05-05

申请号：US12929234

申请日：2011-01-10

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/09672 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49167

摘要： A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，其包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。

公开(公告)号：US20120075818A1

公开(公告)日：2012-03-29

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

发明人： Sang Chul LEE ,  Jung Soo BYUN ,  Jin Seon PARK ,  Doo Hwan LEE

IPC分类号： H05K1/18 ,  B32B37/22

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US08826527B2

公开(公告)日：2014-09-09

申请号：US13620153

申请日：2012-09-14

申请人： Jin Seon Park

发明人： Jin Seon Park

IPC分类号： H05K3/30 ,  H01L23/498 ,  H01L23/13 ,  H05K1/18 ,  H01L21/48 ,  H01L23/538 ,  H01L23/00 ,  H05K3/46

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/18 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

摘要翻译： 本文公开了一种印刷电路板，包括：基板，包括其中形成空腔的绝缘层; 安装在基板的空腔中并具有连接端子的电子部件; 绝缘材料层，形成在所述基板的一侧以埋置所述电子部件; 形成在所述基板的另一侧上并包括与所述电子部件的连接端子连接的连接图案的第一电路层; 以及形成在所述绝缘材料层上的第二电路层。 印刷电路板的优点在于可以通过调节绝缘层或绝缘材料的厚度，热膨胀系数和弹性模量来防止其翘曲并确保电子部件和电路层之间的电连接的可靠性。

公开(公告)号：US20100236821A1

公开(公告)日：2010-09-23

申请号：US12491043

申请日：2009-06-24

申请人： Jin Seon Park ,  Sung Yi ,  Jung Won Lee

发明人： Jin Seon Park ,  Sung Yi ,  Jung Won Lee

IPC分类号： H05K1/16

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/49894 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/3511 ,  H05K3/321 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/10674 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00

摘要： Disclosed herein is an electronic component-embedded printed circuit board including: a base plate including an insulating resin layer and circuit layers; and an electronic component embedded in the insulating resin layer, wherein the insulating resin layer has a thickness 1.3˜3 times greater than that of the electronic component. The electronic component-embedded printed circuit board has an optimum thickness ratio of its constituents in order to minimize the warpage thereof at the time of manufacturing the same.

摘要翻译： 这里公开了一种电子部件嵌入式印刷电路板，包括：基板，包括绝缘树脂层和电路层; 以及埋设在所述绝缘树脂层中的电子部件，所述绝缘树脂层的厚度为所述电子部件的厚度的1.3〜3倍。 电子元件嵌入式印刷电路板具有其成分的最佳厚度比，以便使其制造时的翘曲最小化。

公开(公告)号：US08881382B2

公开(公告)日：2014-11-11

申请号：US13214009

申请日：2011-08-19

申请人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

发明人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC分类号： H05K3/36 ,  H05K3/30 ,  H05K3/10 ,  H05K1/09 ,  H05K1/18 ,  H01L23/00 ,  H05K3/46

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.

摘要翻译： 本发明的实施例提供一种制造嵌入式印刷电路板的方法，其包括以下顺序的操作：形成第一腔和第三腔的第一操作，将第一器件设置在第一腔中，并且设置第三腔 装置在第三腔中; 形成第二腔和第四腔的第二操作，将第二装置设置在所述第二腔中; 提供绝缘构件的第三操作; 设置第一基底基板和第二基底基板并将第一基底基板，第二基底基板和绝缘部件压合在一起的第四操作; 以及形成第一覆铜层压板并形成第二覆铜层压板的第五操作。

公开(公告)号：US20130008024A1

公开(公告)日：2013-01-10

申请号：US13620153

申请日：2012-09-14

申请人： Jin Seon PARK

发明人： Jin Seon PARK

IPC分类号： H05K3/10

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/18 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

摘要翻译： 本文公开了一种印刷电路板，包括：基板，包括其中形成空腔的绝缘层; 安装在基板的空腔中并具有连接端子的电子部件; 绝缘材料层，形成在所述基板的一侧以埋置所述电子部件; 形成在所述基板的另一侧上并包括与所述电子部件的连接端子连接的连接图案的第一电路层; 以及形成在所述绝缘材料层上的第二电路层。 印刷电路板的优点在于可以通过调节绝缘层或绝缘材料的厚度，热膨胀系数和弹性模量来防止其翘曲并确保电子部件和电路层之间的电连接的可靠性。

