公开(公告)号：US07646581B2

公开(公告)日：2010-01-12

申请号：US11668568

申请日：2007-01-30

申请人： Yasuharu Sasaki ,  Takehiro Ueda ,  Yusuke Nakagawa ,  Nobuyuki Nagayama ,  Taketoshi Okajo ,  Mamoru Kosakai

发明人： Yasuharu Sasaki ,  Takehiro Ueda ,  Yusuke Nakagawa ,  Nobuyuki Nagayama ,  Taketoshi Okajo ,  Mamoru Kosakai

IPC分类号： H01L21/683

CPC分类号： H01L21/6831 ,  C23C14/505 ,  C23C16/4581 ,  C23C16/4586 ,  H01L21/6875

摘要： An electrostatic chuck capable of widening a temperature range and reducing a variation in thermal conductivity between the electrostatic chuck and the flat substrate over time is provided. The chuck includes: a body that has an internal electrode for attracting a flat substrate by an electrostatic force provided therein, a plurality of protrusions formed on one surface of the body serving as an electrostatic attraction surface, and projections provided on the top surfaces of some or all of the plurality of protrusions. In the electrostatic chuck, a region of the top surface of each of the minute projections on which the flat substrate is loaded is referred to as a mounting surface, and the total area of the mounting surfaces of the minute projections is equal to or larger than 0.01% and equal to or smaller than 2% of the area of the electrostatic attraction surface.

摘要翻译： 提供了能够随时间扩大温度范围并减少静电卡盘与平板之间的导热性变化的静电卡盘。 卡盘包括：具有用于通过设置在其中的静电力吸引平坦基板的内部电极的主体，形成在作为静电吸引表面的主体的一个表面上的多个突起，以及设置在一些 或所有多个突起。 在静电卡盘中，将安装有平坦基板的每个微小突起的上表面的区域称为安装面，微小突起的安装面的总面积等于或大于 0.01％且等于或小于静电吸引表面积的2％。

公开(公告)号：US06991703B2

公开(公告)日：2006-01-31

申请号：US10668483

申请日：2003-09-22

申请人： Takeshi Ootsuka ,  Mamoru Kosakai

发明人： Takeshi Ootsuka ,  Mamoru Kosakai

IPC分类号： H01L21/60

CPC分类号： H01L24/81 ,  H01L24/75 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13111 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75724 ,  H01L2224/75725 ,  H01L2224/75984 ,  H01L2224/75985 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/14 ,  Y10T29/53178 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05644

摘要： A bonding method is provided in which an electronic component is connected via bumps to a substrate and the electronic component is packaged on the substrate. A surface of the substrate that packages the electronic component, a surface of the electronic component that is connected to the substrate, and a surface of the bumps undergo plasma processing. Subsequently, the bumps are heated to a temperature lower than a melting point of the bumps, and the substrate and the electronic component are compression bonded via the bumps.

摘要翻译： 提供了一种接合方法，其中电子部件通过凸块连接到基板，电子部件被封装在基板上。 封装电子部件的基板的表面，与基板连接的电子部件的表面和凸部的表面进行等离子体处理。 随后，将凸块加热到低于凸块的熔点的温度，并且基板和电子部件经由凸块压接。

公开(公告)号：US06872908B2

公开(公告)日：2005-03-29

申请号：US10270886

申请日：2002-10-11

申请人： Takeshi Ootsuka ,  Kazunori Endou ,  Mamoru Kosakai

发明人： Takeshi Ootsuka ,  Kazunori Endou ,  Mamoru Kosakai

IPC分类号： C04B35/581 ,  C04B35/645 ,  C23C16/458 ,  H01J37/32 ,  H01L21/02 ,  H01L21/68 ,  H01L21/683 ,  B23K9/00

CPC分类号： C04B35/581 ,  B32B18/00 ,  B32B2315/02 ,  C04B35/6264 ,  C04B35/645 ,  C04B37/025 ,  C04B2235/3206 ,  C04B2235/3225 ,  C04B2235/3826 ,  C04B2235/3865 ,  C04B2235/404 ,  C04B2235/5445 ,  C04B2235/6581 ,  C04B2235/77 ,  C04B2235/80 ,  C04B2235/94 ,  C04B2235/963 ,  C04B2237/08 ,  C04B2237/403 ,  C04B2237/62 ,  C23C16/4581 ,  C23C16/4586 ,  H01J37/32009 ,  H01J37/32559

