公开(公告)号：US5141278A

公开(公告)日：1992-08-25

申请号：US658749

申请日：1991-02-21

申请人： Takao Iwata ,  Tetsuo Hotta

发明人： Takao Iwata ,  Tetsuo Hotta

IPC分类号： B60R13/04 ,  B60J1/02 ,  B60J1/20 ,  B60J10/00 ,  B60J10/02 ,  B60R1/04

CPC分类号： B60J1/2002 ,  B60J1/02 ,  B60J10/21 ,  B60J10/22 ,  B60J10/25 ,  B60J10/265 ,  B60J10/30 ,  B60J10/70

摘要： A window molding member for automobiles includes at least one upper segment and at least one side segment to extend along upper and side edges of a window plate, respectively, which are integrally and continuously connected with each other. The molding member comprises a main body having a section with a longitudinally variable width, which is engageable with the outer surface of the window plate with a cushion element therebetween. The cushion element may have a longitudinally variable thickness to form a weir along the side segment for preventing rain water on the window plate from flowing across the side segment to preserve driver's sight through a side window.

摘要翻译： 一种用于汽车的窗口模制构件包括至少一个上部段和至少一个侧部段，其分别沿着彼此一体地连续连接的窗板的上边缘和侧边缘延伸。 模制构件包括主体，其具有纵向可变宽度的部分，其可与窗板的外表面接合，在其间具有缓冲元件。 缓冲元件可以具有纵向可变的厚度，以沿着侧段形成堰，用于防止窗板上的雨水流过侧段，以通过侧窗保持驾驶员的视线。

公开(公告)号：US20140008255A1

公开(公告)日：2014-01-09

申请号：US14006393

申请日：2012-02-06

申请人： Takao Iwata

发明人： Takao Iwata

IPC分类号： B65D19/06

CPC分类号： B65D19/06 ,  B65D19/18 ,  B65D2519/00034 ,  B65D2519/00069 ,  B65D2519/00174 ,  B65D2519/00268 ,  B65D2519/00288 ,  B65D2519/00318 ,  B65D2519/00333 ,  B65D2519/00502 ,  B65D2519/00517 ,  B65D2519/00527 ,  B65D2519/00587 ,  B65D2519/00611 ,  B65D2519/00646 ,  B65D2519/00791 ,  B65D2519/009 ,  B65D2519/00975

摘要： To provide a box pallet side wall that is excellent in beauty and is easily cleaned as well compared to a conventional box pallet side wall, and in which weight saving and high strengthening is possible compared to the conventional one. This box pallet side wall forms a hollow structure having an enclosed space therein. Thus, compared to a conventional box pallet side wall having a solid structure, when the box pallet side wall and the conventional one have the same weight, the geometrical moment of inertia of the box pallet side wall is increased. Since cell configuration ribs for reinforcing an outer main plate and an inner main plate are housed in the box pallet side wall and not exposed outside, irregularity on an outer surface of the box pallet side wall can be decreased compared to the conventional one.

摘要翻译： 为了提供与传统的箱式货盘侧壁相比，美观性和易于清洁的盒式货盘侧壁，与现有的相比，可以减轻重量和高强度。 该盒托板侧壁形成在其中具有封闭空间的中空结构。 因此，与具有实心结构的传统的箱式货盘侧壁相比，当箱式货盘侧壁和常规货箱侧壁具有相同的重量时，箱式货盘侧壁的几何惯性力矩增加。 由于用于加强外主板和内主板的单元构造肋被容纳在箱托板侧壁中并且不暴露在外部，所以与常规侧板相比，可以减小箱托板侧壁的外表面的不规则性。

公开(公告)号：US07927919B1

公开(公告)日：2011-04-19

申请号：US12630623

申请日：2009-12-03

申请人： Wen-Jeng Fan ,  Li-Chih Fang ,  Ronald Takao Iwata

发明人： Wen-Jeng Fan ,  Li-Chih Fang ,  Ronald Takao Iwata

IPC分类号： H01L21/00

CPC分类号： H01L23/3128 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/525 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/731 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12044 ,  H01L2924/15192 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor packaging method without an interposer is revealed. A mother chip is a two-layer structure consisting of a semiconductor layer and an organic layer where a redistribution layer is embedded into the organic layer with a plurality of first terminals and a plurality of second terminals disposed on the redistribution layer and exposed from the organic layer. The mother chip is flip-chip mounted on the substrate. The active surface of the daughter chip is in contact with the organic layer with the bonding pads of the daughter chip bonded to the first terminals. Furthermore, a plurality of electrically connecting components electrically connect the second terminals to the substrate. In the multi-chip stacked package, the interposer can be eliminated with a thinner overall package thickness as well as controlled package warpage.

