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1.发明授权
公开(公告)号：US4841633A
公开(公告)日：1989-06-27
申请号：US267290
申请日：1988-11-04
申请人： Seiichi Kinugawa
发明人： Seiichi Kinugawa
CPC分类号： H05K3/3442 , H01H13/702 , H05K1/0215 , H05K1/112 , H05K1/189 , H01H2207/014 , H01H2207/016 , H01H2239/008 , H01H2239/014 , H05K2201/0305 , H05K2201/0311 , H05K2201/0394 , H05K2201/09472 , H05K2201/10265 , H05K2201/10636 , H05K2203/1572 , H05K3/325 , H05K3/4038 , Y02P70/611 , Y02P70/613 , Y10T29/49139 , Y10T29/49144 , Y10T29/49156
摘要： Disclosed is a method of mounting electronic parts onto a single-sided printed wiring board, including the provision of a key contact pattern on the front surface of a substrate member having a plurality of through-holes; the provision of a conductive pattern covering these through-holes on the front surface of the substrate member; and the mounting of electronic parts in position relative to these through-holes from the rear surface of the substrate member.
摘要翻译： 公开了一种将电子部件安装到单面印刷电路板上的方法，包括在具有多个通孔的基板部件的前表面上设置键接触图案; 在基板构件的前表面上设置覆盖这些通孔的导电图案; 以及从基板构件的后表面相对于这些通孔安装电子部件。
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公开(公告)号：US4901193A
公开(公告)日：1990-02-13
申请号：US082514
申请日：1987-08-07
CPC分类号： H05K3/0061 , H01H13/702 , H01H2229/034 , H01H2229/038 , H01H2239/008 , H01H2239/01 , H01H2239/018 , H05K1/0254 , H05K1/0393 , H05K2201/0367 , H05K2201/056 , H05K2201/09063
摘要： An electronic apparatus including a flexible circuit board, with an electric wiring pattern, having an opening therein, an a supporter for supporting the flexible circuit board, the supporter being provided with an least one protruding member, wherein the protruding member is inserted into the opening of the flexible circuit board, so that the flexible circuit board with the wiring pattern is folded over both sides of said supporter means.
摘要翻译： 一种电子设备，包括具有电路布线图案的柔性电路板，其中具有开口，支撑柔性电路板的支撑件，支撑件设置有至少一个突出构件，其中突出构件插入到开口 的柔性电路板，使得具有布线图案的柔性电路板在所述支撑装置的两侧折叠。
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