摘要： There is provided a susceptor with a built-in electrode and a manufacturing method therefor, in which there is no danger of corrosive gas or plasma or the like penetrating to the inside of the substrate, which has excellent corrosion resistance and plasma resistance, in which nonconductivity under high temperatures is improved, and in which leakage current does not occur. A susceptor with a built-in electrode 21 according to the present invention comprises: a mounting plate 22 and a support plate 23 which are formed from aluminum nitride based sintered bodies; an internal electrode 24 formed from either an aluminum nitride and tungsten composite sintered body or an aluminum nitride and molybdenum composite sintered body, which is formed between the mounting plate 22 and the support plate 23; and power supply terminals 26 which are provided in the support plate 23 and are electrically connected to the internal electrode 24, and both surfaces of the internal electrode 24 are coated with a nonconductive material 30 comprising AlN particles.

摘要翻译： 提供一种具有内置电极的基座及其制造方法，其中不存在腐蚀性气体或等离子体等侵入基板内部的危险，其具有优异的耐腐蚀性和等离子体电阻，其中 在高温下的非导电性提高，并且不会发生漏电流。 根据本发明的具有内置电极21的感受体包括：由氮化铝基烧结体形成的安装板22和支撑板23; 由安装板22和支撑板23之间形成的由氮化铝和钨复合烧结体形成的内部电极24或氮化铝和钼复合烧结体; 以及设置在支撑板23中并与内部电极24电连接的电源端子26，并且内部电极24的两个表面均涂覆有包含AlN颗粒的非导电材料30。

公开(公告)号：US08981263B2

公开(公告)日：2015-03-17

申请号：US13513380

申请日：2010-12-08

申请人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

发明人： Yasuharu Sasaki ,  Kenji Masuzawa ,  Toshiyuki Makabe ,  Mamoru Kosakai ,  Takashi Satou ,  Kazunori Ishimura ,  Ryuuji Hayahara ,  Hitoshi Kouno

IPC分类号： H05B3/68 ,  C23C16/00 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L21/6831 ,  H01J37/32642 ,  H01J2237/332 ,  H01J2237/338 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67248

摘要： Disclosed is an electrostatic chuck apparatus which is configured of: an electrostatic chuck section; an annular focus ring section provided to surround the electrostatic chuck section; and a cooling base section which cools the electrostatic chuck section and the focus ring section. The focus ring section is provided with an annular focus ring, an annular heat conducting sheet, an annular ceramic ring, a nonmagnetic heater, and an electrode section that supplies power to the heater.

摘要翻译： 公开了一种静电卡盘装置，其包括：静电卡盘部; 设置成围绕静电吸盘部分的环形聚焦环部分; 以及冷却静电吸盘部和聚焦环部的冷却基部。 聚焦环部分设置有环形聚焦环，环形导热片，环形陶瓷环，非磁性加热器和向加热器供电的电极部分。

公开(公告)号：US20140204975A1

公开(公告)日：2014-07-24

申请号：US14239352

申请日：2012-08-22

申请人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takeshi Watanabe ,  Hitoshi Kouno ,  Ryuuji Hayahara

发明人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takeshi Watanabe ,  Hitoshi Kouno ,  Ryuuji Hayahara

IPC分类号： G01K13/00 ,  H01L21/66

CPC分类号： G01K13/00 ,  H01L21/67248 ,  H01L21/6833 ,  H01L22/12 ,  H01L2924/0002 ,  H05B1/0233 ,  H05B3/265 ,  H05B2203/002 ,  H01L2924/00

摘要： There are provided a plate-shaped body for temperature measurement which, simply by being mounted on a mounting surface of an electrostatic chuck apparatus and without using a semiconductor wafer itself which is a product, is able to easily optimize the in-plane temperature distribution of the mounting surface of the electrostatic chuck apparatus, the temperature rising characteristics, and the cooling characteristics during decreases in temperature, and a temperature measuring apparatus provided with the same. In such a wafer for temperature measurement (plate-shaped body for temperature measurement) (1), an insulating adhesive (3) is bonded to the entirety of a surface (2a) of a wafer (2), a heater element (4) is provided on the insulating adhesive (3), a temperature measurement region (5) is provided used to measure the temperature of the surface (2a) of the wafer (2) in a region excluding the heater element (4) on the surface (3a) of the insulating adhesive (3), and the heater element (4) and the temperature measurement region (5) are coated with an insulating film (6).

