公开(公告)号：US11133218B1

公开(公告)日：2021-09-28

申请号：US16750909

申请日：2020-01-23

Applicant: Tae Young Lee ,  Youn Tak Park

Inventor： Tae Young Lee ,  Youn Tak Park

IPC: H01L21/768 ,  H01L23/48 ,  H01L23/532 ,  H01L21/02

Abstract: A semiconductor apparatus having through silicon via structure and a manufacturing method thereof to enable the significant process and cost reduction and the improvement of performance of through silicon via by forming barrier and seed metal layers with electroless plating, the barrier layer applied in forming through silicon via with wet electroless plating thereby enabling structural uniformity and improvement in electrical properties with less process cost and higher yield to meet the both performance and economic objectives. The instant invention enables the formation of TSV with smaller diameter of the opening and, if necessary, omitting the formation of copper seed layer. Direct copper plating on the barrier layer is possible and this reduces the number of processes, charges the inside of via at once through copper plating to bring more improvements in electrical properties as effect.

公开(公告)号：US09695347B2

公开(公告)日：2017-07-04

申请号：US11965453

申请日：2007-12-27

Applicant: Homer Chou ,  Won Lae Kim ,  Jong Il Noh ,  In Kyung Lee ,  Tae Young Lee

Inventor： Homer Chou ,  Won Lae Kim ,  Jong Il Noh ,  In Kyung Lee ,  Tae Young Lee

IPC: H01L21/302 ,  H01L21/461 ,  C09K3/14 ,  C09G1/02 ,  C23F3/06 ,  H01L21/321

CPC classification number: C09K3/1463 ,  C09G1/02 ,  C09K3/1409 ,  C23F3/06 ,  H01L21/3212

Abstract: Provided is a slurry composition for chemical mechanical polishing (CMP) of a metal. The slurry composition comprises a copolymer whose average molecular weight is from about 600,000 to about 1,300,000 and whose monomers are acrylic acid and acrylamide in a molar ratio of about 1:30 to about 30:1. The slurry composition exhibits a non-Prestonian behavior to achieve minimized dishing and attain a high degree of planarization.

公开(公告)号：US08586464B2

公开(公告)日：2013-11-19

申请号：US12540661

申请日：2009-08-13

Applicant: Tae Young Lee ,  In Kyung Lee ,  Byoung Ho Choi ,  Yong Soon Park

Inventor： Tae Young Lee ,  In Kyung Lee ,  Byoung Ho Choi ,  Yong Soon Park

IPC: H01L21/4763 ,  H01L21/00

CPC classification number: C09G1/04 ,  H01L45/06 ,  H01L45/143 ,  H01L45/144 ,  H01L45/148 ,  H01L45/1683

Abstract: A slurry composition for chemical mechanical polishing (CMP) of a phase-change memory device is provided. The slurry composition comprises deionized water and iron or an iron compound. The slurry composition can achieve high polishing rate on a phase-change memory device and improved polishing selectivity between a phase-change memory material and a polish stop layer (e.g., a silicon oxide film), can minimize the occurrence of processing imperfections (e.g., dishing and erosion), and can lower the etch rate on a phase-change memory material to provide a high-quality polished surface. Further provided is a method for polishing a phase-change memory device using the slurry composition.

Abstract translation: 提供了一种用于相变存储器件的化学机械抛光（CMP）的浆料组合物。 浆料组合物包含去离子水和铁或铁化合物。 浆料组合物可以在相变存储器件上实现高抛光速率并且改善相变记忆材料和抛光停止层（例如，氧化硅膜）之间的抛光选择性，可以最小化处理缺陷的发生（例如， 凹陷和侵蚀），并且可以降低相变记忆材料上的蚀刻速率，以提供高质量的抛光表面。 还提供了使用该浆料组合物来研磨相变存储器件的方法。

公开(公告)号：US08418342B2

公开(公告)日：2013-04-16

申请号：US12598111

申请日：2008-04-30

Applicant: Robert Dell ,  Chih-Shing Wei ,  Tae Young Lee

Inventor： Robert Dell ,  Chih-Shing Wei ,  Tae Young Lee

IPC: B23P11/02 ,  A41F1/00

CPC classification number: F16B2/02 ,  F16B2001/0092 ,  Y10T24/44 ,  Y10T29/49865 ,  Y10T29/49961

Abstract: The invention relates to bimetallic leaf spring devices (100) that are responsive to changes in temperature, and methods of constructing and utilizing such devices. In one embodiment, the invention includes a clamping apparatus including a first strip (110) of a first material and a second strip (120) of a second material. The second strip (120) may be attached to the first strip (110) at least two attachment locations. The second strip (120) may be spaced apart from the first strip (110) at least one section between the at least two attachment locations, and at least one of the first material and the second material may include a thermally expansive material.

