公开(公告)号：US07519246B2

公开(公告)日：2009-04-14

申请号：US11869420

申请日：2007-10-09

Applicant: David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr. ,  Marco E. Sosa

Inventor： David F. Welch ,  Vincent G. Dominic ,  Fred A. Kish, Jr. ,  Mark J. Missey ,  Radhakrishnan L. Nagarajan ,  Atul Mathur ,  Frank H. Peters ,  Robert B. Taylor ,  Matthew L. Mitchell ,  Alan C. Nilsson ,  Stephen G. Grubb ,  Richard P. Schneider ,  Charles H. Joyner ,  Jonas Webjorn ,  Ting-Kuang Chiang ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr. ,  Marco E. Sosa

IPC: G02B6/12

CPC classification number: G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0612 ,  H01S5/12 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04J14/02

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract translation: 一种包括调制源阵列的光子集成电路（PIC）芯片，每个调制源提供在不同于其它调制源的信道波长的信道波长处的调制信号输出，以及具有光耦合到接收到的所有信号输出的输入的波长选择性组合器 并从芯片提供输出波导上的组合输出信号。 调制源，组合器和输出波导均集成在同一芯片上。

公开(公告)号：US07062114B2

公开(公告)日：2006-06-13

申请号：US10852988

申请日：2004-05-25

Applicant: Jonas Webjorn ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr.

Inventor： Jonas Webjorn ,  Robert Grencavich ,  Vinh D. Nguyen ,  Donald J. Pavinski, Jr.

IPC: G02B6/12

CPC classification number: G02B6/12011 ,  B82Y20/00 ,  G01R31/31728 ,  G01R31/318511 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/12019 ,  G02B6/12021 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/131 ,  G02B6/136 ,  G02B6/4204 ,  G02F1/01725 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/69 ,  H01L31/125 ,  H01S5/0014 ,  H01S5/0085 ,  H01S5/02248 ,  H01S5/026 ,  H01S5/0262 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/06832 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/3408 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/2914 ,  H04B10/50 ,  H04J14/02 ,  H04J14/0246 ,  H04J14/025 ,  H04J14/0258 ,  H04J14/0265 ,  H04J14/0276 ,  H04J14/0282

Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

Abstract translation: 具有形成在芯片的主表面上的多个电光部件的光子集成电路（PIC）芯片和包括在芯片的主表面上延伸的基板的基板，该基板在基板和主体之间形成气隙 表面，基板支持电引线，用于电连接到芯片主表面上的一些电光元件。