摘要翻译： 揭示了没有插入器的半导体封装方法。 母芯片是由半导体层和有机层组成的两层结构，其中再分布层被嵌入到有机层中，多个第一端子和多个第二端子设置在再分配层上并从有机层暴露出来 层。 母芯片倒装芯片安装在基板上。 子芯片的有源面与有机层接触，子芯片的接合焊盘与第一端子接合。 此外，多个电连接部件将第二端子电连接到基板。 在多芯片堆叠封装中，可以以更薄的整体封装厚度以及受控的封装翘曲消除中介层。

公开(公告)号：US20080087999A1

公开(公告)日：2008-04-17

申请号：US11581085

申请日：2006-10-16

申请人： Ronald Takao Iwata

发明人： Ronald Takao Iwata

IPC分类号： H01L23/00

CPC分类号： H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A micro BGA package comprises a first chip, a second chip, a single-layer PCB, a plurality of bonding wires, an encapsulant and a plurality of solder balls. The second chip is smaller than the first chip in size and stacked on the active surface of the first surface by facing the same direction with the first chip without covering the bonding pads of the first chip. The single-layer PCB is disposed on the second chip and smaller than the second chip in size. The single-layer PCB has a single-layer wiring pattern including a plurality of wire-connecting pads and a plurality of ball pads. By wire-bonding method, the first and second chips are electrically connected to the wire-connecting pads. The encapsulant is formed around the first chip, the second chip and the single-layer PCB to seal the bonding wires but exposes the rear surface of the first chip and the solder balls. The solder balls are disposed on the ball pads. Accordingly, the micro BGA package may reduce package size of multi-chip stack and improve thermal dissipation without increasing package thickness.

摘要翻译： 微BGA封装包括第一芯片，第二芯片，单层PCB，多个接合线，密封剂和多个焊球。 第二芯片尺寸小于第一芯片，并且通过面向与第一芯片相同的方向堆叠在第一表面的有源表面上，而不覆盖第一芯片的焊盘。 单层PCB设置在第二芯片上并且小于第二芯片的尺寸。 单层PCB具有包括多个线连接焊盘和多个焊盘的单层布线图案。 通过引线接合方法，第一和第二芯片电连接到导线连接焊盘。 密封剂形成在第一芯片，第二芯片和单层PCB周围，以密封接合线，但暴露第一芯片和焊球的后表面。 焊球设置在球垫上。 因此，微BGA封装可以减小多芯片堆叠的封装尺寸，并且在不增加封装厚度的情况下改善热耗散。

公开(公告)号：US20100167534A1

公开(公告)日：2010-07-01

申请号：US12722251

申请日：2010-03-11

申请人： Ronald Takao IWATA

发明人： Ronald Takao IWATA

IPC分类号： H01L21/768

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/78 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/78301 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2224/451 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

摘要： A semiconductor device with TSV and its fabrication method are revealed. The semiconductor device primarily comprises a chip and a flexible metal wire inside. A redistributed trace layer and a passivation layer are formed on the active surface of the chip. A through hole penetrates the chip from the active surface to the back surface, in which an insulation layer is disposed. The flexible metal wire has a first terminal and a second terminal where the first terminal is bonded to a redistributed pad of the redistributed trace layer and the second terminal passes through the through hole and protrudes from the back surface of the chip. Therefore, the flexible metal wire passing through the chip has two protruded integral terminals to achieve high stress resistance TSV with lower costs for good electrical connections of vertical stacking chips.

