-
公开(公告)号:US08410350B2
公开(公告)日:2013-04-02
申请号:US11788456
申请日:2007-04-19
IPC分类号: H02N6/00 , H01L31/042
CPC分类号: H01L31/052 , B29C45/14639 , B29C45/1671 , H01M14/005 , H02S20/23 , H02S20/25 , H02S40/36 , H02S40/42 , Y02B10/12 , Y02B10/20 , Y02E10/50 , Y10T29/49112 , Y10T29/49114
摘要: A photovoltaic module with photovoltaic cell and a heat sink. The heat sink is attached on a side of the cell opposite to the light-receiving side of the photovoltaic cell. The heat sink can remove heat caused by light absorbed by the photovoltaic cell but not converted to electricity as well as heat generated by resistance to high current passing through electrodes of the photovoltaic cell. A photovoltaic module formed of such cells can exhibit greater energy conversion efficiency as a result of the ability to dissipate the heat. A method of making a solar module involves e.g. laminating a heat sink to a photovoltaic cell.
摘要翻译: 具有光伏电池和散热器的光伏组件。 散热器安装在电池的与光伏电池的光接收侧相对的一侧。 散热器可以去除由光伏电池吸收的光引起的热量,但不会转换成电,以及由通过光伏电池的电极的高电流的电阻产生的热量。 由这种电池形成的光伏模块可以由于散热的能力而显示出更大的能量转换效率。 一种制造太阳能模块的方法包括: 将散热器层压到光伏电池。
-
公开(公告)号:US20070208378A1
公开(公告)日:2007-09-06
申请号:US11747304
申请日:2007-05-11
申请人: Peter Bonutti , Mark Brillhart
发明人: Peter Bonutti , Mark Brillhart
IPC分类号: A61B17/04
CPC分类号: A61B17/0401 , A61B17/68 , A61B17/80 , A61B17/866 , A61B2017/00004 , A61B2017/0408 , A61B2017/0454 , A61B2017/0458 , A61B2017/0464 , A61B2017/0619 , A61B2017/867 , A61F2/30734 , A61F2/367 , A61F2/38 , A61F2002/30062 , A61F2002/30065 , A61F2002/30736 , A61F2210/0004 , A61F2210/0071 , B29C65/602 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/73791 , B29C66/8322 , Y10S606/908 , Y10S606/91 , B29K2277/00 , B29K2277/10 , B29K2307/04 , B29K2305/12 , B29K2023/04 , B29K2305/00 , B29K2077/10 , B29K2077/00 , B29K2023/06
摘要: Surgical devices such as implants or suture fastenings are assembled from a plurality of discrete components, one of which components includes a heat bondable plastic material for bonding the components together. At least two components are bonded to each other by the applying heat to the heat bondable plastic material of one component. The heat bondable plastic material is preferably a polymeric or composite material suitable for surgical applications and implantation in humans, and may be a biodegradable material. A laser may be used as the heat source. The present invention is advantageously embodied in heat bonded fastenings for sutures or K-wires, in which a variety of different suture anchors are usable, including expandable distal suture anchors. Other embodiments include a metal bone plate which is held to bone by a metal bone screw and a nut of bondable material bonded to the plate to secure the connection; a piece of bondable material bonded to a metal prosthesis to custom fit the prosthesis; and a surgical implant custom formed by bonding together a plurality of discrete elements one or more of which is bondable.
摘要翻译: 诸如植入物或缝合线紧固件之类的手术装置由多个分立组件组装,其中一个部件包括用于将部件粘合在一起的可热粘合塑料材料。 至少两个组分通过向一个组分的可热粘合的塑料材料施加热量而彼此结合。 可热粘合的塑料材料优选是适合于人类手术应用和植入的聚合物或复合材料,并且可以是可生物降解的材料。 可以使用激光作为热源。 本发明有利地体现在用于缝线或K线的热粘合紧固件中,其中可使用各种不同的缝合锚,包括可扩展的远端缝合锚。 其他实施例包括通过金属骨螺钉固定在骨头上的金属骨板和结合到板上的可结合材料的螺母以固定连接件; 结合到金属假体的一块可粘合材料以定制地适合假体; 以及通过将多个离散元件结合在一起而形成的手术植入物,其中一个或多个是可结合的。
-
公开(公告)号:US06475830B1
公开(公告)日:2002-11-05
申请号:US09618975
申请日:2000-07-19
申请人: Mark Brillhart
发明人: Mark Brillhart
IPC分类号: H01L2144
CPC分类号: H01L22/20 , H01L21/563 , H01L24/81 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/73204 , H01L2224/73253 , H01L2224/81801 , H01L2224/83102 , H01L2224/92125 , H01L2924/00014 , H01L2924/014 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15174 , H01L2924/15311 , H01L2924/16195 , H05K1/181 , H05K3/225 , H05K3/341 , H05K2201/10159 , H05K2201/10674 , H05K2201/10689 , H05K2201/10734 , H05K2203/1476 , H05K2203/176 , Y02P70/611 , H01L2924/00 , H01L2224/0401
摘要: A multi-chip, module (MCM) having one or more high value chips such as ASICs, CPUs, DSPs or the like attached to the MCM substrate via a direct attach technology (such as flip chip) and one or more memory chips attached to the MCM substrate via a reworkable technology such as connector and receptacle-based package, wirebond package, chip scale package (CSP), leaded package, ball grid array package, or fine pitch ball grid array package. The MCM substrate may, in turn, be attached to a motherboard via solder balls (ball grid array); leads and/or connector interconnect technologies (such as compression sockets).
摘要翻译: 具有通过直接连接技术(例如倒装芯片)连接到MCM基板的一个或多个高价值芯片(例如ASIC,CPU,DSP等)的多芯片模块(MCM)和连接到MCM基板的一个或多个存储芯片 MCM基板通过可重复工艺技术,例如连接器和基于插座的封装,引线封装,芯片级封装(CSP),引线封装,球栅阵列封装或细间距球栅阵列封装。 MCM衬底又可以通过焊球(球栅阵列)连接到母板上; 引线和/或连接器互连技术(如压缩插座)。
-
-