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    Optical navigation device with image sensor and inner housing
    1.
    发明授权
    Optical navigation device with image sensor and inner housing 失效
    具有图像传感器和内壳的光学导航装置

    公开(公告)号：US08711097B2

    公开(公告)日：2014-04-29

    申请号：US12623420

    申请日：2009-11-22

    Applicant: Lothar Westerweck ,  Stephen C. Arnold ,  John D. Griffith ,  Heidi L. Hall ,  Srinivas T. Rao

    Inventor： Lothar Westerweck ,  Stephen C. Arnold ,  John D. Griffith ,  Heidi L. Hall ,  Srinivas T. Rao

    IPC: G06F3/033 ,  G09G5/00

    CPC classification number: G06F3/03543 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0085 ,  G02B19/009 ,  G02B27/0977 ,  G06F3/042 ,  H04N5/2253 ,  H04N5/2257

    Abstract: An optical navigation device that can sense the movement of an object, such as a user's finger, so that the movement can control a feature of a consumer digital device such as a cursor on a display screen. The device includes a substrate to which an LED, reflector, and image sensor are attached. Light from the LED is directed by the elliptical reflector toward and through a window that is transparent to the light from the LED and then is reflected off of the user's finger back through the window, through a lens, and onto the image sensor. The reflector is positioned to direct light toward the window at an oblique angle, in the range of 65 to 70 degrees from an angle normal to the window. Further, the reflector is curved to gather light across a large solid angle in the vicinity of the LED. The curved shape of the reflector may be a portion of an ellipsoid and the LED may be located at one of the foci of the ellipsoid, with the window located at the other foci of the ellipsoid.

    Abstract translation: 可以感测诸如用户手指的物体的移动的光学导航装置，使得移动可以控制消费者数字设备的特征，例如显示屏幕上的光标。 该装置包括附接有LED，反射器和图像传感器的基板。 来自LED的光由椭圆形反射器引导并穿过对于来自LED的光是透明的窗口，然后通过透镜通过窗口从用户的手指反射回到图像传感器上。 反射器被定位成以与角度垂直的角度在65至70度的范围内以倾斜角向窗户引导光。 此外，反射器弯曲以在LED附近聚集大的立体角的光。 反射器的弯曲形状可以是椭圆体的一部分，并且LED可以位于椭圆体的焦点之一处，窗口位于椭圆体的另一个焦点处。

    Bath and process for the electrodeposition of micromachinable copper and additive for said bath
    2.
    发明授权
    Bath and process for the electrodeposition of micromachinable copper and additive for said bath 失效
    用于所述浴的可微加工铜和添加剂的电沉积的浴和工艺

    公开(公告)号：US4551212A

    公开(公告)日：1985-11-05

    申请号：US710290

    申请日：1985-03-11

    Applicant: Srinivas T. Rao ,  Louis Trager

    Inventor： Srinivas T. Rao ,  Louis Trager

    IPC: C25D3/38

    CPC classification number: C25D3/38 ,  Y10S534/01

    Abstract: It has been found that an additive comprising a mixture of phenazine dyestuffs in the combination from about 30 to 40 percent by weight of (a) a Janus Green B type dyestuff or a mixture thereof and (b) from about 70 to 60 percent by weight of Safranine T, when added to an aqueous acidic copper sulfate bath in the amount of about 0.03 to about 0.10 gram per liter of the bath, deposits copper consistently with the required properties for micromachining.

