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    Electronic component module
    1.
    发明授权
    Electronic component module 有权
    电子元件模块

    公开(公告)号：US08179678B2

    公开(公告)日：2012-05-15

    申请号：US12753436

    申请日：2010-04-02

    申请人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    发明人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    IPC分类号： H05K7/20

    CPC分类号： H05K1/0243 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2224/0401

    摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

    摘要翻译： 提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。 电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。 多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。 此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

    ELECTRONIC COMPONENT MODULE
    2.
    发明申请
    ELECTRONIC COMPONENT MODULE 有权
    电子元件模块

    公开(公告)号：US20100265663A1

    公开(公告)日：2010-10-21

    申请号：US12753436

    申请日：2010-04-02

    申请人： Mitsuyoshi YAMASHITA ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    发明人： Mitsuyoshi YAMASHITA ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    IPC分类号： H05K7/20 ,  H05K7/00

    CPC分类号： H05K1/0243 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2224/0401

    摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

    摘要翻译： 提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。 电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。 多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。 此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。