公开(公告)号：US06860746B2

公开(公告)日：2005-03-01

申请号：US10372128

申请日：2003-02-25

申请人： Kouji Ota ,  Hiroki Hirai ,  Yoshitsugu Tsuji ,  Satoshi Takano ,  Masahiro Shibata ,  Atsushi Kimura ,  Masahiko Kanda ,  Narito Yagi ,  Noriki Hayashi

发明人： Kouji Ota ,  Hiroki Hirai ,  Yoshitsugu Tsuji ,  Satoshi Takano ,  Masahiro Shibata ,  Atsushi Kimura ,  Masahiko Kanda ,  Narito Yagi ,  Noriki Hayashi

IPC分类号： H01R13/03 ,  H01R13/53

CPC分类号： H01R13/03

摘要： Provided is a pair of arc discharge suppressive terminals electrically communicable with each other by engagement of the terminal pair. At least one of the terminal pair has a final contact site which is in contact with the counterpart terminal at a final stage of disengagement of the terminal pair. At least the final contact site is covered with an arc discharge suppressive layer containing a first metal having a melting point of 1,550° C. or higher. It is preferable that the terminal pair contact with each other at a portion corresponding to a main contact site other than the arc discharge suppressive layer in a completely engaged state where the one of the terminal pair and the counterpart terminal are tightly engaged with each other. Preferably, the main contact site has a surface made of a material having a higher conductivity than the arc discharge suppressive layer. This arrangement effectively suppresses occurrence of arc discharge at a time of disengagement of the terminal pair.

摘要翻译： 提供一对电弧放电抑制端子，其通过端子对的接合而彼此电连接。 终端对中的至少一个具有在终端对的分离的最后阶段与对方终端接触的最终接触部位。 至少最终的接触部位用含有熔点为1550℃以上的第一金属的电弧放电抑制层覆盖。 优选地，端子对在与电弧放电抑制层以外的主接触部位相对应的部分处于完全接合状态，其中端子对和对应端子之一彼此紧密接合。 优选地，主接触部位具有由比电弧放电抑制层更高的导电性的材料制成的表面。 这种布置有效地抑制了端子对脱离时电弧放电的发生。

公开(公告)号：US07163753B2

公开(公告)日：2007-01-16

申请号：US10413388

申请日：2003-04-15

申请人： Kouji Ota ,  Hiroki Hirai ,  Yoshitugu Tsuji ,  Masahiro Shibata ,  Atsushi Kimura ,  Toshiaki Sakai ,  Satoshi Takano ,  Masahiko Kanda ,  Narito Yagi

发明人： Kouji Ota ,  Hiroki Hirai ,  Yoshitugu Tsuji ,  Masahiro Shibata ,  Atsushi Kimura ,  Toshiaki Sakai ,  Satoshi Takano ,  Masahiko Kanda ,  Narito Yagi

IPC分类号： H01R13/03

CPC分类号： H01R13/53 ,  H01R13/03 ,  H01R13/113 ,  Y10S428/929 ,  Y10T428/12715 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291

摘要： An arc-resistant terminal, couple, and connecter are provided. In an embodiment, a metal-based electrical contact portion thereof includes at least one of Cu, Ni or Sn, and not more than 0.06 mass % P, wherein the arc-resistant terminal capable of suppressing arc discharge wherein a voltage between the arc-resistant terminal and a second terminal immediately after separation thereof is DC36V to 60V and a current between terminals during contact is 6A to 30A. In another embodiment, the an electrical contact portion comprising at least 80 mass % of metal having a boiling point of not less than 1000 degrees centigrade. According to the present invention, since the electrical contact portion or the final contact portion of the terminal includes a specific metal-based material, even when the voltage applied between the terminals is increased and an arc discharge is liable to be generated, the arc discharge can be suppressed. The arc-resistant terminal of the present invention can be suitably used in a connector for an automobile, a joint box provided with the connector portion and the like. This abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

