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1.发明申请Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device 有权用于半导体器件的封装衬底，其制造方法和半导体器件公开(公告)号：US20060044735A1
公开(公告)日：2006-03-02
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
IPC分类号： H05K1/00
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。
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2.发明授权Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns 有权用于具有热塑性树脂层和导电图案的半导体器件的封装衬底公开(公告)号：US07378745B2
公开(公告)日：2008-05-27
申请号：US11213867
申请日：2005-08-30
申请人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
发明人： Akimori Hayashi , Katsunobu Suzuki , Ryuichi Oikawa , Makoto Nakagoshi , Naoko Sera , Tadashi Murai , Chiho Ogihara , Ryohei Kataoka , Koji Kondo , Tomohiro Yokochi
CPC分类号： H05K3/4632 , H01L23/49816 , H01L23/49827 , H01L2224/16 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/15311 , H01L2924/3011 , H01L2924/3025 , H05K1/0271 , H05K1/114 , H05K3/4617 , H05K2201/0129 , H05K2201/0394 , H05K2201/068 , H05K2201/09063 , H05K2201/096 , H05K2201/09781 , H05K2201/2009 , H05K2203/1178 , H01L2924/00 , H01L2224/0401
摘要： A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.
摘要翻译： 具有形成在表面上的导电图案的多个膜绝缘体和在厚度方向上穿过膜绝缘体的导电通孔堆叠在一起并且集体地经受压力和热量以形成为单个单元。 在如此形成的多层板的一个最外层上，多个连接端子暴露于外部，LSI芯片的连接凸块固定在这些连接端子上。 在相对侧的最外层，设置多个金属焊盘，并且在每个金属焊盘上固定焊球以形成用于连接到主板的球栅阵列（BGA）结构。
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公开(公告)号：US07323238B2
公开(公告)日：2008-01-29
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
IPC分类号： B32B3/00
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译： 在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大 比土地和热塑性树脂构件之间的距离大。 在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。 由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。 因此，可以有效地提高土地的识别率。
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公开(公告)号：US20060068180A1
公开(公告)日：2006-03-30
申请号：US11232078
申请日：2005-09-22
申请人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
发明人： Koji Kondo , Ryohei Kataoka , Tomohiro Yokochi , Makoto Nakagoshi , Tadashi Murai , Akimori Hayashi , Katsunobu Suzuki
CPC分类号： H05K3/4688 , H05K1/0269 , H05K1/0373 , H05K1/111 , H05K3/28 , H05K3/285 , H05K3/4614 , H05K3/4617 , H05K3/4632 , H05K2201/0112 , H05K2201/0129 , H05K2203/161 , Y10T428/24917
摘要： In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.
摘要翻译： 在具有焊盘作为电极的印刷电路板中，在热塑性树脂部件的焊盘形成面上配置有色热塑性树脂膜，以将焊盘和着色热塑性树脂膜之间的光反射率设定为较大 比土地和热塑性树脂构件之间的距离大。 在有色热塑性树脂膜中设置有开口部，使得至少一部分接地部从开口部露出。 由于着色热塑性树脂膜位于开口部分的圆周部分上，因此可以有效地增加焊盘相对于其周边部分的光反射率差异。 因此，可以有效地提高土地的识别率。
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5.发明授权公开(公告)号：US07165321B2
公开(公告)日：2007-01-23
申请号：US10701441
申请日：2003-11-06
IPC分类号： H05K3/30
CPC分类号： H05K1/186 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H05K1/056 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0394 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49147 , Y10T29/49165 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2224/05624
摘要： A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
摘要翻译： 具有嵌入式电气装置的印刷电路板的制造方法如下。 具有开口部的第一树脂膜或具有凹部的片状部件与多个第二树脂膜一起堆积，形成有多个导电层。 第一和第二树脂膜和片状构件包括热塑性树脂。 电气装置插入开口或凹槽中。 然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。 当堆叠体被按压和加热时，电气装置的电极与导电层电连接，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。
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6.发明授权Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device 有权具有嵌入式电气装置的印刷电路板及具有嵌入式电气装置的印刷电路板的制造方法公开(公告)号：US06680441B2
公开(公告)日：2004-01-20
申请号：US10166731
申请日：2002-06-12
IPC分类号： H05K116
CPC分类号： H05K1/186 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/48091 , H01L2224/48472 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H05K1/056 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0394 , H05K2201/10636 , H05K2203/063 , Y02P70/611 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/49147 , Y10T29/49165 , Y10T428/24917 , H01L2924/00014 , H01L2924/00 , H01L2224/05624
摘要： A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.
摘要翻译： 具有嵌入式电气装置的印刷电路板如下制造。 具有开口的第一树脂膜或具有凹部的片状构件与多个第二树脂膜一起堆叠，其上形成有多个导电层。 第一和第二树脂膜和片状构件包括热塑性树脂。 电气装置插入开口或凹槽中。 然后，将包括电气装置的堆叠体按压并加热以使堆叠体整合。 当堆叠体被按压和加热时，电气装置的多个电极电连接到导电层，同时第一和第二树脂膜和片构件塑性变形以密封电子装置。
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公开(公告)号：US06667443B2
公开(公告)日：2003-12-23
申请号：US10007703
申请日：2001-12-10
申请人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
发明人： Koji Kondo , Tetsuaki Kamiya , Toshikazu Harada , Ryuichi Onoda , Yasutaka Kamiya , Gentaro Masuda , Yoshitaro Yazaki , Tomohiro Yokochi
IPC分类号： H05K100
CPC分类号： H05K3/4638 , H05K3/0035 , H05K3/281 , H05K3/4069 , H05K3/4617 , H05K3/4632 , H05K2201/0129 , H05K2201/0355 , H05K2201/0394 , H05K2201/09245 , H05K2201/096 , H05K2201/09854 , H05K2203/063 , H05K2203/065 , H05K2203/1476 , H05K2203/1572 , Y10T156/1064
摘要： Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.
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公开(公告)号：US06972070B2
公开(公告)日：2005-12-06
申请号：US10643919
申请日：2003-08-20
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T428/24917
摘要： A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
摘要翻译： 通过用层间导电材料填充形成在布线板的绝缘膜层上的孔，制成加压印刷线路板。 绝缘膜与导体图案堆叠，并且每个导体图案封闭通孔。 夹层导电材料在加压压制程序后在通孔中形成固体导电材料。 固体导电材料包括两种类型的导电材料。 第一类导电材料包括金属，第二类导电材料包括由导体图案的金属和导体金属形成的合金。 导体图形可靠地电连接，而不依赖于机械接触。
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公开(公告)号：US07188412B2
公开(公告)日：2007-03-13
申请号：US10662368
申请日：2003-09-16
IPC分类号： H01K3/10
CPC分类号： H05K3/4632 , H05K1/095 , H05K3/4069 , H05K3/4617 , H05K2201/0129 , H05K2201/0272 , H05K2201/0305 , H05K2201/0355 , H05K2201/0394 , H05K2201/09827 , H05K2201/09863 , H05K2203/0425 , H05K2203/1131 , Y10T29/49126 , Y10T29/49144 , Y10T29/49165 , Y10T428/24917
摘要： Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.
摘要翻译： 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。
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公开(公告)号：US07036214B2
公开(公告)日：2006-05-02
申请号：US10383227
申请日：2003-03-07
IPC分类号： H05K3/36
CPC分类号： H05K3/4691 , H05K1/118 , H05K3/4069 , H05K3/4614 , H05K3/4632 , H05K2201/0129 , H05K2201/0909 , H05K2201/09109 , Y10T29/49117 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.
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