摘要翻译： 揭示了具有TSV的半导体器件及其制造方法。 半导体器件主要包括芯片和内部的柔性金属线。 在芯片的有源表面上形成再分布的迹线层和钝化层。 通孔从活性表面穿透芯片到背面，其中设置绝缘层。 柔性金属线具有第一端子和第二端子，其中第一端子接合到再分布的迹线层的重新分布的焊盘，并且第二端子穿过通孔并从芯片的后表面突出。 因此，穿过芯片的柔性金属线具有两个突出的集成端子，以实现高应力阻力TSV，具有较低的成本，用于垂直堆叠芯片的良好电连接。

公开(公告)号：US07054334B2

公开(公告)日：2006-05-30

申请号：US09918537

申请日：2001-08-01

申请人： Yoshimi Nakagawa ,  Satoko Araki ,  Takao Iwata ,  Takeshi Sato ,  Keiji Usuba

发明人： Yoshimi Nakagawa ,  Satoko Araki ,  Takao Iwata ,  Takeshi Sato ,  Keiji Usuba

IPC分类号： H04J3/16 ,  H04L12/28 ,  H04L12/56

CPC分类号： H04L41/0213 ,  H04J3/14 ,  H04J2203/0057 ,  H04J2203/0071 ,  H04L41/0226 ,  H04L41/22 ,  H04Q3/0066 ,  H04Q2213/13076 ,  H04Q2213/13199 ,  H04Q2213/13332 ,  H04Q2213/13349 ,  H04Q2213/13367

摘要： The invention has an object of enhancing the service capacity and the operability of a network and simplifying the maintenance and control of the network by adopting a size automatic change mode after a path is set and providing arbitrary pathsize at arbitrary time. To achieve the object, the following means is provided. The service capacity and the operability of a network are enhanced and the maintenance and control of the network are simplified by adopting a size automatic change mode that the size of an input path signal conforms to information written to line overhead H1 and H2 bytes and an output path signal is transmitted with the pathsize the same as the size of the input path signal. A case that receiving path size changes exceeding a band and the fault of a path is caused occurs by providing both modes of fixing pathsize and automating pathsize to a user, flexibly corresponding to various service and automatically changing pathsize. At this time, an operation system identifies the cause, analyzes an influenced range and realizes the simplification of the maintenance and control of the network.

公开(公告)号：US09242761B2

公开(公告)日：2016-01-26

申请号：US14006393

申请日：2012-02-06

申请人： Takao Iwata

发明人： Takao Iwata

IPC分类号： B65D19/06 ,  B65D19/18

CPC分类号： B65D19/06 ,  B65D19/18 ,  B65D2519/00034 ,  B65D2519/00069 ,  B65D2519/00174 ,  B65D2519/00268 ,  B65D2519/00288 ,  B65D2519/00318 ,  B65D2519/00333 ,  B65D2519/00502 ,  B65D2519/00517 ,  B65D2519/00527 ,  B65D2519/00587 ,  B65D2519/00611 ,  B65D2519/00646 ,  B65D2519/00791 ,  B65D2519/009 ,  B65D2519/00975

摘要： To provide a box pallet side wall that is excellent in beauty and is easily cleaned as well compared to a conventional box pallet side wall, and in which weight saving and high strengthening is possible compared to the conventional one. This box pallet side wall forms a hollow structure having an enclosed space therein. Thus, compared to a conventional box pallet side wall having a solid structure, when the box pallet side wall and the conventional one have the same weight, the geometrical moment of inertia of the box pallet side wall is increased. Since cell configuration ribs for reinforcing an outer main plate and an inner main plate are housed in the box pallet side wall and not exposed outside, irregularity on an outer surface of the box pallet side wall can be decreased compared to the conventional one.

摘要翻译： 为了提供与传统的箱式货盘侧壁相比，美观性和易于清洁的盒式货盘侧壁，与现有的相比，可以减轻重量和高强度。 该盒托板侧壁形成在其中具有封闭空间的中空结构。 因此，与具有实心结构的传统的箱式货盘侧壁相比，当箱式货盘侧壁和常规货箱侧壁具有相同的重量时，箱式货盘侧壁的几何惯性力矩增加。 由于用于加强外主板和内主板的单元构造肋被容纳在箱托板侧壁中并且不暴露在外部，所以与常规侧板相比，可以减小箱托板侧壁的外表面的不规则性。

公开(公告)号：US20090127667A1

公开(公告)日：2009-05-21

申请号：US11984785

申请日：2007-11-21

申请人： Ronald Takao Iwata

发明人： Ronald Takao Iwata

IPC分类号： H01L23/48 ,  H01L21/304

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/78 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/1134 ,  H01L2224/11901 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/136 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/78301 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2224/451 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

摘要： A semiconductor device with TSV and its fabrication method are revealed. The semiconductor device primarily comprises a chip and a flexible metal wire inside. A redistributed trace layer and a passivation layer are formed on the active surface of the chip. A through hole penetrates the chip from the active surface to the back surface, in which an insulation layer is disposed. The flexible metal wire has a first terminal and a second terminal where the first terminal is bonded to a redistributed pad of the redistributed trace layer and the second terminal passes through the through hole and protrudes from the back surface of the chip. Therefore, the flexible metal wire passing through the chip has two protruded integral terminals to achieve high stress resistance TSV with lower costs for good electrical connections of vertical stacking chips.