    Abstract translation: 已经发现，添加剂包含以下组合的吩嗪染料的混合物：约30至40重量％的（a）Janus Green B型染料或其混合物和（b）约70至60重量％ 的Safranine T，当加入到每升浴中约0.03至约0.10克的量的酸性硫酸铜水溶液中时，将铜一致地存在于微加工所需的性能上。

    Bonding pads for semiconductor devices
    5.
    发明授权
    Bonding pads for semiconductor devices 失效
    用于半导体器件的接合焊盘

    公开(公告)号：US4514265A

    公开(公告)日：1985-04-30

    申请号：US627921

    申请日：1984-07-05

    Applicant: Srinivas T. Rao ,  Frank Z. Hawrylo

    Inventor： Srinivas T. Rao ,  Frank Z. Hawrylo

    IPC: H01L21/288 ,  H01L21/60 ,  C25D5/02

    CPC classification number: H01L24/11 ,  H01L21/2885 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  Y10S204/09

    Abstract: An improved process for electroplating bonding pads, such as of gold, onto semiconductor devices is disclosed. Upon electrically connecting a masked semiconductor body and a suitable anode to the negative and positive terminals respectively of a power supply and submerging the wafer and anode into a suitable electrolyte, a modulated, rather than direct, current is applied to the electrolyte. A low stress, fine grain bonding pad layer is provided and, unexpectedly, non-planarities in the semiconductor body surface having a depth of about 1-3 microns can be substantially planarized when the thickness of the layer deposited is about 6-8 microns or more.

    Abstract translation: 公开了一种用于将键合焊盘（例如金）电镀到半导体器件上的改进方法。 将掩模的半导体本体和合适的阳极电连接到电源的负极和正极端子，并将晶片和阳极浸没在合适的电解液中之后，向电解质施加调制而不是直流电流。 提供了低应力的细晶粒焊盘层，并且意想不到的是，当沉积的层的厚度为约6-8微米时，半导体主体表面中具有约1-3微米深度的非平面度可以基本平坦化， 更多。

    Method of making a fiber optic array
    6.
    发明授权
    Method of making a fiber optic array 失效
    制作光纤阵列的方法

    公开(公告)号：US4875969A

    公开(公告)日：1989-10-24

    申请号：US254756

    申请日：1988-10-07

    Applicant: Kevin Hsu ,  Srinivas T. Rao ,  Joseph Y. Kaukeinen

    Inventor： Kevin Hsu ,  Srinivas T. Rao ,  Joseph Y. Kaukeinen

    IPC: B41J2/46 ,  B41J2/44 ,  B41J2/45 ,  B41J2/455 ,  G02B6/00 ,  G02B6/04 ,  G02B6/34 ,  G02B6/36 ,  G02B6/38

    CPC classification number: G02B26/103 ,  G02B6/245 ,  G02B6/3636 ,  G02B6/368 ,  G02B6/3652 ,  G02B6/3692

    Abstract: A method is disclosed for making a fiber optic array for use in an optical scanning device. The array includes a substrate and a plurality of optical fibers arranged on the substrate to form a linear array of the fibers. Each of the fibers is received in grooves in the substrate to precisely space the fibers relative to each other. Each of the fibers is adapted to receive light from a source such as a laser diode. In order to increase the packing density of the fibers in the array, the fibers are mounted in sets of parallel grooves which are spaced to draw the fibers closer together at an output end. Further, the ends of the fibers are etched to decrease the cladding diameter and thereby permit the fiber ends to be more closely spaced relative to each other.

    Abstract translation: 公开了一种用于制造用于光学扫描装置的光纤阵列的方法。 阵列包括基板和布置在基板上的多条光纤，以形成光纤的线性阵列。 每个纤维被接收在衬底中的凹槽中以相对于彼此精确地间隔纤维。 每个光纤适于接收来自诸如激光二极管的光的光。 为了增加阵列中的纤维的包装密度，纤维被安装成一组平行的凹槽，这些平行的凹槽被间隔开以将纤维在输出端处靠近在一起。 此外，纤维的端部被蚀刻以减小包层直径，从而允许纤维端部相对于彼此更紧密地间隔开。

    Method for fabricating via connectors through semiconductor wafers
    7.
    发明授权
    Method for fabricating via connectors through semiconductor wafers 失效
    通过半导体晶片制造通孔连接器的方法

    公开(公告)号：US4445978A

    公开(公告)日：1984-05-01

    申请号：US473551

    申请日：1983-03-09

    Applicant: James C. Whartenby ,  Richard Brown ,  Srinivas T. Rao ,  Raymond J. Menna