公开(公告)号：US08339796B2

公开(公告)日：2012-12-25

申请号：US12972355

申请日：2010-12-17

申请人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

发明人： Sang Chul Lee ,  Jung Soo Byun ,  Jin Seon Park ,  Doo Hwan Lee

IPC分类号： H05K1/18

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L24/24 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/24227 ,  H01L2224/32145 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/3511 ,  H05K3/4652 ,  H05K2203/063 ,  H05K2203/1469 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

摘要翻译： 公开了一种嵌入式印刷电路板，其中可以将具有不同厚度的电子器件嵌入到一起，从而实现高密度电子器件，并且当嵌入具有相当不同厚度的电子器件时，可以将相对较薄的两个电子器件嵌入 垂直方向，从而减少了嵌入区域并抑制了印刷电路板的翘曲，并且将其厚度可变地调节的绝缘构件插入在基底之间，使得电子器件之间的空间被完全填充，从而解决了问题 的空隙缺陷，导致可靠的印刷电路板，并且当基底包括由金属制成的芯时，印刷电路板可以较少翘曲。 还提供了一种制造嵌入式印刷电路板的方法。

公开(公告)号：US08305766B2

公开(公告)日：2012-11-06

申请号：US12841809

申请日：2010-07-22

申请人： Jin Seon Park

发明人： Jin Seon Park

IPC分类号： H01K1/18

CPC分类号： H05K1/185 ,  H01L21/4846 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/18 ,  H05K3/4602 ,  H05K2201/10674 ,  H05K2203/0191 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155

摘要： Disclosed herein is a printed circuit board, including: a substrate including an insulation layer in which a cavity is formed; an electronic component mounted in the cavity of the substrate and having connection terminals; an insulation material layer formed on one side of the substrate to bury the electronic component; a first circuit layer formed on the other side of the substrate and including a connection pattern connecting with the connection terminals of the electronic component; and a second circuit layer formed on the insulation material layer. The printed circuit board is advantageous in that it can prevent the warpage thereof and ensure the reliability of electrical connection between an electronic component and a circuit layer by adjusting the thickness, thermal expansion coefficient and elastic modulus of insulation layer or the insulating material.

摘要翻译： 本文公开了一种印刷电路板，包括：基板，包括其中形成空腔的绝缘层; 安装在基板的空腔中并具有连接端子的电子部件; 绝缘材料层，形成在所述基板的一侧以埋置所述电子部件; 形成在所述基板的另一侧上并包括与所述电子部件的连接端子连接的连接图案的第一电路层; 以及形成在所述绝缘材料层上的第二电路层。 印刷电路板的优点在于可以通过调节绝缘层或绝缘材料的厚度，热膨胀系数和弹性模量来防止其翘曲并确保电子部件和电路层之间的电连接的可靠性。

公开(公告)号：US08302270B2

公开(公告)日：2012-11-06

申请号：US12929234

申请日：2011-01-10

申请人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

发明人： Woon-Chun Kim ,  Sung Yi ,  Hwa-Sun Park ,  Hong-Won Kim ,  Dae-Jun Kim ,  Jin-Seon Park

IPC分类号： H01G7/00

CPC分类号： H05K1/162 ,  H05K3/108 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/09672 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49167

摘要： A method of manufacturing a capacitor-embedded printed circuit board that includes fabricating a capacitor substrate having at least one inner electrode formed on one side of a dielectric layer; aligning a semi-cured insulation layer with one side of a core layer, and aligning the capacitor substrate with the semi-cured insulation layer such that the inner electrode faces the semi-cured insulation layer; and collectively stacking the core layer, the semi-cured insulation layer, and the capacitor substrate.

摘要翻译： 一种制造电容器嵌入式印刷电路板的方法，其包括制造具有形成在电介质层的一侧上的至少一个内部电极的电容器基板; 将半固化绝缘层与芯层的一侧对准，并将电容器基板与半固化绝缘层对准，使得内电极面向半固化绝缘层; 并且集中地堆叠芯层，半固化绝缘层和电容器基板。