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Patent Agency Ranking
1.发明授权Circuit materials with improved bond, method of manufacture thereof, and articles formed therefrom 有权具有改进粘结的电路材料，其制造方法和由其形成的制品公开(公告)号：US08722192B2
公开(公告)日：2014-05-13
申请号：US13649333
申请日：2012-10-11
Applicant: World Properties, Inc
Inventor： Sankar K. Paul
CPC classification number: C09J107/00 , B32B7/12 , B32B15/14 , C08L15/00 , C08L19/006 , C08L71/12 , C08L71/126 , C08L2666/08 , C08L2666/14 , C09J171/12 , H05K1/0393 , H05K3/386 , H05K2201/0133 , H05K2201/0158 , H05K2201/0355 , Y10T428/273 , Y10T428/2804 , Y10T428/2878 , Y10T428/2883 , Y10T428/31511 , Y10T428/31696 , Y10T428/31855
Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
Abstract translation: 一种电路材料，包括导电金属层或介电电路衬底层和设置在导电金属层或介电衬底层上的粘合剂层，其中粘合剂包括聚（亚芳基醚）和聚丁二烯或聚异戊二烯聚合物。
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公开(公告)号：US5506049C1
公开(公告)日：2001-05-29
申请号：US17719893
申请日：1993-12-30
Applicant: WORLD PROPERTIES INC
Inventor： SWEI GWO S , ARTHUR DAVID J
IPC: B29C41/28 , B29D7/01 , C08J3/00 , C08J3/215 , C08J9/26 , H05K1/03 , H05K1/05 , H05K3/38 , B32B5/16
CPC classification number: C08J9/26 , B29C41/28 , B29D7/01 , B29K2027/18 , B29K2105/04 , B29K2105/16 , C08J3/005 , C08J3/215 , C08J2327/12 , H05K1/034 , H05K1/0373 , H05K1/056 , H05K3/386 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0239 , Y02P20/582 , Y10S428/901 , Y10T428/25 , Y10T428/252 , Y10T428/264
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公开(公告)号：US5384181B1
公开(公告)日：2000-06-13
申请号：US13187093
申请日：1993-10-05
Applicant: WORLD PROPERTIES INC
Inventor： ARTHUR DAVID J , SWEI GWO S , HORN ALLEN F III , KILHENNY BRETT
CPC classification number: H05K1/0373 , C08K9/06 , H01B3/445 , H01L23/145 , H01L2924/0002 , H05K1/034 , H05K1/0366 , H05K1/056 , H05K3/389 , H05K3/4626 , H05K2201/015 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/0251 , H05K2201/068 , Y10S428/901 , Y10T428/24802 , Y10T428/252 , Y10T428/259 , Y10T428/2995 , Y10T428/3154 , Y10T428/31544 , Y10T428/31663 , Y10T428/31692 , C08L27/12 , H01L2924/00
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4.发明申请CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF, AND ARTICLES FORMED THEREFROM 有权具有改进粘合剂的电路材料，其制造方法及其形成的制品公开(公告)号：US20130034725A1
公开(公告)日：2013-02-07
申请号：US13649333
申请日：2012-10-11
Applicant: World Properties, Inc.
Inventor： Sankar K. Paul
IPC: B32B7/12 , B32B15/06 , B32B33/00 , B32B15/085
CPC classification number: C09J107/00 , B32B7/12 , B32B15/14 , C08L15/00 , C08L19/006 , C08L71/12 , C08L71/126 , C08L2666/08 , C08L2666/14 , C09J171/12 , H05K1/0393 , H05K3/386 , H05K2201/0133 , H05K2201/0158 , H05K2201/0355 , Y10T428/273 , Y10T428/2804 , Y10T428/2878 , Y10T428/2883 , Y10T428/31511 , Y10T428/31696 , Y10T428/31855
Abstract: A circuit material, comprising a conductive metal layer or a dielectric circuit substrate layer and an adhesive layer disposed on the conductive metal layer or the dielectric substrate layer, wherein the adhesive comprises a poly(arylene ether) and a polybutadiene or polyisoprene polymer.
Abstract translation: 一种电路材料，包括导电金属层或介电电路衬底层和设置在导电金属层或介电衬底层上的粘合剂层，其中粘合剂包括聚（亚芳基醚）和聚丁二烯或聚异戊二烯聚合物。
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公开(公告)号：US5312576B1
公开(公告)日：2000-04-18
申请号：US70498391
申请日：1991-05-24
Applicant: WORLD PROPERTIES INC
Inventor： SWEI GWO S , ARTHUR DAVID J
IPC: B29C41/28 , B29D7/01 , C08J3/00 , C08J3/215 , C08J9/26 , H05K1/03 , H05K1/05 , H05K3/38 , B29C39/00 , B32B27/00
CPC classification number: C08J9/26 , B29C41/28 , B29D7/01 , B29K2027/18 , B29K2105/04 , B29K2105/16 , B29K2995/0006 , C08J3/005 , C08J3/215 , C08J2327/12 , H05K1/034 , H05K1/0373 , H05K1/056 , H05K3/386 , H05K2201/015 , H05K2201/0209 , H05K2201/0212 , H05K2201/0215 , H05K2201/0239 , Y02P20/582
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