Abstract:
Methods of preparing front and back facets of a diode laser include controlling an atmosphere within a first chamber, such that an oxygen content and a water vapor content are controlled to within predetermined levels and cleaving the diode laser from a wafer within the controlled atmosphere of the first chamber to form a native oxide layer hating a predetermined thickness on the front and back facets of the diode laser. After cleavage, the diode laser is transported from the first chamber to a second chamber within a controlled atmosphere, the native oxide layer on the front and back facets of the diode laser is partially removed, an amorphous surface layer is formed on the front and back facets of the diode laser, and the front and back facets of the diode laser are passivated.
Abstract:
A 0.degree. and 180.degree. hybrid power divider/combiner includes a first quadrature hybrid and two other quadrature hybrids arranged in tandem with one output port of the first hybrid connected to an input port of the tandem arrangement and the other output port thereof connected to a delay of electrical length equal to that of the tandem arrangement. When an input signal is applied to one input port of the first hybrid with the other port terminated, two signals of reduced amplitude which are either in phase or of opposed phase (dependent on which input port receives the input signal) are produced at the output of the tandem arrangement and delay.
Abstract:
A closed-loop ring resonator including a closed loop formed on a substrate and including at least one coupling region having a first effective depth and at least one other region having a second effective depth, wherein the first and second depths are different.
Abstract:
A semiconductor electro luminescent diode having a body of a semiconductor material with the body having a pair of spaced opposed end surfaces, side surfaces and top and bottom surfaces. The body includes therein an active layer which extends from one end surface to a point spaced from the other end surface. The active layer is of a width narrower than the distance between the side surfaces. Also, the active layer has a portion adjacent the other end surface of the body which is tapered to come to a point. First clad layers of a material having an index of refraction smaller than that of the active layer are at opposite sides of the active layer and extend between the end of the active layer and the other end surface of the body. Second clad layers of a material having an index of refraction larger than that of the first clad layers but less than the index of refraction of the active layer are on the first clad layer. Radiation generated in the active layer and emitted from the pointed end of the active layer extends in area in the portion of the second clad layer between the pointed end of the active layer and the other end of the body so that the area of the beam of radiation emitted from the -diode is larger than the area of the beam formed in the active layer.
Abstract:
A method is provided for fabricating a via connector from a first surface of a semiconductor wafer to an opposite second surface of the wafer. The first step consists of forming an adherent metal layer on the first surface on the semiconductor wafer. If the first surface of the semiconductor wafer has electronic components formed thereon, the metal layer is applied over the electronic components and preferably a protective layer of material is formed over the metal layer. Via holes are then laser drilled at predetermined locations through the metal layer and then through the semiconductor wafer. Thereafter a photoresist layer is applied over the first surface and exposed and developed to provide passage holes in the photoresist which are in alignment with the laser drilled apertures. The metal layer is then connected in the cathode position of the electroforming apparatus and via connectors are thereafter electroformed in the via holes.
Abstract:
A method for improving the efficiency for an optoelectronic device, such as semiconductor lasers, Superluminescence Light Emitting Diodes (SLDs), Gain Chips, optical amplifiers is disclosed, see FIG. 4B. In accordance with the principles of the invention, at least one blocking layer (70) is interposed at the interface between materials composing the device. The at least one blocking layers creates a barrier that prevents the leakage of electrons from a device active region contained in the waveguide region, to a device clad region (66). In one aspect of the invention, a blocking layer (70) is formed at the junction of the semiconductor materials having different types of conductivity. The blocking layer prevents electrons from entering the material of a different polarity. In another aspect of the invention, a low-doped or undoped region (64) is positioned adjacent to the blocking layer (70) to decrease optical losses.