公开(公告)号：US08227706B2

公开(公告)日：2012-07-24

申请号：US12347600

申请日：2008-12-31

申请人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

发明人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC分类号： H05K1/11

CPC分类号： H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

摘要： In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开并要求保护其他实施例。

公开(公告)号：US20140098506A1

公开(公告)日：2014-04-10

申请号：US14097932

申请日：2013-12-05

申请人： Debendra Mallik ,  Mihir Roy

发明人： Debendra Mallik ,  Mihir Roy

IPC分类号： H05K1/11

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K1/113 ,  H05K1/115

摘要： Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

摘要翻译： 实施例涉及具有减小尺寸的电镀通孔（PTH）焊盘的半导体封装，通过消除焊盘到PTH对准的边缘并且使得能够在衬底的芯上更细的迹线。

公开(公告)号：US20090321932A1

公开(公告)日：2009-12-31

申请号：US12217068

申请日：2008-06-30

申请人： Javier Soto Gonzalez ,  Tao Wu ,  Pallavi Alur ,  Mihir Roy ,  Sheng Li ,  Reynaldo Olmedo

发明人： Javier Soto Gonzalez ,  Tao Wu ,  Pallavi Alur ,  Mihir Roy ,  Sheng Li ,  Reynaldo Olmedo

IPC分类号： H01L23/48 ,  H01L21/4763 ,  H01L23/52 ,  H01L21/441 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/16 ,  H01L2221/68345 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01004 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/243 ,  H05K3/4682 ,  H05K2203/0376

摘要： A thin die Package Substrate is described that may be produced using existing chemistry. In one example, a package substrate is built over a support material. A dry film photoresist layer is formed over the package substrate. The support material is removed from the package substrate. The dry film photoresist layer is removed from the substrate and the substrate is finished for use with a package.

摘要翻译： 描述了可以使用现有化学品生产的薄模包装衬底。 在一个示例中，封装衬底被构建在支撑材料上。 在封装衬底上形成干膜光致抗蚀剂层。 支撑材料从封装衬底移除。 将干膜光致抗蚀剂层从基材上除去，并且底物被完成以用于包装。

公开(公告)号：US09210809B2

公开(公告)日：2015-12-08

申请号：US14097932

申请日：2013-12-05

申请人： Debendra Mallik ,  Mihir Roy

发明人： Debendra Mallik ,  Mihir Roy

IPC分类号： H01L23/52 ,  H01L23/48 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K1/113 ,  H05K1/115

摘要： Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

摘要翻译： 实施例涉及具有减小尺寸的电镀通孔（PTH）焊盘的半导体封装，通过消除焊盘到PTH对准的边缘并且使得能够在衬底的芯上更细的迹线。

公开(公告)号：US20130189812A1

公开(公告)日：2013-07-25

申请号：US13555938

申请日：2012-07-23

申请人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

发明人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC分类号： H01L21/768 ,  H01L21/50

CPC分类号： H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

摘要： In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. in this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed.

摘要翻译： 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开了其他实施例。

公开(公告)号：US20100163295A1

公开(公告)日：2010-07-01

申请号：US12347600

申请日：2008-12-31

申请人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

发明人： Mihir Roy ,  Mahadevan Suryakumar ,  Yonggang Li

IPC分类号： H05K1/11

CPC分类号： H01L21/76877 ,  H01L21/50 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0222 ,  H05K3/4046 ,  H05K3/42 ,  H05K3/4602 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/10265 ,  H05K2201/10287 ,  H01L2224/0401

摘要： In some embodiments, coaxial plated through holes (PTH) for robust electrical performance are presented. In this regard, an apparatus is introduced comprising an integrated circuit device and a substrate coupled with the integrated circuit device, wherein the substrate includes: a plated through hole, the plated through hole filled with dielectric material and a coaxial copper wire, and conductive traces to separately route the plated through hole and the coaxial copper wire. Other embodiments are also disclosed and claimed.

摘要翻译： 在一些实施例中，呈现用于鲁棒电性能的同轴电镀通孔（PTH）。 在这方面，引入了包括集成电路器件和与集成电路器件耦合的衬底的器件，其中衬底包括：电镀通孔，填充有介电材料的电镀通孔和同轴铜线，以及导电迹线 以分开布线电镀通孔和同轴铜线。 还公开并要求保护其他实施例。