摘要翻译： 提供了一种用于温度测量的板状体，其简单地通过安装在静电卡盘装置的安装表面上而不使用作为产品的半导体晶片本身，能够容易地优化面内温度分布 静电吸盘装置的安装面，升温特性以及降温时的冷却特性，以及设置有该温度的温度测定装置。 在这种用于温度测量的晶片（温度测量用板状体）（1））中，绝缘性粘合剂（3）与晶片（2）的表面（2a）的整体，加热元件（4） 设置在绝缘粘合剂（3）上，设置用于测量在表面上的除了加热器元件（4）之外的区域中的晶片（2）的表面（2a）的温度的温度测量区域（5） 绝缘胶（3）的表面（3a），以及加热元件（4）和温度测量区域（5）都涂覆有绝缘膜（6）。

公开(公告)号：US20120299253A1

公开(公告)日：2012-11-29

申请号：US13575545

申请日：2011-01-28

申请人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takashi Satou ,  Ryuuji Hayahara ,  Takeshi Watanabe ,  Yoshiaki Moriya ,  Kei Furuuchi

发明人： Mamoru Kosakai ,  Kazunori Ishimura ,  Takashi Satou ,  Ryuuji Hayahara ,  Takeshi Watanabe ,  Yoshiaki Moriya ,  Kei Furuuchi

IPC分类号： H01L21/683

CPC分类号： H01L21/6831 ,  H01L21/67103 ,  Y10T279/23

摘要： The present invention provides an electrostatic chuck apparatus including: an electrostatic chuck section having one main surface that is a mounting surface on which a plate specimen is mounted, and being equipped with an electrostatic adsorbing internal electrode; and a temperature adjusting base section that adjusts the electrostatic chuck section to a desired temperature, wherein a heating member is bonded to a main surface of the electrostatic chuck section, which is opposite to the mounting surface, via an adhesive material, the whole or a part of the main surface of the temperature adjusting base section, which is on the side of the electrostatic chuck section, is covered with a sheet-like or film-like insulating material, and the electrostatic chuck section bonded with the heating member and the temperature adjusting base section covered with the sheet-like or the film-like insulating material are bonded and integrated via an insulating organic adhesive layer formed by curing a liquid adhesive.

摘要翻译： 本发明提供一种静电卡盘装置，其特征在于，包括：静电吸盘部，具有作为安装有试样的安装面的一个主面，并具有静电吸附内部电极; 以及温度调节基部，其将静电吸盘部调节到期望的温度，其中，加热部件经由粘合剂材料，整体或一个或多个部分结合到与安装表面相对的静电卡盘部分的主表面上 位于静电卡盘部分一侧的温度调节基部的主表面的一部分被片状或薄膜状绝缘材料覆盖，并且与加热构件接合的静电卡盘部分和温度 由片状或薄膜状绝缘材料覆盖的调整基座部分通过固化液体粘合剂形成的绝缘有机粘合剂层而结合并整合。

公开(公告)号：US20100002354A1

公开(公告)日：2010-01-07

申请号：US12310094

申请日：2007-08-01

申请人： Hiroshi Inazumachi ,  Mamoru Kosakai ,  Miura Yukio ,  Keigo Maki

发明人： Hiroshi Inazumachi ,  Mamoru Kosakai ,  Miura Yukio ,  Keigo Maki

IPC分类号： H01L21/683

CPC分类号： H01L21/6833 ,  H02N13/00 ,  Y10T279/23

摘要： An electrostatic chuck device which enables to perform a plasma process having high in-plane uniformity to a plane-like sample by improving the in-plane uniformity of the electric field intensity in a plasma when applied to a plasma processing apparatus. Specifically disclosed is an electrostatic chuck device (21) including an electrostatic chuck section (22), a metal base section (23) serving as a high-frequency generating electrode, and an insulating plate (24). The electrostatic chuck section (22) is composed of a dielectric plate (31) whose top surface (31a) serves as a mounting surface on which a plate-like sample (W) is placed, a supporting plate (32), an electrostatic-adsorption inner electrode (25), and an insulating layer (33). The electrostatic-adsorption inner electrode (25) is made of a composite sintered body containing an insulating ceramic and silicon carbide, while having a volumetric resistance of not less than 1.0×10−1 Ωcm but not more than 1.0×108 Ωcm.

