公开(公告)号：US08106724B1

公开(公告)日：2012-01-31

申请号：US12508257

申请日：2009-07-23

申请人： Ye Wang ,  Seungbae Lee ,  Harmeet Bhugra

发明人： Ye Wang ,  Seungbae Lee ,  Harmeet Bhugra

IPC分类号： H03H9/00 ,  H01L41/08

CPC分类号： H03H9/2463 ,  H03H2009/02251 ,  H03H2009/0244 ,  H03H2009/241

摘要： Micro-electromechanical acoustic resonators include a substrate having a cavity therein and a resonator body suspended over the cavity. The resonator body is anchored on opposing sides thereof (by support beams) to first and second portions of the substrate. These first and second portions of the substrate, which extend over the cavity as first and second ledges, respectively, each have at least one perforation therein disposed over the cavity. These perforations may be open or filled. The first and second ledges are formed of a first material (e.g., silicon) and the first and second ledges are filled with a second material having a relatively high acoustic impedance relative to the first material. This second material may include a material selected from a group consisting of tungsten (W), copper (Cu), molybdenum (Mo).

摘要翻译： 微机电声谐振器包括其中具有空腔的基板和悬在空腔上的谐振器体。 谐振器主体被固定在基板的第一和第二部分的相对侧（通过支撑梁）上。 基板的这些第一和第二部分分别在第一和第二凸缘之上延伸到空腔上，每个在其上设置有至少一个穿孔。 这些穿孔可以是开放的或填充的。 第一和第二凸缘由第一材料（例如硅）形成，并且第一和第二凸缘由相对于第一材料具有相对较高的声阻抗的第二材料填充。 该第二材料可以包括选自钨（W），铜（Cu），钼（Mo）的材料。

公开(公告)号：US07871857B1

公开(公告)日：2011-01-18

申请号：US12240292

申请日：2008-09-29

申请人： Kuolung Lei ,  Harmeet Bhugra

发明人： Kuolung Lei ,  Harmeet Bhugra

IPC分类号： H01L21/00 ,  H01L23/02 ,  H05K1/14

CPC分类号： H01L21/78 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/94 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/051 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/11462 ,  H01L2224/11901 ,  H01L2224/11914 ,  H01L2224/13011 ,  H01L2224/13082 ,  H01L2224/13101 ,  H01L2224/13117 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/81097 ,  H01L2224/81141 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/81899 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00

摘要： Methods of forming multi-chip semiconductor substrates include forming a first plurality of dicing streets in a first surface of a first semiconductor wafer having a first plurality of bonding sites thereon and forming a second plurality of dicing streets in a first surface of a second semiconductor wafer having a second plurality of bonding sites thereon. The first surfaces of the first and second semiconductor wafers are bonded together so that the first plurality of dicing streets are aligned with the second plurality of dicing streets and the first plurality of bonding sites are matingly received and permanently affixed within the second plurality of bonding sites. A plurality of bonded pairs of semiconductor chips are then formed by planarizing the second surface of the second semiconductor wafer until the second plurality of dicing streets are exposed.

摘要翻译： 形成多芯片半导体衬底的方法包括在其上具有第一多个结合位置的第一半导体晶片的第一表面中形成第一多个切割街道，并且在第二半导体晶片的第一表面中形成第二多个切割街道 在其上具有第二多个结合位置。 第一和第二半导体晶片的第一表面被结合在一起，使得第一多个切割街道与第二多个切割街道对准，并且第一多个结合位置被配合地接收并永久地固定在第二多个结合位置 。 然后通过平面化第二半导体晶片的第二表面直到第二多个切割街道露出来形成多个键合的半导体芯片对。

