Flat profile structures for bipolar transistors
    2.
    发明授权
    Flat profile structures for bipolar transistors 有权
    双极晶体管的平面结构

    公开(公告)号:US07541624B2

    公开(公告)日:2009-06-02

    申请号:US10624038

    申请日:2003-07-21

    IPC分类号: H01L21/00

    摘要: A method for fabricating a bipolar transistor includes forming collector, base, and emitter semiconductor layers on a substrate such that the layers form a vertical sequence with respect to an adjacent surface of the substrate. The method includes etching away a portion of a top one of the semiconductor layers to expose a portion of the base semiconductor layer and then, growing semiconductor on the exposed portion of the base layer. The top one of the semiconductor layers is the layer of the sequence that is located farthest from the substrate. The growing causes grown semiconductor to laterally surround a vertical portion of the top one of the semiconductor layers.

    摘要翻译: 制造双极晶体管的方法包括在基板上形成集电极,基极和发射极半导体层,使得这些层相对于基板的相邻表面形成垂直的顺序。 该方法包括蚀刻远离半导体层顶部的一部分以露出基底半导体层的一部分,然后在基底层的暴露部分上生长半导体。 半导体层中的顶部之一是距离衬底最远的序列层。 生长的原因使半导体横向围绕半导体层的顶部的垂直部分。

    Flat profile structures for bipolar transistors
    6.
    发明申请
    Flat profile structures for bipolar transistors 有权
    双极晶体管的平面结构

    公开(公告)号:US20050032323A1

    公开(公告)日:2005-02-10

    申请号:US10624038

    申请日:2003-07-21

    摘要: A method for fabricating a bipolar transistor includes forming collector, base, and emitter semiconductor layers on a substrate such that the layers form a vertical sequence with respect to an adjacent surface of the substrate. The method includes etching away a portion of a top one of the semiconductor layers to expose a portion of the base semiconductor layer and then, growing semiconductor on the exposed portion of the base layer. The top one of the semiconductor layers is the layer of the sequence that is located farthest from the substrate. The growing causes grown semiconductor to laterally surround a vertical portion of the top one of the semiconductor layers.

    摘要翻译: 制造双极晶体管的方法包括在基板上形成集电极,基极和发射极半导体层,使得这些层相对于基板的相邻表面形成垂直的顺序。 该方法包括蚀刻远离半导体层顶部的一部分以露出基底半导体层的一部分,然后在基底层的暴露部分上生长半导体。 半导体层中的顶部之一是距离衬底最远的序列层。 生长的原因使半导体横向围绕半导体层顶部的垂直部分。