Abstract translation: 本发明涉及响应温度变化的双金属片弹簧装置（100）以及构造和利用这些装置的方法。 在一个实施例中，本发明包括夹持装置，其包括第一材料的第一条带（110）和第二材料的第二条带（120）。 第二条带（120）可以至少两个附接位置附接到第一条带（110）。 第二条带（120）可以与第一条带（110）间隔开至少两个附接位置之间的至少一个部分，并且第一材料和第二材料中的至少一个可以包括热膨胀材料。

公开(公告)号：US20130045066A1

公开(公告)日：2013-02-21

申请号：US13542277

申请日：2012-07-05

Applicant: Jun Keun SONG ,  Tae Young LEE

Inventor： Jun Keun SONG ,  Tae Young LEE

IPC: B65G65/00

CPC classification number: H05K13/021 ,  H05K13/0434

Abstract: Provided are a tray feeder which provides parts to a part mounting device and parts providing method using the same. The tray feeder includes: a magazine which houses at least one tray for accommodating parts; an inserting/extracting member which inserts a tray into the magazine or extracts a tray from the magazine; a buffer member which is positioned above the magazine and supports a standby tray from which parts accommodated therein are to be mounted on a board by a part mounting device; and a feeding member which is positioned above the inserting/extracting member and provides a tray supported by the feeding member so that parts accommodated in the supported tray are adsorbed by the part mounting device, wherein the inserting/extracting member is elevated or lowered to insert a tray into the magazine or extract a tray from the magazine.

Abstract translation: 提供了一种向部件安装装置提供部件的托盘进给器以及使用其的部件提供方法。 托盘进料器包括：容纳至少一个用于容纳部件的托盘的盒子; 插入/取出构件，其将托盘插入到盒中或从盒中提取托盘; 缓冲构件，其位于所述盒的上方并且支撑备用托盘，容纳在其中的部件将通过部件安装装置安装在板上; 以及进给构件，其位于插入/取出构件上方，并且提供由进给构件支撑的托盘，使得容纳在支撑托盘中的部件被部件安装装置吸附，其中插入/取出构件被升高或降低以插入 托盘进入杂志或从杂志提取托盘。

公开(公告)号：US08291580B2

公开(公告)日：2012-10-23

申请号：US12582894

申请日：2009-10-21

Applicant: Tae-Young Lee

Inventor： Tae-Young Lee

IPC: B23P19/00 ,  B65H20/00

CPC classification number: H05K13/0417 ,  B65H20/32 ,  Y10T29/53 ,  Y10T29/53465

Abstract: A tape feeder for supplying components to a component mounter via a carrier tape on which the components are disposed at predetermined intervals, wherein the carrier tape and components are covered with a cover tape, is described. The tape feeder may comprise a frame including a receptacle. The receptacle may have an inlet port for receiving the cover tape separated from the carrier tape, a space for containing the cover tape received through the inlet port, and a door opening through which the cover tape is discharged. The tape feeder may additionally comprise a door configured to open or close the door opening and an opening/closing member configured to fasten the door closed and thereafter open the door when an inner pressure of at least a predetermined value is applied by the cover tape received in the receptacle.

Abstract translation: 描述了一种带式馈送器，用于经由其上以预定间隔布置组件的载带将部件提供给部件安装器，其中载带和部件被盖带覆盖。 带式给料器可以包括包括容器的框架。 容器可以具有用于接收从载带分离的盖带的入口端口，用于容纳通过入口端口容纳的盖带的空间，以及盖带从其中排出的门开口。 带式馈送器可以另外包括构造成打开或关闭门开口的门，以及打开/关闭构件，其构造成当所接收的盖带施加至少预定值的内部压力时将门闭合并且随后打开门 在容器中。

公开(公告)号：US08174513B2

公开(公告)日：2012-05-08

申请号：US10745465

申请日：2003-12-24

Applicant: Koichi Sono ,  Young-sun Kim ,  Tae-young Lee

Inventor： Koichi Sono ,  Young-sun Kim ,  Tae-young Lee

IPC: G09G5/00

CPC classification number: G09G3/2022 ,  G09G3/296 ,  G09G3/2965 ,  G09G2310/066

Abstract: An apparatus and method for driving a display panel, and more particularly, an apparatus and method for easily generating a programmable signal to drive a digital display panel without re-designing a drive signal generating apparatus according to the specifications of the digital display panel including its size, the number of scan lines, and types of input signals. The apparatus includes a memory, a decoder, and an output waveform generating circuit. The memory stores information to generate a plurality of drive pulse signals necessary for driving the display panel. The decoder reads information stored in an address assigned according to a predetermined control sequence from the memory and then edits the read information so as to be suitable for specifications of the display panel. The output waveform generating circuit generates drive pulse signals corresponding to the information read by the decoder.