公开(公告)号：US07834524B2

公开(公告)日：2010-11-16

申请号：US12404830

申请日：2009-03-16

申请人： Ye Wang ,  Harmeet Bhugra

发明人： Ye Wang ,  Harmeet Bhugra

IPC分类号： H01L41/08 ,  H03H9/13 ,  H03H9/15

CPC分类号： H03H9/172 ,  H03H2009/241 ,  Y10T29/42

摘要： Micro-electromechanical devices include a temperature-compensation capacitor and a thin-film bulk acoustic resonator having a first terminal electrically coupled to an electrode of the temperature-compensation capacitor. The temperature-compensation capacitor includes a bimorph beam having a first electrode thereon and a second electrode extending opposite the first electrode. This bimorph beam is configured to yield an increase in spacing between the first and second electrodes in response to an increase in temperature of the micro-electromechanical device. This increase in spacing between the first and second electrodes leads to a decrease in capacitance of the temperature-compensation capacitor. Advantageously, this decrease in capacitance can be used to counteract a negative temperature coefficient of frequency associated with the thin-film bulk acoustic resonator, and thereby render the resonant frequency of the micro-electromechanical device more stable in response to temperature fluctuations.

摘要翻译： 微机电装置包括温度补偿电容器和具有电耦合到温度补偿电容器的电极的第一端子的薄膜体声波谐振器。 温度补偿电容器包括其上具有第一电极的双压电晶片和与第一电极相对延伸的第二电极。 该双压电晶片梁被配置为响应于微机电装置的温度升高而产生第一和第二电极之间的间隔的增加。 这种第一和第二电极之间的间隔增加导致温度补偿电容器的电容降低。 有利地，电容的这种减小可以用于抵消与薄膜体声波谐振器相关联的频率的负温度系数，从而使得微机电装置的谐振频率响应于温度波动而更加稳定。

公开(公告)号：US07194573B1

公开(公告)日：2007-03-20

申请号：US10721036

申请日：2003-11-21

申请人： Jakob Saxtorph ,  John R. Mick, Jr. ,  Harmeet Bhugra

发明人： Jakob Saxtorph ,  John R. Mick, Jr. ,  Harmeet Bhugra

IPC分类号： G06F12/00

CPC分类号： G11C15/00

摘要： CAM-based search engine devices operate to reduce the occurrence of duplicate learned entries within a CAM database when processing search and learn (SNL) instructions. A search engine device may be configured to support processing of first and second immediately consecutive and equivalent SNL instructions as a first SNL instruction and a second search and search instruction, respectively. This processing is performed in order to block an addition of a duplicate learned entry within a database in the search engine device. The search engine device may also be configured to selectively block processing of the second SNL instruction as a second search and search instruction in response to detecting the database as full when the first SNL instruction is processed.

摘要翻译： 基于CAM的搜索引擎设备操作以在处理搜索和学习（SNL）指令时减少CAM数据库内的重复学习条目的出现。 搜索引擎设备可以被配置为分别支持作为第一SNL指令和第二搜索和搜索指令的第一和第二直接连续和等效的SNL指令的处理。 执行该处理以阻止在搜索引擎设备中的数据库中添加重复的学习条目。 搜索引擎设备还可以被配置为当处理第一SNL指令时响应于检测到数据库为满，来选择性地阻止第二SNL指令的处理作为第二搜索和搜索指令。

公开(公告)号：US08575819B1

公开(公告)日：2013-11-05

申请号：US13184970

申请日：2011-07-18

申请人： Harmeet Bhugra ,  Ashwin Samarao

发明人： Harmeet Bhugra ,  Ashwin Samarao

IPC分类号： H01L41/107 ,  H01L41/09 ,  H03H9/00 ,  H03L7/00 ,  H03L1/00

CPC分类号： H03H9/173 ,  H03H2009/02204 ,  H03H2009/155

摘要： Microelectromechanical resonators include a resonator body with a built-in piezoelectric-based varactor diode. This built-in varactor diode supports passive frequency tuning by enabling low-power manipulation of the stiffness of a piezoelectric layer, in response to controlling charge build-up therein at resonance. A resonator may include a composite stack of a bottom electrode, a piezoelectric layer on the bottom electrode and at least one top electrode on the piezoelectric layer. The piezoelectric layer includes a built-in varactor diode, which is defined by at least two regions having different concentrations of electrically active dopants therein.

