公开(公告)号：US07073957B2

公开(公告)日：2006-07-11

申请号：US10639397

申请日：2003-08-12

申请人： Nikolaus Schunk ,  Gottfried Beer ,  Josef Wittl

发明人： Nikolaus Schunk ,  Gottfried Beer ,  Josef Wittl

IPC分类号： G02B6/42 ,  H04B10/02

CPC分类号： H04B10/801 ,  G02B6/3893 ,  G02B6/4204 ,  G02B6/4246 ,  H01L31/12 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic transmitting and/or receiving module and an optical plug include a circuit carrier disposed at least partially in an alignment parallel to the optical axis of the module in a module housing. The circuit carrier forms a tongue-shaped region that protrudes into the continuation. A transmitting device and/or a receiving device is disposed in the continuation, where they are connected to the circuit carrier. The associated axial offsetting of the transmitting device and/or receiving device in the direction of an optical plug to be coupled on permits the provision of plug-in connections with improved protection of the devices and the fiber ends.

摘要翻译： 光电发射和/或接收模块和光学插头包括在模块外壳中至少部分地布置为平行于模块的光轴的对准的电路载体。 电路载体形成突出到延续部分的舌状区域。 发射装置和/或接收装置设置在继续中，在那里连接到电路载体。 发射装置和/或接收装置在要耦合的光学插头的方向上相关联的轴向偏移允许提供具有改进的装置和光纤端部保护的插入式连接。

公开(公告)号：US20050018977A1

公开(公告)日：2005-01-27

申请号：US10890258

申请日：2004-07-14

申请人： Gottfried Beer ,  Nikolaus Schunk

发明人： Gottfried Beer ,  Nikolaus Schunk

IPC分类号： G02B6/42 ,  G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.

摘要翻译： 相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有 后侧接触件作为其后侧的阴极。 另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

公开(公告)号：US07048450B2

公开(公告)日：2006-05-23

申请号：US10890258

申请日：2004-07-14

申请人： Gottfried Beer ,  Nikolaus Schunk

发明人： Gottfried Beer ,  Nikolaus Schunk

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05569 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05099

摘要： An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.

摘要翻译： 相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有 后侧接触件作为其后侧的阴极。 另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

公开(公告)号：US08889548B2

公开(公告)日：2014-11-18

申请号：US13084105

申请日：2011-04-11

申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

IPC分类号： H01L29/72 ,  H01L23/552 ,  H01L21/768 ,  H01L23/48 ,  H01L23/66

CPC分类号： H01L21/76898 ,  H01L21/3065 ,  H01L21/308 ,  H01L21/76879 ,  H01L23/481 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6688 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05569 ,  H01L2924/00014 ,  H01L2224/05552

摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分布线图案。

公开(公告)号：US07952185B2

公开(公告)日：2011-05-31

申请号：US11645150

申请日：2006-12-22

申请人： Horst Theuss ,  Gottfried Beer

发明人： Horst Theuss ,  Gottfried Beer

IPC分类号： H01L23/52

CPC分类号： H01L21/568 ,  B81B7/007 ,  B81C2203/0109 ,  B81C2203/0154 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/20 ,  H01L2224/24137 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2224/82 ,  H01L2924/00

摘要： A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed.

摘要翻译： 公开了一种包括芯片的装置，该芯片保持在铸造化合物中并且布置有中空结构。

公开(公告)号：US07910404B2

公开(公告)日：2011-03-22

申请号：US12205294

申请日：2008-09-05

申请人： Klaus Pressel ,  Gottfried Beer

发明人： Klaus Pressel ,  Gottfried Beer

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/20 ,  H01L2224/32145 ,  H01L2224/73217 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/97 ,  H01L2225/06524 ,  H01L2225/06593 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2924/00

摘要： A method of manufacturing a stacked die module includes applying a plurality of stacked die structures to a carrier. Each stacked die structure includes a first semiconductor die applied to the carrier and a second semiconductor die stacked over the first semiconductor die. The second semiconductor die has a larger lateral surface area than the first semiconductor die. A dam is applied around each of the stacked die structures, thereby forming an enclosed cavity for each of the stacked die structures. The enclosed cavity for each stacked die structure surrounds the first semiconductor die of the stacked die structure.

