公开(公告)号：US20180236164A1

公开(公告)日：2018-08-23

申请号：US15962725

申请日：2018-04-25

申请人： Ho Seok SONG ,  Min Kyo CHO ,  Jun Woo PARK ,  Hong Ho KIM

发明人： Ho Seok SONG ,  Min Kyo CHO ,  Jun Woo PARK ,  Hong Ho KIM

IPC分类号： A61M5/158 ,  A61B17/34

CPC分类号： A61M5/158 ,  A61B17/3403 ,  A61B34/70 ,  A61B46/10 ,  A61B90/11 ,  A61B2017/0092 ,  A61B2017/3409 ,  A61B2090/0813 ,  A61M2005/1585

摘要： Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

公开(公告)号：US09987039B2

公开(公告)日：2018-06-05

申请号：US14723036

申请日：2015-05-27

申请人： Ho Seok Song ,  Min Kyo Cho ,  Jun Woo Park ,  Hong Ho Kim

发明人： Ho Seok Song ,  Min Kyo Cho ,  Jun Woo Park ,  Hong Ho Kim

IPC分类号： A61B17/34 ,  A61B46/10 ,  A61B90/11 ,  A61M5/158 ,  A61B90/00

CPC分类号： A61B17/3403 ,  A61B46/10 ,  A61B90/11 ,  A61B2017/3405 ,  A61B2017/3409 ,  A61B2090/0813 ,  A61M5/158 ,  A61M2005/1585 ,  A61M2205/02

摘要： Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

公开(公告)号：US20100102445A1

公开(公告)日：2010-04-29

申请号：US12650610

申请日：2009-12-31

申请人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

发明人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14806 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/49171 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

摘要翻译： 在一个实施例中，小型化固态成像装置包括具有用于将半导体芯片安装在其中的空腔的主体。 主体具有向空腔延伸的伸出部分。 此外，引线设置在身体内。 引线的一端通过主体的顶表面暴露，而另一端通过主体的底表面暴露以与其电连接。

公开(公告)号：US20050174469A1

公开(公告)日：2005-08-11

申请号：US11053209

申请日：2005-02-07

申请人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

发明人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

IPC分类号： H01L27/14 ,  H01L23/00 ,  H01L23/02 ,  H01L23/04 ,  H01L23/12 ,  H01L23/50 ,  H01L27/146 ,  H01L27/148 ,  H01L31/0203 ,  H01L31/0232 ,  H04N5/225 ,  H04N5/335

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14806 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/49171 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

摘要翻译： 在一个实施例中，小型化固态成像装置包括具有用于将半导体芯片安装在其中的空腔的主体。 主体具有向空腔延伸的伸出部分。 此外，引线设置在身体内。 引线的一端通过主体的顶表面暴露，而另一端通过主体的底表面暴露以与其电连接。

公开(公告)号：US06607938B2

公开(公告)日：2003-08-19

申请号：US10200077

申请日：2002-07-18

申请人： Yong Hwan Kwon ,  Sa Yoon Kang ,  Dong Hyeon Jang ,  Min Kyo Cho ,  Gu Sung Kim

发明人： Yong Hwan Kwon ,  Sa Yoon Kang ,  Dong Hyeon Jang ,  Min Kyo Cho ,  Gu Sung Kim

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2225/0652 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/013

摘要： A wafer level chip package has a redistrubution substrate, at least one lower semiconductor chip stacked on the redisctribution substrate, and an uppermost semiconductor chip. The redistribution substrate has a redistribution layer and substrate pads connected to the redistribution layer. The lower semiconductor chip is stacked on the redistribution layer and may have through holes for partially exposing the redistribution layer, the through holes corresponding to the substrate pads, and having conductive filling material filling the through holes. The uppermost semiconductor chip may have the same elements as the lower semiconductor chip, and may be flip chip bonded to the through holes. The package may further have a filling layer for filling areas between chips, a metal lid for coating most of the external surfaces, and external connection terminals formed on and electrically connected to the exposed redistribution layer from the first dielectric layer of the redistribution substrate.