摘要翻译： 微机电谐振器包括具有内置的基于压电的变容二极管的谐振器体。 这种内置的变容二极管响应于在谐振时控制其中的电荷积聚而支持对压电层的刚度进行低功率操作的无源频率调谐。 谐振器可以包括底部电极的复合叠层，底部电极上的压电层和压电层上的至少一个顶部电极。 压电层包括内置的变容二极管，其由其中具有不同浓度的电活性掺杂剂的至少两个区域限定。

公开(公告)号：US07955885B1

公开(公告)日：2011-06-07

申请号：US12351020

申请日：2009-01-09

申请人： Harmeet Bhugra ,  Kuolung Lei ,  Ye Wang

发明人： Harmeet Bhugra ,  Kuolung Lei ,  Ye Wang

IPC分类号： H01L21/00 ,  H01L21/30 ,  H01L21/46

CPC分类号： B81C1/00301 ,  B81B2207/095 ,  B81C2203/0118

摘要： Methods of forming packaged micro-electromechanical devices include forming a first substrate having a micro-electromechanical device therein, which extends adjacent a first surface of the first substrate. A first surface of a second substrate is then bonded to the first surface of the first substrate, to thereby encapsulate the micro-electromechanical device within a space provided between the first and second substrates. Subsequent to bonding, a second surface of the second substrate is selectively etched to define at least one through-substrate opening therein, which exposes an electrode of the micro-electromechanical device. Thereafter, the through-substrate opening is filled with an electrically conductive through-substrate via.

摘要翻译： 形成包装的微机电装置的方法包括在其中形成具有微机电装置的第一基板，其在第一基板的第一表面附近延伸。 然后将第二基板的第一表面接合到第一基板的第一表面，从而将微机电装置封装在设置在第一和第二基板之间的空间内。 在接合之后，选择性地蚀刻第二衬底的第二表面以在其中限定其中暴露微机电器件的电极的至少一个贯穿衬底开口。 此后，贯通基板开口填充有导电贯穿基板通孔。

公开(公告)号：US07693040B1

公开(公告)日：2010-04-06

申请号：US11743080

申请日：2007-05-01

申请人： Harmeet Bhugra ,  Bertan Tezcan

发明人： Harmeet Bhugra ,  Bertan Tezcan

IPC分类号： H04J11/00

CPC分类号： H04L5/0007 ,  H04L27/2647

摘要： A baseband processor includes a processing switch for performing orthogonal frequency division multiplexing operations on data packets and routing the data packets in the baseband processor. Additionally, the baseband processor includes digital signal processors for performing symbol processing operations on the data packets. The baseband processor is scalable such that digital signal processors may be added to, or removed from, the baseband processor. Further, the baseband processor is programmable such that the symbol processing operations may be distributed among the digital signal processors.

摘要翻译： 基带处理器包括用于对数据分组执行正交频分复用操作并在基带处理器中路由数据分组的处理开关。 此外，基带处理器包括用于对数据分组执行符号处理操作的数字信号处理器。 基带处理器是可扩展的，使得数字信号处理器可以被添加到基带处理器或从基​​带处理器移除。 此外，基带处理器是可编程的，使得符号处理操作可以在数字信号处理器之间分配。

公开(公告)号：US07120731B1

公开(公告)日：2006-10-10

申请号：US10688353

申请日：2003-10-17

申请人： Harmeet Bhugra ,  Kenneth Branth ,  John R. Mick, Jr. ,  Jakob Saxtorph

发明人： Harmeet Bhugra ,  Kenneth Branth ,  John R. Mick, Jr. ,  Jakob Saxtorph

IPC分类号： G06F12/06

CPC分类号： G11C15/00 ,  G06F17/30982

摘要： CAM-based search engines may be configured to support multiple databases within a CAM core. These databases may represent tables for different applications, which can be searched sequentially in response to a single indirect instruction that is loaded during a control cycle. The databases to be searched may be identified by a multi-database search instruction that is loaded during a single data cycle, which may overlap with the control cycle. In some cases, the databases may be searched using variations of a primary search key, so that it is unnecessary to repeatedly load the entire search key across a network interface for each search operation within a respective database. Instead, shorter replacement key segments may be loaded for each of a plurality of the search operations and these replacement key segments may be combined with one or more segments of the primary search key in the CAM core to define a desired search key for a respective search operation.

