THERMAL CONTROL SYSTEM FOR REENTRY VEHICLES
    5.
    发明公开

    公开(公告)号:US20230166872A1

    公开(公告)日:2023-06-01

    申请号:US17536450

    申请日:2021-11-29

    发明人: Tosh Alan Keune

    摘要: A thermal control system may transfer energy (directly or after a delay) to a thrusting device that can be used to slow a reentry vehicle entering a gaseous atmosphere from orbit. The thermal control system may mitigate the heating of the vehicle by transferring heat generated by the viscous interaction between the vehicle and high-altitude portions of a planetary atmosphere to a working fluid. This working fluid may then be routed through and/or ejected through one or more nozzles aligned to produce thrust in a direction that opposes the forward motion of this vehicle. This counter thrust may help to slow the reentry vehicle and reduce the amount of kinetic energy that can be converted into thermal energy. The working fluid may also be stored to use for propulsion after the reentry vehicle slows below hypersonic velocities.

    Self-Sintering Conductive Inks
    10.
    发明申请

    公开(公告)号:US20220306887A1

    公开(公告)日:2022-09-29

    申请号:US17211248

    申请日:2021-03-24

    摘要: Self-sintering conductive inks can be printed and self-sintered with a simple and low-cost process mechanized by exothermic alkali metal and water reaction, with enhanced electrical and thermal performance by liquid metal fusion. Such self-sintering conductive inks may include a gallium-alkali metal component and a water absorbing gel component. After patterning, the self-sintering inks, on reaching a designed trigger temperature (including room temperature), may metallize through a two-step process. Initially the gallium-alkali metal component activates and reacts with water released from the water absorbing gel component. Then the exothermic reaction between the water and the alkali element creates an intense and highly localized heating effect, which liquefies all metallic components in the ink and, on cooling, creates a solid metal trace or interconnect. Post cooling, the metal trace or interconnect cannot be reflowed without a significant temperature increase or other energetic input.