公开(公告)号：US20150374406A1

公开(公告)日：2015-12-31

申请号：US14723036

申请日：2015-05-27

申请人： Ho Seok SONG ,  Min Kyo CHO ,  Jun Woo PARK ,  Hong Ho KIM

发明人： Ho Seok SONG ,  Min Kyo CHO ,  Jun Woo PARK ,  Hong Ho KIM

IPC分类号： A61B17/34 ,  A61B19/00 ,  A61M25/06 ,  A61M5/158

CPC分类号： A61B17/3403 ,  A61B46/10 ,  A61B90/11 ,  A61B2017/3405 ,  A61B2017/3409 ,  A61B2090/0813 ,  A61M5/158 ,  A61M2005/1585 ,  A61M2205/02

摘要： Disclosed is a medical intervention apparatus. The medical intervention apparatus includes a needle rotation unit configured to include a first needle rotation member, a second needle rotation member that is disposed to be separated from the first needle rotation member, and a first driver that drives the first and second needle rotation members to rectilinearly move in opposite directions and a needle insertion unit configured to insert a needle, which is inserted between the first needle rotation member and the second needle rotation member, into a target.

摘要翻译： 公开了一种医疗介入装置。 医疗介入装置包括：针旋转单元，被配置为包括第一针旋转构件，设置成与第一针旋转构件分离的第二针旋转构件;以及驱动第一和第二针旋转构件的第一驱动器， 在相反方向上直线移动，并且针插入单元构造成将插入在第一针旋转构件和第二针旋转构件之间的针插入到目标中。

公开(公告)号：US08054370B2

公开(公告)日：2011-11-08

申请号：US12650610

申请日：2009-12-31

申请人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

发明人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

IPC分类号： H04N5/225

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14806 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/49171 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

摘要翻译： 在一个实施例中，小型化固态成像装置包括具有用于将半导体芯片安装在其中的空腔的主体。 主体具有向空腔延伸的伸出部分。 此外，引线设置在身体内。 引线的一端通过主体的顶表面暴露，而另一端通过主体的底表面暴露以与其电连接。

公开(公告)号：US07659936B2

公开(公告)日：2010-02-09

申请号：US11053209

申请日：2005-02-07

申请人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

发明人： Min-Kyo Cho ,  Jae-Cheon Doh ,  Young-Shin Kwon

IPC分类号： H04N5/225

CPC分类号： H04N5/2251 ,  H01L27/14618 ,  H01L27/14806 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/49171 ,  H04N5/2253 ,  H04N5/2254 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, a miniaturized solid-state imaging apparatus includes a body having a cavity for mounting a semiconductor chip therein. The body has an overhanging portion extending toward the cavity. Further, a lead is disposed within the body. The lead has one end exposed through a top surface of the body and the other end exposed through a bottom surface of the body for electrical connection thereof.

摘要翻译： 在一个实施例中，小型化固态成像装置包括具有用于将半导体芯片安装在其中的空腔的主体。 主体具有向空腔延伸的伸出部分。 此外，引线设置在身体内。 引线的一端通过主体的顶表面暴露，而另一端通过主体的底表面暴露以与其电连接。

公开(公告)号：US07405760B2

公开(公告)日：2008-07-29

申请号：US10347184

申请日：2003-01-21

申请人： Min Kyo Cho ,  Sa Yoon Kang ,  Young Hoon Ro ,  Young Shin Kwon

发明人： Min Kyo Cho ,  Sa Yoon Kang ,  Young Hoon Ro ,  Young Shin Kwon

IPC分类号： H04N5/225

CPC分类号： H04N5/2253 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/92247 ,  H01L2924/00014

摘要： An image pickup device and a manufacturing method thereof. A digital signal processing (DSP) chip is attached on a first surface of a substrate. A CMOS image sensor (CIS) chip is attached on an active surface of the DSP chip. The DSP chip and the CIS chip may be electrically connected to the substrate by wire bonding. A housing kit having a lens configured to transmit an image to the DSP chip may be mounted on the substrate. An inner space between the housing kit and the substrate is not molded, thereby simplifying a manufacturing process and providing a thinner and/or lighter image pickup device.

摘要翻译： 一种摄像装置及其制造方法。 数字信号处理（DSP）芯片附着在基板的第一表面上。 CMOS图像传感器（CIS）芯片附着在DSP芯片的有源表面上。 DSP芯片和CIS芯片可以通过引线接合电连接到基板。 具有被配置为将图像传送到DSP芯片的透镜的外壳套件可以安装在基板上。 外壳套件和基板之间的内部空间不被模制，从而简化制造过程并提供更薄和/或更轻的图像拾取装置。