摘要:
A semiconductor device includes a plurality of memory cell blocks, each including a plurality of memory cells each storing a predetermined amount of data. Each of the memory cell blocks stores, in the memory cells thereof, truth table data used for outputting desired logical values in response to input of a given address so as to function as a logic circuit. The number of inputs and the number of outputs of the memory cell block is three or more, and the memory cell blocks are connected to each other so that three or more outputs from one memory cell block are input to three or more other memory cell blocks.
摘要:
A semiconductor device comprises multiple memory cell blocks including multiple memory cells for storing a predetermined amount of data. Each of the memory cell blocks having three or more inputs and three or more outputs includes two readout address decoders as to the memory cells internally, stores truth table data for outputting a desired logical value as to predetermined address input, and is configured so as to operate as a logic circuit. Also, the memory cells include two readout word lines corresponding to the two readout address decoders, and in the case of the voltage of both of the two readout word lines being applied, the data held at this time is read out from readout data lines. Further, between the memory cell blocks is connected such that the three or more outputs from one memory cell block are input to three or more other memory cell blocks.
摘要:
A semiconductor device 110 has a plurality of memory cell blocks provided with a plurality of memory cells storing a predetermined amount of data. Each memory cell block has four or more inputs and outputs, and is internally provided with a read address decoder to the memory cell and a sense amplifier for amplifying a voltage in outputting outside. Each memory cell block is structured so as to store a truth table data for outputting a desired logic value in response to a specified address input, thereby operating as a logic circuit. The memory cell has a read word line correspondingly to the read address decoder. In the case when a voltage is applied to the read word line, the data that is held at that time is read from a read data line. The memory cell blocks are connected to each other such that the four or more outputs from one memory cell block are inputted to other four or more memory cell blocks through the sense amplifier.
摘要:
A semiconductor device 110 has a plurality of memory cell blocks provided with a plurality of memory cells storing a predetermined amount of data. Each memory cell block has four or more inputs and outputs, and is internally provided with a read address decoder to the memory cell and a sense amplifier for amplifying a voltage in outputting outside. Each memory cell block is structured so as to store a truth table data for outputting a desired logic value in response to a specified address input, thereby operating as a logic circuit. The memory cell has a read word line correspondingly to the read address decoder. In the case when a voltage is applied to the read word line, the data that is held at that time is read from a read data line. The memory cell blocks are connected to each other such that the four or more outputs from one memory cell block are inputted to other four or more memory cell blocks through the sense amplifier.
摘要:
This invention relates to a system in package including a plurality of integrated circuit chips and a substrate on which the plurality of integrated circuit chips are mounted and characterized in that a testability circuit for facilitating a test on at least one of the integrated circuit chips is incorporated into the substrate. The testability circuit incorporated into the substrate is formed by embedding a so-called WLCSP integrated circuit chip into the substrate. Alternatively, the testability circuit is formed by using a transistor element formed by using a semiconductor layer formed on the substrate. By incorporating the testability circuit into the substrate as described above, it is possible to realize a system in package facilitated in test without increases in size and cost.
摘要:
A method for selectively forming an electric conductor, the method including disposing a processing target and a metal compound in an atmosphere including a supercritical fluid, the processing target having formed thereon at least one recess for providing an electric conductor, the metal compound including a metal serving as a main component of the electric conductor, and dissolving at least part of the metal compound in the supercritical fluid, selectively introducing the metal compound dissolved in the supercritical fluid into the recess in contact with a surface of the processing target, and coagulating in the recess the metal compound introduced into the recess to precipitate the metal from the metal compound, and coagulating the metal precipitated in the recess, thereby providing the electric conductor in the recess.
摘要:
A conductor forming apparatus includes a reaction container having housed therein a processing target on a surface of which a recess in which a conductor is to be provided is formed, and a process for providing the conductor in the recess being carried out inside the container after a supercritical fluid dissolved with a metal compound is supplied into the container, a supply device which supplies the fluid from an outside to the inside of the container, and a discharge device which discharges the fluid that is not submitted for the process from the inside to the outside of the container, wherein while an amount of the fluid in the container is adjusted by continuously supplying the fluid into the container by the supply device and continuously discharging the fluid that is not submitted for the process to the outside of the container by the discharge device.
摘要:
In a resin-sealed semiconductor device, an inner lead including a bend portion formed by lifting has a protruding shape located on one side and an inclined vertical surface shape located on the other side (inside) in an external connection terminal direction. A cutaway portion is provided along the bend portion and an external connection terminal. A height of an upper surface portion of the inner lead is higher than a height of an upper surface of a semiconductor element. The inner lead is provided in a substantially central portion of a die pad so that the inclined vertical surface shape is parallel to a side of a die pad which includes a thin portion located in a side surface portion and an exposure portion located on a bottom surface.
摘要:
A conductor forming apparatus includes a reaction container having housed therein a processing target on a surface of which a recess in which a conductor is to be provided is formed, and a process for providing the conductor in the recess being carried out inside the container after a supercritical fluid dissolved with a metal compound is supplied into the container, a supply device which supplies the fluid from an outside to the inside of the container, and a discharge device which discharges the fluid that is not submitted for the process from the inside to the outside of the container, wherein while an amount of the fluid in the container is adjusted by continuously supplying the fluid into the container by the supply device and continuously discharging the fluid that is not submitted for the process to the outside of the container by the discharge device.
摘要:
A semiconductor device comprises multiple memory cell blocks including multiple memory cells for storing a predetermined amount of data. Each of the memory cell blocks having three or more inputs and three or more outputs includes two readout address decoders as to the memory cells internally, stores truth table data for outputting a desired logical value as to predetermined address input, and is configured so as to operate as a logic circuit. Also, the memory cells include two readout word lines corresponding to the two readout address decoders, and in the case of the voltage of both of the two readout word lines being applied, the data held at this time is read out from readout data lines. Further, between the memory cell blocks is connected such that the three or more outputs from one memory cell block are input to three or more other memory cell blocks.