摘要翻译： 制造堆叠模具模块的方法包括将多个堆叠的模具结构应用于载体。 每个堆叠的管芯结构包括施加到载体的第一半导体管芯和堆叠在第一半导体管芯上的第二半导体管芯。 第二半导体管芯具有比第一半导体管芯更大的侧表面积。 在每个堆叠的模具结构周围施加坝，从而为每个堆叠的模具结构形成封闭的腔。 用于每个堆叠的管芯结构的封闭空腔包围堆叠管芯结构的第一半导体管芯。

公开(公告)号：US20110024918A1

公开(公告)日：2011-02-03

申请号：US12904561

申请日：2010-10-14

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L23/48

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

摘要翻译： 公开了堆叠的半导体芯片。 一个实施例提供了包括具有第一表面和相对的第二表面的第一基底的方法。 第一衬底包括在第一衬底的第一表面上的第一连接元件的阵列。 第二基板具有第一表面和相对的第二表面。 第二衬底包括在第二衬底的第一表面上的第二连接元件的阵列。 第一连接元件附接到第二连接元件; 并且在将第一连接元件附接到第二连接元件之后使第一基板和第二基板中的至少一个变薄。

公开(公告)号：US07867878B2

公开(公告)日：2011-01-11

申请号：US11859329

申请日：2007-09-21

申请人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

发明人： Markus Brunnbauer ,  Recai Sezi ,  Thorsten Meyer ,  Gottfried Beer

IPC分类号： H01L21/30

CPC分类号： H01L24/96 ,  H01L21/568 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/16145 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06582 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2224/81

摘要： Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate. A second substrate has a first surface and an opposing second surface. The second substrate includes an array of second connection elements on the first surface of the second substrate. The first connection elements is attached to the second connection elements; and is thinning at least one of the first substrate and the second substrate after the attachment of the first connection elements to the second connection elements.

公开(公告)号：US20100019370A1

公开(公告)日：2010-01-28

申请号：US12179217

申请日：2008-07-24

申请人： Klaus Pressel ,  Gottfried Beer

发明人： Klaus Pressel ,  Gottfried Beer

IPC分类号： H01L23/52 ,  H01L23/28 ,  H01L21/50 ,  H01L21/98

CPC分类号： G01P1/023 ,  B81B7/02 ,  B81B2207/092 ,  B81B2207/095 ,  B81C1/0023 ,  B81C2203/0154 ,  G01L9/0042 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/50 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/76155 ,  H01L2224/82039 ,  H01L2224/97 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H04R1/04 ,  H04R2201/003 ,  H01L2224/82 ,  H01L2224/29099 ,  H01L2924/00

摘要： A semiconductor device and manufacturing method. One embodiment provides a semiconductor chip. An encapsulating material covers the semiconductor chip. A metal layer is over the semiconductor chip and the encapsulating material. At least one of a voltage generating unit and a display unit are rigidly attached to at least one of the encapsulating material and the metal layer.

摘要翻译： 半导体器件及其制造方法。 一个实施例提供一种半导体芯片。 封装材料覆盖半导体芯片。 金属层在半导体芯片和封装材料之上。 电压产生单元和显示单元中的至少一个刚性地附接到至少一个封装材料和金属层。

公开(公告)号：US07413353B2

公开(公告)日：2008-08-19

申请号：US11693446

申请日：2007-03-29

申请人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

发明人： Gottfried Beer ,  Jochen Dangelmaier ,  Cyrus Ghahremani ,  Jean Schmitt

IPC分类号： G02B6/36 ,  G02B6/00

CPC分类号： G02B6/4202 ,  G02B6/4232

摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.

摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。