摘要翻译： 一种静电吸盘装置，其能够通过提高施加到等离子体处理装置时等离子体中的电场强度的面内均匀性，而对平面状样品进行具有高面内均匀性的等离子体处理。 具体公开了一种静电卡盘装置（21），包括静电卡盘部（22），作为高频发生电极的金属基部（23）和绝缘板（24）。 静电吸盘部（22）由电极板（31）构成，电介质板（31）的顶面（31a）作为其上放置有板状样品（W）的安装面，支撑板（32） 吸附内电极（25）和绝缘层（33）。 静电吸附内部电极（25）由含有绝缘陶瓷和碳化硅的复合烧结体构成，体积电阻为1.0×10 -1Ω〜1.0×10 8Ω·cm以上。

公开(公告)号：USD587222S1

公开(公告)日：2009-02-24

申请号：US29276663

申请日：2007-02-01

申请人： Yasuharu Sasaki ,  Mamoru Kosakai

设计人： Yasuharu Sasaki ,  Mamoru Kosakai

公开(公告)号：US20080062610A1

公开(公告)日：2008-03-13

申请号：US11835560

申请日：2007-08-08

申请人： Shinji HIMORI ,  Shoichiro MATSUYAMA ,  Atsushi MATSUURA ,  Hiroshi INAZUMACHI ,  Mamoru KOSAKAI ,  Yukio MIURA ,  Keigo MAKI

发明人： Shinji HIMORI ,  Shoichiro MATSUYAMA ,  Atsushi MATSUURA ,  Hiroshi INAZUMACHI ,  Mamoru KOSAKAI ,  Yukio MIURA ,  Keigo MAKI

IPC分类号： H01L21/683

CPC分类号： H01L21/6833

摘要： An electrostatic chuck device includes: an electrostatic chuck section including a substrate, which has a main surface serving as a mounting surface on which a plate-like sample is mounted and an electrostatic-adsorption inner electrode built therein, and a power supply terminal for applying a DC voltage to the electrostatic-adsorption inner electrode; and a metal base section that is fixed to the other main surface of the electrostatic chuck section so as to be incorporated into a body and that serves as a high frequency generating electrode. Here, the volume resistivity of the electrostatic-adsorption inner electrode is in the range of 1.0×10−1Ωcm to 1.0×108 Ωcm.

摘要翻译： 静电吸盘装置包括：静电吸盘部，其具有基板，其具有作为安装有板状试样的安装面的主面和内置有静电吸附内部电极的基板，以及用于施加电力的端子 到静电吸附内部电极的DC电压; 以及固定在静电卡盘部的另一个主面上的金属基部，以结合到主体中并作为高频发生电极。 这里，静电吸附内部电极的体积电阻率在1.0×10 -1Ω〜1.0×10 8Ωm的范围内。

公开(公告)号：US06730276B2

公开(公告)日：2004-05-04

申请号：US09909075

申请日：2001-07-18

申请人： Mamoru Kosakai ,  Kazunori Ishimura ,  Teruyasu Fujita

发明人： Mamoru Kosakai ,  Kazunori Ishimura ,  Teruyasu Fujita

IPC分类号： B01J1908

CPC分类号： B29C59/106 ,  B29K2105/256 ,  H02N13/00

摘要： The plastic film electrostatic adsorption apparatus of the present invention comprises an electrostatic adsorption electrode, an insulated dielectric layer that covers the electrostatic adsorption electrode and has a center line average roughness of an adsorption surface on which a plastic film is placed of 0.5 micrometers or less, and a power supply electrode that applies a voltage to the electrostatic adsorption electrode. According to this plastic film electrostatic adsorption apparatus, surface treatment can be performed even in a vacuum without requiring tedious work such as application or removal of adhesive. In addition, even if the plastic film expands and deforms due to heat treatment and plasma treatment performed during surface treatment, there is no occurrence of wrinkling, deformation or separation in the plastic film due to the difference in thermal expansion between the electrostatic adsorption surface and plastic film.

摘要翻译： 本发明的塑料膜静电吸附装置包括静电吸附电极，覆盖静电吸附电极的绝缘电介质层，其中放置塑料膜的吸附面的中心线平均粗糙度为0.5微米以下， 以及向静电吸附电极施加电压的电源电极。 根据该塑料膜静电吸附装置，即使在真空中也可以进行表面处理，而不需要繁琐的工作，例如施加或去除粘合剂。 此外，即使由于表面处理中进行的热处理和等离子体处理而导致的塑料膜膨胀变形，也不会由于静电吸附面和静电吸附面之间的热膨胀差异而导致塑料膜起皱，变形或分离 塑料薄膜。