-
1.发明申请THERMOFORMABLE POLYMER THICK FILM SILVER CONDUCTOR AND ITS USE IN CAPACITIVE SWITCH CIRCUITS 审中-公开热稳定聚合物厚膜导体及其在电容式开关电路中的应用公开(公告)号：US20130068512A1
公开(公告)日：2013-03-21
申请号：US13471950
申请日：2012-05-15
申请人： JAY ROBERT DORFMAN , Vince Arancio
发明人： JAY ROBERT DORFMAN , Vince Arancio
CPC分类号： H01G4/008 , C08G2650/56 , C08K3/08 , C08L71/00 , C08L75/04 , H01B1/22 , H03K17/962 , H03K2017/9602 , H05K1/095 , H05K2201/0129 , H05K2201/0245 , H05K2201/10053
摘要： This invention is directed to a polymer thick film conductive composition. More specifically, the polymer thick film conductive composition may be used in applications where thermoforming of the base substrate occurs as in capacitive switches. Polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer. Thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition.
摘要翻译： 本发明涉及聚合物厚膜导电组合物。 更具体地，聚合物厚膜导电组合物可用于如电容开关中发生基底衬底的热成型的应用中。 通常使用聚碳酸酯基材作为基材，并且可以使用聚合物厚膜导电组合物而没有任何阻挡层。 可热成型电路从干燥的聚合物厚膜导电组合物上存在密封剂层获益。
-
公开(公告)号：US09034417B2
公开(公告)日：2015-05-19
申请号：US13589564
申请日：2012-08-20
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
IPC分类号： C23C24/00 , H01L31/0224 , B23K35/26 , B29C67/04 , C08K3/08 , C08L27/08 , C08L35/04 , C22C13/00 , H01B1/22 , B22F7/08 , B23K35/30 , B23K35/36 , H05K1/09 , H05K3/10 , H05K3/12 , C09D11/52 , C22C12/00 , C22C1/04 , H05K1/03
CPC分类号： H01B1/22 , B22F7/08 , B22F2998/10 , B23K35/26 , B23K35/262 , B23K35/3006 , B23K35/3613 , B29C67/04 , C08K3/08 , C08L27/08 , C08L35/04 , C09D5/24 , C09D11/102 , C09D11/52 , C22C1/0483 , C22C12/00 , C22C13/00 , H01B13/0016 , H01B13/003 , H01B13/30 , H01L31/0224 , H01L31/022425 , H05K1/0346 , H05K1/095 , H05K3/10 , H05K3/106 , H05K3/12 , H05K3/1283 , H05K2201/0305 , H05K2203/0783 , H05K2203/1131 , Y02E10/50 , B22F1/0059 , B22F3/10
摘要： This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.
摘要翻译： 本发明提供一种使用聚合物厚膜导体组合物在电路中形成电导体的方法，该方法使沉积的厚膜导体组合物进行光子烧结。 本发明还提供一种降低由聚合物厚膜导体组合物形成的电导体的电阻的方法，该方法包括对电导体进行光子烧结的步骤。 本发明还提供了包含由这些方法制成的电导体的装置。
-
3.发明授权公开(公告)号：US08575260B2
公开(公告)日：2013-11-05
申请号：US13308622
申请日：2011-12-01
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
CPC分类号： H05B3/12 , B60N2/5685 , C08L27/16 , C08L33/12 , C09D127/16 , H01C1/034 , H01C7/02 , H05B2203/02 , C08L2666/04
摘要： The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.
摘要翻译： 本发明涉及包含溶解在有机溶剂中的热塑性含氟聚合物树脂和丙烯酸树脂的聚合物厚膜包封组合物。 沉积的密封剂组合物在足以除去所有溶剂并形成密封剂的时间和能量下进行处理。 本发明进一步涉及使用密封剂组合物在PTC加热器电路中形成密封剂，特别是在镜面加热器和座椅加热器应用中的PTC加热器电路中。
-
4.发明授权公开(公告)号：US08093328B2
公开(公告)日：2012-01-10
申请号：US12764185
申请日：2010-04-21
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
CPC分类号： H05B3/12 , B60N2/5685 , C08L27/16 , C08L33/12 , C09D127/16 , H01C1/034 , H01C7/02 , H05B2203/02 , C08L2666/04
摘要： The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.