    Inventor： James C. Whartenby ,  Richard Brown ,  Srinivas T. Rao ,  Raymond J. Menna

    IPC: C25D5/02 ,  H01L21/768 ,  H05K3/42 ,  C25D7/04

    CPC classification number: C25D5/02 ,  H01L21/76898 ,  H05K3/423

    Abstract: A method is provided for fabricating a via connector from a first surface of a semiconductor wafer to an opposite second surface of the wafer. The first step consists of forming an adherent metal layer on the first surface on the semiconductor wafer. If the first surface of the semiconductor wafer has electronic components formed thereon, the metal layer is applied over the electronic components and preferably a protective layer of material is formed over the metal layer. Via holes are then laser drilled at predetermined locations through the metal layer and then through the semiconductor wafer. Thereafter a photoresist layer is applied over the first surface and exposed and developed to provide passage holes in the photoresist which are in alignment with the laser drilled apertures. The metal layer is then connected in the cathode position of the electroforming apparatus and via connectors are thereafter electroformed in the via holes.

    Abstract translation: 提供一种用于从半导体晶片的第一表面到晶片的相对的第二表面制造通孔连接器的方法。 第一步包括在半导体晶片的第一表面上形成粘附金属层。 如果半导体晶片的第一表面具有形成在其上的电子部件，则将金属层施加在电子部件上，并且优选在金属层上形成材料保护层。 然后在预定位置通过金属层激光钻孔，然后穿过半导体晶片。 此后，将光致抗蚀剂层施加在第一表面上并暴露并显影以在光致抗蚀剂中提供与激光钻孔相对准的通孔。 然后将金属层连接在电铸装置的阴极位置，然后通孔连接器在通孔中电铸。

    OPTICAL NAVIGATION DEVICE
    8.
    发明申请
    OPTICAL NAVIGATION DEVICE 失效
    光学导航装置

    公开(公告)号：US20110122060A1

    公开(公告)日：2011-05-26

    申请号：US12623420

    申请日：2009-11-22

    Applicant: Lothar Westerweck ,  Stephen C. Arnold ,  John D. Griffith ,  Heidi L. Hall ,  Srinivas T. Rao

    Inventor： Lothar Westerweck ,  Stephen C. Arnold ,  John D. Griffith ,  Heidi L. Hall ,  Srinivas T. Rao

    IPC: G09G5/00

    CPC classification number: G06F3/03543 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0085 ,  G02B19/009 ,  G02B27/0977 ,  G06F3/042 ,  H04N5/2253 ,  H04N5/2257

    Abstract: An optical navigation device that can sense the movement of an object, such as a user's finger, so that the movement can control a feature of a consumer digital device such as a cursor on a display screen. The device includes a substrate to which an LED, reflector, and image sensor are attached. Light from the LED is directed by the elliptical reflector toward and through a window that is transparent to the light from the LED and then is reflected off of the user's finger back through the window, through a lens, and onto the image sensor. The reflector is positioned to direct light toward the window at an oblique angle, in the range of 65 to 70 degrees from an angle normal to the window. Further, the reflector is curved to gather light across a large solid angle in the vicinity of the LED. The curved shape of the reflector may be a portion of an ellipsoid and the LED may be located at one of the foci of the ellipsoid, with the window located at the other foci of the ellipsoid.

    Abstract translation: 可以感测诸如用户手指的物体的移动的光学导航装置，使得移动可以控制消费者数字设备的特征，例如显示屏幕上的光标。 该装置包括附接有LED，反射器和图像传感器的基板。 来自LED的光由椭圆形反射器引导并穿过对于来自LED的光是透明的窗口，然后通过透镜通过窗口从用户的手指反射回到图像传感器上。 反射器被定位成以与角度垂直的角度在65至70度的范围内以倾斜角向窗户引导光。 此外，反射器弯曲以在LED附近聚集大的立体角的光。 反射器的弯曲形状可以是椭圆体的一部分，并且LED可以位于椭圆体的焦点之一处，窗口位于椭圆体的另一个焦点处。

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