摘要翻译： 揭示了具有TSV的半导体器件及其制造方法。 半导体器件主要包括芯片和内部的柔性金属线。 在芯片的有源表面上形成再分布的迹线层和钝化层。 通孔从活性表面穿透芯片到背面，其中设置绝缘层。 柔性金属线具有第一端子和第二端子，其中第一端子接合到再分布的迹线层的重新分布的焊盘，并且第二端子穿过通孔并从芯片的后表面突出。 因此，穿过芯片的柔性金属线具有两个突出的集成端子，以实现高应力阻力TSV，具有较低的成本，用于垂直堆叠芯片的良好电连接。

公开(公告)号：US20080088005A1

公开(公告)日：2008-04-17

申请号：US11581084

申请日：2006-10-16

申请人： Ronald Takao Iwata

发明人： Ronald Takao Iwata

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/13 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A SIP package with a small dimension integrates one or more small size chips. The small size chips are disposed on a back side of a carrying chip and are encapsulated by an encapsulant. The SIP package further includes a substrate having a slot, an encapsulant and a plurality of bonding wires. The carrying chip is disposed on the substrate and the bonding pads of the carrying chip are aligned within the slot. A back side pattern is formed on the back side of the carrying chip. The chip-attached area of the small size chips is smaller than half of that of the back side of the carrying chip. Besides, the back side pattern is connected with a plurality of transfer fingers or a plurality of PTHs at the periphery of the back side for electrically connecting the small size chips to the substrate. Accordingly, the bonding wires used for connecting the small size chips can be shortened and regulated to achieve miniaturization of SIP package without increasing package size and thickness.

摘要翻译： 具有小尺寸的SIP封装集成了一个或多个小尺寸芯片。 小尺寸芯片设置在承载芯片的背面并且由密封剂封装。 SIP封装还包括具有槽的衬底，密封剂和多个接合线。 承载芯片设置在基板上，并且承载芯片的接合焊盘在槽内对准。 背面图案形成在承载芯片的背面。 小尺寸芯片的芯片附着面积小于载体芯片背面的一半。 此外，背面图案与背侧的周边处的多个传送指状物或多个PTH连接，用于将小尺寸的芯片电连接到基板。 因此，可以缩短和调节用于连接小尺寸芯片的接合线，以实现SIP封装的小型化，而不增加封装尺寸和厚度。

公开(公告)号：US5009460A

公开(公告)日：1991-04-23

申请号：US426779

申请日：1989-10-26

申请人： Takao Iwata ,  Tetsuo Hotta

发明人： Takao Iwata ,  Tetsuo Hotta

IPC分类号： B60R13/04 ,  B60J1/02 ,  B60J1/20 ,  B60J10/00 ,  B60J10/02 ,  B60R1/04

CPC分类号： B60J1/2002 ,  B60J1/02 ,  B60J10/21 ,  B60J10/22 ,  B60J10/25 ,  B60J10/265 ,  B60J10/30 ,  B60J10/70

摘要： A window molding member for automobiles includes at least one upper segment and at least one side segment to extend along upper and side edges of a window plate, respectively, which are integrally and continuously connected with each other. The molding member comprises a main body having a section with a longitudinally variable width, which is engageable with the outer surface of the window plate with a cushion element therebetween. The cushion element may have a longitudinally variable thickness to form a weir along the side segment for preventing rain water on the window plate from flowing across the side segment to preserve driver's sight through a side window.

摘要翻译： 一种用于汽车的窗口模制构件包括至少一个上部段和至少一个侧部段，其分别沿着彼此一体地连续连接的窗板的上边缘和侧边缘延伸。 模制构件包括主体，其具有纵向可变宽度的部分，其可与窗板的外表面接合，在其间具有缓冲元件。 缓冲元件可以具有纵向可变的厚度，以沿着侧段形成堰，用于防止窗板上的雨水流过侧段，以通过侧窗保持驾驶员的视线。