摘要翻译： 本发明涉及包含溶解在有机溶剂中的热塑性含氟聚合物树脂和丙烯酸树脂的聚合物厚膜包封组合物。 沉积的密封剂组合物在足以除去所有溶剂并形成密封剂的时间和能量下进行处理。 本发明进一步涉及使用密封剂组合物在PTC加热器电路中形成密封剂，特别是在镜面加热器和座椅加热器应用中的PTC加热器电路中。
-
公开(公告)号：US20140048751A1
公开(公告)日：2014-02-20
申请号：US13589564
申请日：2012-08-20
申请人： VINCE ARANCIO , JAY ROBERT DORFMAN
发明人： VINCE ARANCIO , JAY ROBERT DORFMAN
CPC分类号： H01B1/22 , B22F7/08 , B22F2998/10 , B23K35/26 , B23K35/262 , B23K35/3006 , B23K35/3613 , B29C67/04 , C08K3/08 , C08L27/08 , C08L35/04 , C09D5/24 , C09D11/102 , C09D11/52 , C22C1/0483 , C22C12/00 , C22C13/00 , H01B13/0016 , H01B13/003 , H01B13/30 , H01L31/0224 , H01L31/022425 , H05K1/0346 , H05K1/095 , H05K3/10 , H05K3/106 , H05K3/12 , H05K3/1283 , H05K2201/0305 , H05K2203/0783 , H05K2203/1131 , Y02E10/50 , B22F1/0059 , B22F3/10
摘要： This invention provides a method for using a polymer thick film conductor composition to form an electrical conductor in an electrical circuit, the method subjecting the deposited thick film conductor composition to photonic sintering. The invention also provides a method for reducing the resistance of an electrical conductor formed from a polymer thick film conductor composition, the method comprising the step of subjecting the electrical conductor to photonic sintering. The invention further provides devices containing electrical conductors made by these methods.
摘要翻译： 本发明提供一种使用聚合物厚膜导体组合物在电路中形成电导体的方法，该方法使沉积的厚膜导体组合物进行光子烧结。 本发明还提供一种降低由聚合物厚膜导体组合物形成的电导体的电阻的方法，该方法包括对电导体进行光子烧结的步骤。 本发明还提供了包含由这些方法制成的电导体的装置。
-
公开(公告)号：US20130056537A1
公开(公告)日：2013-03-07
申请号：US13225873
申请日：2011-09-06
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
CPC分类号： H01Q1/2225 , C08L75/04 , G06K19/02 , G06K19/0723 , H05K1/165 , H05K3/1208 , H05K3/285 , H05K3/386
摘要： This invention is directed to a polymer thick film barrier layer dielectric composition. Dielectrics made from the composition can be used in various electronic applications to protect electrical elements and particularly to insulate and protect both the conductive silver antenna above it and the polycarbonate substrate below it in RFID applications.
摘要翻译： 本发明涉及聚合物厚膜阻挡层电介质组合物。 由组合物制成的电介质可用于各种电子应用中以保护电气元件，特别是在RFID应用中绝缘并保护其上方的导电银天线和其下方的聚碳酸酯基底。
-
7.发明申请公开(公告)号：US20120067867A1
公开(公告)日：2012-03-22
申请号：US13308622
申请日：2011-12-01
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
IPC分类号： H05B1/00
CPC分类号： H05B3/12 , B60N2/5685 , C08L27/16 , C08L33/12 , C09D127/16 , H01C1/034 , H01C7/02 , H05B2203/02 , C08L2666/04
摘要： The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and , in particular, in PTC heater circuitry in mirror heater and seat heater applications.
摘要翻译： 本发明涉及包含溶解在有机溶剂中的热塑性含氟聚合物树脂和丙烯酸树脂的聚合物厚膜包封组合物。 沉积的密封剂组合物在足以除去所有溶剂并形成密封剂的时间和能量下进行处理。 本发明进一步涉及使用密封剂组合物在PTC加热器电路中形成密封剂，特别是在镜面加热器和座椅加热器应用中的PTC加热器电路中。
-
8.发明申请公开(公告)号：US20110263781A1
公开(公告)日：2011-10-27
申请号：US12764185
申请日：2010-04-21
申请人： Vince Arancio , Jay Robert Dorfman
发明人： Vince Arancio , Jay Robert Dorfman
IPC分类号： C08L27/16
CPC分类号： H05B3/12 , B60N2/5685 , C08L27/16 , C08L33/12 , C09D127/16 , H01C1/034 , H01C7/02 , H05B2203/02 , C08L2666/04
摘要： The invention is directed to a polymer thick film encapsulant composition comprising thermoplastic fluoropolymer resin and acrylic resin dissolved in organic solvents. The deposited encapsulant composition is processed at a time and energy sufficient to remove all solvent and form an encapsulant. The invention is further directed to using the encapsulant composition to form an encapsulant in PTC heater circuitry and, in particular, in PTC heater circuitry in mirror heater and seat heater applications.
摘要翻译： 本发明涉及包含溶解在有机溶剂中的热塑性含氟聚合物树脂和丙烯酸树脂的聚合物厚膜包封组合物。 沉积的密封剂组合物在足以除去所有溶剂并形成密封剂的时间和能量下进行处理。 本发明进一步涉及使用密封剂组合物在PTC加热器电路中形成密封剂，特别是在镜面加热器和座椅加热器应用中的PTC加热器电路中。
-
-
-
-
-
-
-
搜索结果
8 条记录 (耗时 0.01 秒)