Abstract translation: 更具体地，涉及一种用于容易地生成可编程信号以驱动数字显示面板的装置和方法，而不需要根据包括其的数字显示面板的规格重新设计驱动信号发生装置 尺寸，扫描线数量和输入信号的类型。 该装置包括存储器，解码器和输出波形发生电路。 存储器存储用于产生驱动显示面板所需的多个驱动脉冲信号的信息。 解码器从存储器读取根据预定控制序列分配的地址中存储的信息，然后编辑读取的信息，以适合于显示面板的规格。 输出波形发生电路产生与由解码器读取的信息相对应的驱动脉冲信号。

公开(公告)号：US08037588B2

公开(公告)日：2011-10-18

申请号：US12082032

申请日：2008-04-08

Applicant: Tae-Young Lee

Inventor： Tae-Young Lee

IPC: B25B27/14

CPC classification number: H05K13/0069 ,  Y10T29/5313 ,  Y10T29/53135 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53961 ,  Y10T29/53974

Abstract: A back-up table for a chip mounter. The back-up table for a chip mounter includes a base plate, a back-up plate spaced a predetermined distance from the base plate to support a back-up pin that supports a printed circuit board, and at least one set of link units installed between the base plate and the back-up plate and facing opposite to each other. The back-up table further comprises a first driving part installed between the opposite facing link units and operating the link units to raise and lower the back-up plate, and a second driving part serially connected to the first driving part.

Abstract translation: 芯片贴片机的备用桌。 用于芯片安装器的备用台包括基板，与基板隔开预定距离的支撑板，以支撑支撑印刷电路板的支撑销，以及安装有至少一组连接单元 在基板和支撑板之间并且彼此面对。 备用桌还包括安装在相对的相对的连杆单元之间的第一驱动部分，并且操作连杆单元以升高和降低支撑板;以及与第一驱动部分串联连接的第二驱动部。

公开(公告)号：US20110214286A1

公开(公告)日：2011-09-08

申请号：US13011048

申请日：2011-01-21

Applicant: Tae-Young Lee ,  Boo-Goan Choi

Inventor： Tae-Young Lee ,  Boo-Goan Choi

IPC: H05K3/30 ,  B23P19/00

CPC classification number: B23P19/00 ,  H05K3/30 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53187 ,  Y10T29/53252

Abstract: A head nozzle unit includes a pair of motion guides located parallel to each other, a pair of movable blocks disposed on the pair of motion guides and movable independently of each other, a guide member transversely connected to the pair of motion guides via the pair of movable blocks, a pair of head nozzle parts disposed on opposite lateral surfaces of the guide member, the pair of head nozzle parts movable independently of each other and operable to pick up and mount electronic parts, and a driver that moves the pair of movable blocks in cooperation with one another and that moves the pair of head nozzle parts in predetermined directions. Further, an apparatus and method for mounting electronic parts includes the head nozzle unit. The pair of head nozzle parts alternately and sequentially performs a series of mounting processes of picking up the electronic parts and mounting the picked up electronic parts.

Abstract translation: 头喷嘴单元包括彼此平行布置的一对运动引导件，一对可移动块，其设置在所述一对运动引导件上并且可彼此独立地移动;引导构件，其经由所述一对运动引导件横向地连接到所述一对运动引导件 可移动块，设置在引导构件的相对侧表面上的一对头喷嘴部分，一对头部喷嘴部分可彼此独立地移动并可操作以拾取和安装电子部件;以及驱动器，其将一对可移动块 彼此协作，并使预定方向的一对头部喷嘴部分移动。 此外，用于安装电子部件的装置和方法包括头喷嘴单元。 一对头喷嘴部件交替地并且顺序地执行拾取电子部件并安装拾取的电子部件的一系列安装处理。

公开(公告)号：US20100155920A1

公开(公告)日：2010-06-24

申请号：US12591820

申请日：2009-12-02

Applicant: Tae-young Lee

Inventor： Tae-young Lee

IPC: H01L25/065

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: Provided are a stacked-type semiconductor package using a stud bump, a semiconductor package module, and a method of fabricating the stacked-type semiconductor package. The stacked-type semiconductor package may include a first semiconductor package and a second semiconductor package stacked on the first semiconductor package. The first semiconductor package may include a first circuit board and at least one conductive member extending upward from the first circuit board. The second semiconductor package may include a second circuit board, and a stud bump being inserted from the second circuit board into the at least one conductive member of the first semiconductor package in order to electrically connect the first semiconductor package and the second semiconductor package.

Abstract translation: 提供了一种使用柱形凸块，半导体封装模块和制造叠层型半导体封装的方法的叠层型半导体封装。 层叠型半导体封装可以包括堆叠在第一半导体封装上的第一半导体封装和第二半导体封装。 第一半导体封装可以包括第一电路板和从第一电路板向上延伸的至少一个导电构件。 第二半导体封装可以包括第二电路板和从第二电路板插入到第一半导体封装的至少一个导电构件中的柱形凸块，以便电连接第一半导体封装和第二半导体封装。