摘要翻译： 提供防弧端子，耦合和连接器。 在一个实施方案中，其金属基电接触部分包括Cu，Ni或Sn中的至少一种，并且不大于0.06质量％的P，其中能够抑制电弧放电的耐电弧端子， 紧靠其后的第二端子为DC36V至60V，并且接触端子之间的电流为6A至30A。 在另一个实施方案中，电接触部分包含至少80质量％的沸点不低于1000摄氏度的金属。 根据本发明，由于端子的电接触部分或最终接触部分包括特定的金属基材料，即使当端子之间施加的电压增加并且容易产生电弧放电时，电弧放电 可以抑制。 本发明的耐电弧端子可以适用于汽车连接器，连接器部分的接头盒等。 该摘要既不旨在限定本说明书中公开的发明，也不旨在以任何方式限制本发明的范围。

公开(公告)号：US20050236182A1

公开(公告)日：2005-10-27

申请号：US10517058

申请日：2003-06-02

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/16 ,  H05K3/24 ,  H05K3/38 ,  H05K1/16

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US20080063792A1

公开(公告)日：2008-03-13

申请号：US11976490

申请日：2007-10-25

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： H05K3/00

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US08231766B2

公开(公告)日：2012-07-31

申请号：US11976490

申请日：2007-10-25

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： C23C14/00 ,  B05D5/12

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，通过使用含有平均粒径为4μm以下且最大粒径为15μm的金属粒子的导电糊进行印刷来制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。

公开(公告)号：US08866027B2

公开(公告)日：2014-10-21

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/44 ,  H05K3/20 ,  H05K1/09 ,  H05K3/40 ,  H01B1/22 ,  H05K1/05

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。

公开(公告)号：US20100044094A1

公开(公告)日：2010-02-25

申请号：US12518398

申请日：2008-01-16

申请人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

发明人： Yoshio Oka ,  Jinjoo Park ,  Kazuyuki Maeda ,  Narito Yagi ,  Tetsuya Shimomura ,  Junichiro Nishikawa

IPC分类号： H05K1/11 ,  H05K3/10

CPC分类号： H05K3/44 ,  H01B1/22 ,  H05K1/056 ,  H05K1/097 ,  H05K3/4069 ,  H05K2201/09554 ,  H05K2203/0315 ,  H05K2203/105 ,  H05K2203/1136 ,  Y10T29/49128 ,  Y10T29/49165

摘要： The printed wiring board 1 includes the metallic substrate 2, the insulating layer 3 provided on the surface of the metallic substrate 2, and the conductive layer 4 formed on the surface of the insulating layer 3. The conductive layer 4 is electrically connected to the metallic substrate 2. A bottomed via hole or a through hole 6 is formed in the insulating layer 3 and the conducive layer 4. The via hole has a bottom in the metallic substrate 2, and has a wall surface in the insulating layer 3 and in the conductive layer 4. The through hole 6 extends through the insulating layer 3, the conductive layer 4, and the metallic substrate 2. Conductive paste 7 fills the bottomed via hole or the through hole 6 to electrically connect the metallic substrate 2 and the conductive layer 4 with each other. The printed wiring board 1 is subjected to a process in which current is applied to the interface between the metallic substrate 2 and the conductive paste 7.

摘要翻译： 印刷电路板1包括金属基板2，设置在金属基板2的表面上的绝缘层3和形成在绝缘层3的表面上的导电层4.导电层4电连接到金属 基板2.在绝缘层3和导电层4中形成有底的通孔或通孔6.通孔在金属基板2中具有底部，并且在绝缘层3中具有壁表面 通孔6延伸穿过绝缘层3，导电层4和金属基底2.导电浆料7填充有底的通孔或通孔6，以将金属基底2和导电层 4与彼此。 对印刷布线板1进行电流施加到金属基板2和导电浆料7之间的界面的处理。