摘要:
A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.
摘要:
A high performance, low power up/down counter is set forth. The counter presented is controlled by two clock pulses, an up pulse and a down pulse, and updates all bits of the counter in parallel. These bits are then latched using a scannable pulsed limited output switching dynamic logic latch. By using a limited switch dynamic logic latch, the counter is able to utilize the speed of dynamic logic without requiring the traditional dynamic logic power. The area saved and speed gained by using a dynamic latch is significant compared to a typical edge-triggered flip-flop. Additionally, by computing all the next count state bits in parallel, the counter reduces an overall count computation delay by eliminating the counter ripple.
摘要:
A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.
摘要:
A technique for operating a multiplexer includes selecting, from multiple transmission gate groups, a transmission gate group. A transmission gate is selected from the selected transmission gate group. Finally, a data signal associated with the selected transmission gate is provided at an output of the multiplexer.
摘要:
A configurable, low power high fan-in multiplexer (MUX) is disclosed. The MUX circuit includes multiple current control elements, which each include multiple inverters coupled to a transmission gate. Each current control element receives a data signal and a select signal that corresponds to the data signal. If a select signal exceeds a threshold value (e.g., a logical “1”), the select signal deactivates a pull-up transistor (e.g., a p-type field effect transistor), and the transmission gate enables the corresponding data signal to provide input to a logic gate (e.g., a NAND gate) coupled to the output of the MUX. If the select signal does not exceed the threshold value, the select signal activates the pull-up transistor, and the transmission gate prevents the corresponding data signal from providing input to the logic gate.
摘要:
A design structure embodied in a machine readable medium used in a design process, includes a circuit for data storage. The circuit includes a double edge clock generation circuit for generating a pulse clock signal having first and second clock pulses for each clock cycle of a system clock; a scan clock generation circuit for generating first and second scan clock signals; a scannable pulse flip-flop circuit having a data input and a data output that are connected with an internal storage node, the scannable pulse flip-flop circuit including a scan input and a scan output connected with the internal storage node, and receptive to the pulse clock signal and the scan clock signals. The scannable pulse flip-flop circuit is configured to be operable in a function mode of operation and a scan mode of operation.
摘要:
Methods and apparatuses to decrease power consumption and reduce leakage current of integrated circuits are disclosed. New leakage power saving techniques for various types of integrated circuits, including cache memory circuits, are discussed. Embodiments comprise methods and apparatuses to reduce power consumption in integrated circuits by using virtual voltage rails, or virtual power rails, to supply power to integrated circuit loads. The methods and apparatuses generally involve using one or two virtual power control devices to “head” and “foot”, or sandwich, the integrated circuit loads from firm power supply rails. In these method embodiments, one or more elements sense the voltage of the virtual power rails, or nodes, and make adjustments to control the voltage at certain “virtual” voltage potentials. While controlling the voltage in this manner, the virtual power control devices may serve to restrict unnecessary current flow through the integrated circuit loads.
摘要:
An electronic switch circuit switches out bad decoupling capacitors on a high speed integrated circuit chip. The circuit comprises a control device that operates in the subthreshold or off device state to detect leakage in a decoupling capacitor. This control device operates in a low impedance state if the capacitor is good and in a high impedance sate if the capacitor is bad. A feedback circuit is connected from an internal node of the capacitor to a gate of the control device so that once a state of the capacitor is detected it can be stored on the gate of the control device. A single external signal source shared by a group of capacitors activates the control device to detect leakage in the capacitor. The circuit operates to switch out capacitors that fail during normal operation.
摘要:
A programmable interrupt controller having a plurality of interrupt request inquest inputs and an interrupt request output for connection to a central processing unit (CPU) includes means for interrupting the CPU over the interrupt request output responsive to an interrupt request from any one of the interrupt request inputs and a priority resolver for assigning a priority position to each of the interrupt request inputs to create an interrupt priority hierarchy. The interrupt controller is programmable such that each interrupt request input may be independently established as responsive to either edge-triggered or level-triggered interrupt requests on a per interrupt basis. An initialization command word register of the interrupt controller has a bit corresponding to each of the interrupt request inputs. Programming each of the bits of the register to one of two states determines whether corresponding interrupt request inputs are edge-sensitive or level-sensitive.
摘要:
A plurality of peripheral test structure substrate (PTSS) through vias is formed within a peripheral test structure substrate. A peripheral test structure layer and at least one functional layer are formed on one side of the plurality of the PTSS through vias. The other side of the plurality of the PTSS through vias is exposed throughout fabrication of the peripheral test structure layer and the at least one functional layer to provide access points for testing functionality of the various layers throughout the manufacturing sequence. C4 bonding may be performed after manufacture of all of the at least one functional layer is completed. A 3D assembly carrier or a C4 carrier substrate is not required since the peripheral test structure substrate has sufficient mechanical strength to support the peripheral test structure layer and the at least one functional layer.