摘要翻译： 基于CAM的搜索引擎可以被配置为支持CAM内核中的多个数据库。 这些数据库可以表示用于不同应用的表，其可以响应于在控制周期期间加载的单个间接指令而被顺序地搜索。 要搜索的数据库可以由在多个数据库搜索指令中识别，该指令在单个数据周期期间加载，这可能与控制周期重叠。 在一些情况下，可以使用主搜索关键字的变体来搜索数据库，使得不必在相应数据库内的每个搜索操作的网络接口上重复加载整个搜索关键字。 相反，可以为多个搜索操作中的每一个加载更短的替换密钥段，并且这些替换密钥段可以与CAM核心中的主要搜索密钥的一个或多个段组合以定义用于相应搜索的期望的搜索密钥 操作。

公开(公告)号：US08610336B1

公开(公告)日：2013-12-17

申请号：US13250560

申请日：2011-09-30

申请人： Ye Wang ,  Harmeet Bhugra ,  Seungbae Lee

发明人： Ye Wang ,  Harmeet Bhugra ,  Seungbae Lee

IPC分类号： H01L41/08

CPC分类号： H03H3/0073 ,  H03H3/0077 ,  H03H9/02338 ,  H03H9/02401 ,  H03H2009/241

摘要： A microelectromechanical resonator includes a resonator body, which is encapsulated within a sealed cavity extending between first and second substrates that are bonded together. The resonator body is anchored to the first substrate by at least a pair of tethers that suspend the resonator body opposite an underlying recess in the first substrate. A resistive heating element is provided, which is configured to indirectly heat the resonator body through convective heating of the cavity. This resistive heating element may be disposed on an inner surface of the second substrate that is exposed to the cavity. The resonator may also include first and second electrical interconnects, which extend through the second substrate and contact respective first and second portions of the resistive heating element.

摘要翻译： 微机电谐振器包括谐振器体，该谐振器体封装在第一和第二基板之间延伸的密封腔中，所述第一和第二基板被接合在一起。 谐振器主体通过至少一对将谐振器体悬挂在第一衬底中与下面的凹槽相对的系绳来锚定到第一衬底。 提供电阻加热元件，其被配置为通过腔体的对流加热来间接加热谐振器体。 该电阻加热元件可以设置在暴露于空腔的第二基板的内表面上。 谐振器还可以包括第一和第二电互连，其延伸穿过第二基板并接触电阻加热元件的相应的第一和第二部分。

公开(公告)号：US08575981B1

公开(公告)日：2013-11-05

申请号：US13538759

申请日：2012-06-29

申请人： Chien Chen Chen ,  YuanHeng Lo ,  Pavan Kumar Alli ,  Yongchou Lo ,  Minhui Yan ,  Harmeet Bhugra

发明人： Chien Chen Chen ,  YuanHeng Lo ,  Pavan Kumar Alli ,  Yongchou Lo ,  Minhui Yan ,  Harmeet Bhugra

IPC分类号： H03L7/06

CPC分类号： H03L7/1974 ,  H03L1/022

摘要： A frequency synthesizer is configured to generate a periodic output signal in response to a periodic input signal and a temperature-dependent frequency adjusting control signal. A temperature sensor is provided, which is configured to generate a temperature measurement signal in response to detecting a temperature of at least a portion of the frequency synthesizer. A control circuit is provided, which is configured to generate the temperature-dependent frequency adjusting control signal in response to the temperature measurement signal. This control circuit includes a cascaded arrangement of an oversampled data converter and a multi-stage digital filter, which is configured to generate a plurality of codes from respective ones of the digital filter stages, and a selection circuit, which is configured to use at least first and second ones of the plurality of codes in sequence during first and second consecutive time intervals to generate the temperature-dependent frequency adjusting control signal.

摘要翻译： 频率合成器被配置为响应于周期性输入信号和与温度相关的频率调节控制信号产生周期性输出信号。 提供了温度传感器，其被配置为响应于检测到频率合成器的至少一部分的温度而产生温度测量信号。 提供控制电路，其被配置为响应于温度测量信号而产生温度相关的频率调节控制信号。 该控制电路包括过采样数据转换器和多级数字滤波器的级联布置，其被配置为从相应的数字滤波器级产生多个代码，以及选择电路，其被配置为至少使用 第一和第二连续时间间隔中的第一和第二代码顺序地产生温度相关的频率调节控制信号。