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    Electronic component module
    1.
    发明授权
    Electronic component module 有权
    电子元件模块

    公开(公告)号：US08179678B2

    公开(公告)日：2012-05-15

    申请号：US12753436

    申请日：2010-04-02

    申请人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    发明人： Mitsuyoshi Yamashita ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    IPC分类号： H05K7/20

    CPC分类号： H05K1/0243 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2224/0401

    摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

    摘要翻译： 提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。 电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。 多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。 此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

    ELECTRONIC COMPONENT MODULE
    2.
    发明申请
    ELECTRONIC COMPONENT MODULE 有权
    电子元件模块

    公开(公告)号：US20100265663A1

    公开(公告)日：2010-10-21

    申请号：US12753436

    申请日：2010-04-02

    申请人： Mitsuyoshi YAMASHITA ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    发明人： Mitsuyoshi YAMASHITA ,  Yoshihisa Amano ,  Akiteru Deguchi ,  Masahiko Kushino ,  Masahiro Murakami

    IPC分类号： H05K7/20 ,  H05K7/00

    CPC分类号： H05K1/0243 ,  H01L23/552 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/181 ,  H05K9/006 ,  H05K2201/10371 ,  H05K2201/10522 ,  H01L2224/0401

    摘要： Provided is an electronic component module which has high reliability and is capable of suppressing reduction in handling performance of a mounting machine. An electronic component module includes a plurality of electronic components mounted on a top surface of a module substrate, a planar top plate covering the electronic components, and a top plate holding member for holding the top plate. The plurality of electronic components include a quartz resonator, and a RF-IC which has a height smaller than that of the quartz resonator and is disposed on the top surface of the module substrate so as to be side by side with the quartz resonator. In addition, the top plate is fixed to the quartz resonator, and the top plate holding member for holding the top plate is disposed between the RF-IC and the top plate.

    摘要翻译： 提供一种电子部件模块，其具有高可靠性并且能够抑制安装机器的操作性能的降低。 电子部件模块包括安装在模块基板的上表面上的多个电子部件，覆盖电子部件的平面顶板和用于保持顶板的顶板保持部件。 多个电子部件包括石英谐振器和具有比石英谐振器的高度小的RF-IC，并且被布置在模块基板的顶表面上以与石英谐振器并排。 此外，顶板固定在石英谐振器上，用于保持顶板的顶板保持构件设置在RF-IC和顶板之间。

    SEMICONDUCTOR MODULE
    3.
    发明申请
    SEMICONDUCTOR MODULE 有权
    半导体模块

    公开(公告)号：US20100202125A1

    公开(公告)日：2010-08-12

    申请号：US12685306

    申请日：2010-01-11

    申请人： Masahiro MURAKAMI ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

    发明人： Masahiro MURAKAMI ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

    IPC分类号： H05K7/00

    CPC分类号： H05K1/0271 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/09136 ,  H05K2201/10204 ,  H01L2224/0401

    摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.

    摘要翻译： 面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。 金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。 利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲 树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲 的顶板被淘汰。 这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

    Semiconductor module
    4.
    发明授权
    Semiconductor module 有权
    半导体模块

    公开(公告)号：US08335086B2

    公开(公告)日：2012-12-18

    申请号：US12685306

    申请日：2010-01-11

    申请人： Masahiro Murakami ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

    发明人： Masahiro Murakami ,  Masahiko Kushino ,  Akiteru Deguchi ,  Yoshihisa Amano

    IPC分类号： H05K7/02 ,  H05K7/06 ,  H05K7/08 ,  H05K7/10

    CPC分类号： H05K1/0271 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/19105 ,  H05K1/144 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/09136 ,  H05K2201/10204 ,  H01L2224/0401

    摘要： A top panel, which is disposed to face a module board with an electronic component therebetween, includes a resin layer and a metal layer, and has an insulating characteristic. The metal layer includes a metal layer formed at a front side of the resin layer and a metal layer formed at a rear side of the resin layer. With this structure, in reflow soldering performed in mounting a semiconductor module on a main board, warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the front side of the resin layer is cancelled by warp which is caused, under temperature change, in the top panel due to difference in coefficient of thermal expansion between the resin layer and the metal layer formed at the rear side of the resin layer, whereby warp of the top panel is eliminated. This helps prevent the electronic component adhered to the top panel with adhesive from being pressed down to or pulled up from the module board due to warp of the top panel.

