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公开(公告)号:US20050106329A1
公开(公告)日:2005-05-19
申请号:US10888286
申请日:2004-07-09
申请人: Brian Lewis , Gerard Minogue , Robert Detig , Dietmar Eberlein , Bawa Singh , Michael Marczi , Kenneth Reilly
发明人: Brian Lewis , Gerard Minogue , Robert Detig , Dietmar Eberlein , Bawa Singh , Michael Marczi , Kenneth Reilly
IPC分类号: B01J19/08 , B05D1/06 , B05D1/32 , B23K3/06 , C23C20060101 , H01L21/288 , H01L21/48 , H01L21/60 , H05K3/34
CPC分类号: H05K3/3484 , B23K3/0607 , H01L21/288 , H01L21/2885 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03622 , H01L2224/03912 , H01L2224/0401 , H01L2224/05023 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/11005 , H01L2224/11332 , H01L2224/11334 , H01L2224/114 , H01L2224/11442 , H01L2224/116 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01049 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/12042 , H05K3/3478 , H05K2203/0338 , H05K2203/041 , H05K2203/0425 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/13099 , H01L2924/00014 , H01L2924/00
摘要: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means. A method for applying metal particles such as solder metal in a pattern to an electronic device substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means.
摘要翻译: 通过电动或静电方式直接或通过使用中间工具将图案中的颗粒施加到基底上的方法。 通过电动或静电方式直接地或通过使用中间工具将诸如焊料金属的金属颗粒以图案施加到电子器件基板的方法。
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公开(公告)号:US07585549B2
公开(公告)日:2009-09-08
申请号:US10888286
申请日:2004-07-09
申请人: Brian G. Lewis , Bawa Singh , Robert H. Detig , Gerard R. Minogue , Dietmar C. Eberlein , Kenneth Reilly , Michael Marczi
发明人: Brian G. Lewis , Bawa Singh , Robert H. Detig , Gerard R. Minogue , Dietmar C. Eberlein , Kenneth Reilly , Michael Marczi
IPC分类号: B05D3/14
CPC分类号: H05K3/3484 , B23K3/0607 , H01L21/288 , H01L21/2885 , H01L21/4853 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2224/03622 , H01L2224/03912 , H01L2224/0401 , H01L2224/05023 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/11005 , H01L2224/11332 , H01L2224/11334 , H01L2224/114 , H01L2224/11442 , H01L2224/116 , H01L2224/11849 , H01L2224/131 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01049 , H01L2924/01056 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04953 , H01L2924/09701 , H01L2924/12042 , H05K3/3478 , H05K2203/0338 , H05K2203/041 , H05K2203/0425 , H05K2203/0776 , H05K2203/09 , H05K2203/105 , H01L2224/13099 , H01L2924/00014 , H01L2924/00
摘要: A method for applying particles in a pattern to a substrate, either directly or by use of an intermediate tool, by electrokinetic or electrostatic means by exposing the substrate to particles in a fluid medium to electrokinetically or electrostatically deposit the particles onto the substrate.
摘要翻译: 通过将基质暴露于流体介质中的颗粒以电动或静电将颗粒沉积到基底上,通过电动或静电方式直接或通过使用中间工具将图案颗粒施加到基底上的方法。
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