公开(公告)号：US09613938B2

公开(公告)日：2017-04-04

申请号：US14987892

申请日：2016-01-05

申请人： Soichiro Suzu ,  Tomohito Taki

发明人： Soichiro Suzu ,  Tomohito Taki

IPC分类号： H05K1/18 ,  H01L25/10 ,  H01L23/043 ,  H01L21/54 ,  H01L23/00 ,  H01L25/00 ,  H01L23/16

CPC分类号： H01L25/10 ,  H01L21/54 ,  H01L23/043 ,  H01L23/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/26175 ,  H01L2224/29191 ,  H01L2224/3013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48135 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49051 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess.

公开(公告)号：US11137305B2

公开(公告)日：2021-10-05

申请号：US16967868

申请日：2019-02-07

申请人： Soichiro Suzu

发明人： Soichiro Suzu

IPC分类号： G01L9/00 ,  G01L19/00

摘要： A pressure sensor device of the present invention includes a first board including external connection terminals, a second board stacked on an upper surface of the first board and including a first through hole and a second through hole, a pressure sensor element including a diaphragm structure and mounted on an upper surface of the second board such that the first through hole is closed by the diaphragm structure, and a cover that is mounted on the upper surface of the second board to cover the pressure sensor element and in which a first channel for guiding a first fluid to an upper surface of the diaphragm structure is formed. A second channel is formed between the first board and the second board to lead from the second through hole to the first through hole and guide a second fluid to a lower surface of the diaphragm structure.

公开(公告)号：US20120049300A1

公开(公告)日：2012-03-01

申请号：US13219756

申请日：2011-08-29

申请人： Shinya YAMAGUCHI ,  Tomohito Taki ,  Takashi Usui ,  Soichiro Suzu

发明人： Shinya YAMAGUCHI ,  Tomohito Taki ,  Takashi Usui ,  Soichiro Suzu

IPC分类号： H01L29/84 ,  H01L21/50

CPC分类号： H01L24/29 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/07 ,  G01L19/147 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/26122 ,  H01L2224/2956 ,  H01L2224/29599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/481 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor apparatus includes a semiconductor sensor device including a first attachment surface, a base part being wire-bonded to the semiconductor sensor device and including a second attachment surface, and a spacer being interposed between the first and second attachment surfaces and having a target attachment surface to which at least one of the first and second attachment surfaces is adhered via a die-bond resin. A total area of the target attachment surface is smaller than a total area of the first attachment surface.

摘要翻译： 传感器装置包括半导体传感器装置，其包括第一附接表面，基底部分被引线接合到半导体传感器装置并且包括第二附接表面，以及间隔件插入在第一和第二附接表面之间并且具有目标附件 第一和第二附接表面中的至少一个经由模片接合树脂粘合到该表面上。 目标附着表面的总面积小于第一附接表面的总面积。

公开(公告)号：US20160219707A1

公开(公告)日：2016-07-28

申请号：US14987892

申请日：2016-01-05

申请人： Soichiro Suzu ,  Tomohito Taki

发明人： Soichiro Suzu ,  Tomohito Taki

IPC分类号： H05K1/18 ,  H05K1/03 ,  H05K3/46 ,  H05K7/02 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01L25/10 ,  H01L21/54 ,  H01L23/043 ,  H01L23/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/26175 ,  H01L2224/29191 ,  H01L2224/3013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48135 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/49051 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/85186 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A module includes a first substrate including first electrodes; a first element bonded to the first substrate, and including second electrodes disposed at a first end of the first element and third electrodes disposed at a second end of the first element opposite from the first end; a second substrate stacked on the first substrate and including a recess; and a second element bonded to a bottom surface of the recess of the second substrate and including fourth electrodes. The first electrodes of the first substrate are electrically connected to the second electrodes at the first end of the first element, and the third electrodes at the second end of the first element are electrically connected to the fourth electrodes of the second element via a through hole formed in the bottom surface of the recess.

摘要翻译： 模块包括：第一基板，包括第一电极; 第一元件，其结合到第一基板，并且包括设置在第一元件的第一端的第二电极和设置在第一元件的与第一端相对的第二端的第三电极; 第二基板，其堆叠在所述第一基板上并且包括凹部; 以及第二元件，其结合到第二基板的凹部的底表面并且包括第四电极。 第一基板的第一电极在第一元件的第一端处电连接到第二电极，并且第一元件的第二端处的第三电极经由通孔电连接到第二元件的第四电极 形成在凹部的底面。

公开(公告)号：US20150235980A1

公开(公告)日：2015-08-20

申请号：US14701589

申请日：2015-05-01

申请人： Shinya YAMAGUCHI ,  Tomohito TAKI ,  Takashi USUI ,  Soichiro SUZU

发明人： Shinya YAMAGUCHI ,  Tomohito TAKI ,  Takashi USUI ,  Soichiro SUZU

IPC分类号： H01L23/00

CPC分类号： H01L24/29 ,  B81B7/0048 ,  B81B2201/0264 ,  B81B2207/012 ,  B81B2207/07 ,  G01L19/147 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/26122 ,  H01L2224/2956 ,  H01L2224/29599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/481 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A sensor apparatus includes a semiconductor sensor device including a first attachment surface, a base part being wire-bonded to the semiconductor sensor device and including a second attachment surface, and a spacer being interposed between the first and second attachment surfaces and having a target attachment surface to which at least one of the first and second attachment surfaces is adhered via a die-bond resin. A total area of the target attachment surface is smaller than a total area of the first attachment surface.

摘要翻译： 传感器装置包括半导体传感器装置，其包括第一附接表面，基底部分被引线接合到半导体传感器装置并且包括第二附接表面，以及间隔件插入在第一和第二附接表面之间并且具有目标附件 第一和第二附接表面中的至少一个经由模片接合树脂粘合到该表面上。 目标附着表面的总面积小于第一附接表面的总面积。