    摘要翻译： 面对其间具有电子部件的模块板的顶板包括树脂层和金属层，并且具有绝缘特性。 金属层包括在树脂层的前侧形成的金属层和形成在树脂层的后侧的金属层。 利用这种结构，在将半导体模块安装在主板上进行的回流焊接中，由于在树脂层和形成在该主板上的金属层之间的热膨胀系数的差异，在顶板中在温度变化时引起的翘曲 树脂层的前侧由于在树脂层和形成在树脂层的后侧的金属层之间的热膨胀系数的差异而在顶板中由于温度变化引起的翘曲而消除，由此翘曲 的顶板被淘汰。 这有助于防止由于顶板的翘曲而使粘合剂附着在顶板上的电子部件被压下或从模块板拉出。

    SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES
    7.
    发明申请
    SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES 审中-公开
    基板成员，模块，电气设备和模块的制造方法

    公开(公告)号：US20110104429A1

    公开(公告)日：2011-05-05

    申请号：US12832353

    申请日：2010-07-08

    申请人： Masahiko Kushino ,  Masahiro Murakami ,  Shinichi Tokuno

    发明人： Masahiko Kushino ,  Masahiro Murakami ,  Shinichi Tokuno

    IPC分类号： B32B3/02 ,  B32B3/30 ,  B29C65/00

    CPC分类号： H01L21/565 ,  H01L21/561 ,  H01L23/13 ,  H01L23/3128 ,  H01L24/97 ,  H01L2224/83385 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/19041 ,  Y10T428/239 ,  Y10T428/24479 ,  Y10T428/24612

    摘要： A substrate member is a manufacturing component of a module including electronic components mounted on a substrate and sealed with resin. The substrate member has substantially a plate-like shape and is to be the substrate later. A manufacturing process of the modules includes a mounting step of mounting electronic components on a component side of the substrate member, and a sealing step of supplying resin to flow on the component side so that the mounted electronic components are sealed with the resin. The mounting step includes mounting a first electronic component having substantially a flat mounting surface in a first mounting region specified on the component side so that a gap is formed between the mounting surface and the component side. The component side is provided with a first groove for boosting the resin to fill up the gap in the sealing step. Thus, insufficient filling of the resin in the gap between the substrate member and the electronic component is suppressed.

    摘要翻译： 基板构件是包括安装在基板上并用树脂密封的电子部件的模块的制造部件。 基板构件基本上具有板状形状，并且稍后将成为基板。 模块的制造过程包括将电子部件安装在基板部件的部件侧的安装步骤以及供给树脂在部件侧流动从而将所安装的电子部件用树脂密封的密封工序。 安装步骤包括将具有基本上平坦的安装表面的第一电子部件安装在在部件侧指定的第一安装区域中，使得在安装表面和部件侧之间形成间隙。 部件侧设置有用于在密封步骤中增加树脂以填充间隙的第一凹槽。 因此，抑制了树脂在衬底构件和电子部件之间的间隙中的填充不充分。

    Image sensor having clamp connecting sensing and driving components
    8.
    发明授权
    Image sensor having clamp connecting sensing and driving components 失效
    图像传感器具有夹紧连接检测和驱动部件

    公开(公告)号：US5142137A

    公开(公告)日：1992-08-25

    申请号：US699656

    申请日：1991-05-14

    申请人： Masahiko Kushino ,  Hidetoshi Maeda ,  Noboru Nakajima ,  Mitsuhiko Yoshikawa ,  Toshiyuki Sakata

    发明人： Masahiko Kushino ,  Hidetoshi Maeda ,  Noboru Nakajima ,  Mitsuhiko Yoshikawa ,  Toshiyuki Sakata

    IPC分类号： H04N1/031

    CPC分类号： H04N1/0286 ,  H04N1/02865 ,  H04N1/0312 ,  H04N1/0315 ,  H04N1/0318 ,  H04N2201/03112 ,  H04N2201/03154

    摘要： An image sensor includes a light receiving insulating substrate which has a plurality of light receiving elements with one row disposed on one major surface and has a first wiring portion on one side of the major surface for connecting the light receiving elements to a plurality of external driving elements; a driving insulating substrate which has the driving elements mounted on one major surface and has a second wiring portion on one side of the major surface for connecting the driving elements to the light receiving elements; a press-contact connector for electrically connecting the wiring portions, keeping the light receiving insulating substrate and the driving insulating substrate in contact with each other with their respective wiring portions positioned back to back; and engaging means provided close to at least one of the wiring portions in the light receiving insulating substrate and the driving insulating substrate and also provided in the press-contact connector, for enhancing a mechanical holding strength of the press-contact connector to the insulating substrates.

    摘要翻译： 一种图像传感器包括：光接收绝缘基板，其具有设置在一个主表面上的多个具有一行的光接收元件，并且在主表面的一侧具有用于将光接收元件连接到多个外部驱动的第一布线部分 元素 驱动绝缘基板，其具有安装在一个主表面上的驱动元件，并且在主表面的一侧上具有用于将驱动元件连接到光接收元件的第二布线部分; 用于电连接所述布线部分的压接触连接器，保持所述光接收绝缘基板和所述驱动绝缘基板彼此接触，并且其各个布线部分背靠背定位; 以及接合装置，其靠近光接收绝缘基板和驱动绝缘基板中的布线部分中的至少一个并且还设置在压接触连接器中，用于提高压接触连接器对绝缘基板的机械保持强度 。