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    PASTE COMPOSITION FOR PRINTING AND TOUCH PANEL
    1.
    发明申请
    PASTE COMPOSITION FOR PRINTING AND TOUCH PANEL 有权
    用于印刷和触摸面板的喷涂组合物

    公开(公告)号：US20140264188A1

    公开(公告)日：2014-09-18

    申请号：US14354444

    申请日：2012-10-23

    Applicant: Bong Jun Park ,  Sun Hong Yoon ,  Yong Jin Lee ,  Kwang Yong Jin ,  Kyoung Hoon Chai

    Inventor： Bong Jun Park ,  Sun Hong Yoon ,  Yong Jin Lee ,  Kwang Yong Jin ,  Kyoung Hoon Chai

    IPC: H01B1/22 ,  H01B1/24

    CPC classification number: H01B1/22 ,  H01B1/24

    Abstract: Disclosed is a paste composition for printing including conductive powders, a binder, a dispersing agent, and a solvent. The dispersing agent includes a block copolymer of polyethylene oxide (PEO)-polypropylene oxide (PPO)-polyethylene oxide (PEO), or a block copolymer of polypropylene oxide (PPO)-polyethylene oxide (PEO)-polypropylene oxide (PPO).

    Abstract translation: 公开了一种用于印刷的糊剂组合物，其包括导电粉末，粘合剂，分散剂和溶剂。 分散剂包括聚环氧乙烷（PEO） - 聚环氧丙烷（PPO） - 聚环氧乙烷（PEO）或聚环氧丙烷（PPO） - 聚环氧乙烷（PEO） - 聚环氧丙烷（PPO）的嵌段共聚物的嵌段共聚物。

    Production method and production device for a composite metal powder using the gas spraying method
    3.
    发明授权
    Production method and production device for a composite metal powder using the gas spraying method 有权
    使用气体喷涂法复合金属粉末的生产方法和生产装置

    公开(公告)号：US09267190B2

    公开(公告)日：2016-02-23

    申请号：US13378756

    申请日：2009-12-16

    Applicant: Yong-Jin Kim ,  Sangsun Yang ,  Tae-Soo Lim

    Inventor： Yong-Jin Kim ,  Sangsun Yang ,  Tae-Soo Lim

    IPC: B22F9/04 ,  C22C1/10 ,  C22C21/04 ,  B22F9/08

    CPC classification number: C22C1/1042 ,  B22F2009/0816

    Abstract: Disclosed herein are a method and an apparatus for preparing a metal composite powder by using gas spraying. The method of preparing a metal composite powder by using gas spraying includes introducing a matrix phase in a chamber, including a reinforcing phase in the chamber, melting the introduced matrix phase to form a melt, adding the reinforcing phase in the melt, stirring the melt with the added reinforcing phase to form a melt mixture, atomizing the melt mixture together with a gas to form a metal composite powder containing the reinforcing phase, and collecting the metal composite powder formed.

    Abstract translation: 本文公开了通过使用气体喷射来制备金属复合粉末的方法和装置。 通过使用气体喷射制备金属复合粉末的方法包括在室中引入基质相，包括在室中的增强相，熔化引入的基质相以形成熔体，将增强相加入熔体中，搅拌熔体 加入增强相以形成熔融混合物，将熔融混合物与气体一起雾化以形成含有增强相的金属复合粉末，并收集所形成的金属复合粉末。

    Wrinkle-removing tape
    4.
    发明授权
    Wrinkle-removing tape 有权
    防皱胶带

    公开(公告)号：US09144289B2

    公开(公告)日：2015-09-29

    申请号：US13387746

    申请日：2010-08-07

    Applicant: Yong Jin Kim

    Inventor： Yong Jin Kim

    IPC: A61F5/08 ,  A45D44/22 ,  A45D34/04 ,  A61B17/32 ,  A61B17/00 ,  A61B17/34

    CPC classification number: A45D44/22 ,  A45D34/04 ,  A45D2200/1009 ,  A61B17/32 ,  A61B2017/00761 ,  A61B2017/00942 ,  A61B2017/320004 ,  A61B2017/3437

    Abstract: The present invention relates to a wrinkle-removing apparatus. When the wrinkle removing apparatus of the present invention adopting a vacuum suction system is tightly applied to the shallow wrinkles on a forehead or to deep wrinkles, a vacuum is created by means of the elasticity of the wrinkle-removing apparatus, in order to strongly suck and pull wrinkles outwardly from the skin. Repeated use of the apparatus with the above-described condition enables a substance such as subcutaneous fat or collagen to replace the wrinkles at the back surface of the wrinkled skin when wrinkles are pulled outwardly from the skin, and finally, skin wrinkles are removed even when the apparatus is no longer used.

    Abstract translation: 除皱装置技术领域本发明涉及一种除皱装置。 当采用真空抽吸系统的本发明的皱纹去除装置紧紧地应用于前额上的浅皱纹或深皱纹时，通过除皱装置的弹性产生真空，以便强吸 并从皮肤向外拉出皱纹。 具有上述条件的装置的重复使用使得诸如皮下脂肪或胶原的物质可以在皱纹从皮肤向外拉出时更换起皱皮肤背面的皱纹，最后除去皮肤皱纹 该设备已不再使用。

    GUIDE SERVICE METHOD AND DEVICE APPLIED TO SAME
    6.
    发明申请
    GUIDE SERVICE METHOD AND DEVICE APPLIED TO SAME 审中-公开
    指导服务方法和适用于此的设备

    公开(公告)号：US20150215457A1

    公开(公告)日：2015-07-30

    申请号：US14418692

    申请日：2013-07-30

    Applicant: Yong Jin Kim

    Inventor： Yong Jin Kim ,  Jay Wook Chung

    IPC: H04M3/493 ,  G06F3/0484 ,  G06F3/0488 ,  H04M1/725

    CPC classification number: H04M3/4936 ,  G06F3/04842 ,  G06F3/0488 ,  G06F3/04895 ,  G06F3/167 ,  H04M1/72522 ,  H04M1/72552 ,  H04M1/72583 ,  H04M2203/252 ,  H04M2250/56 ,  H04W4/00

    Abstract: Disclosed is a guidance service method and an apparatus thereof. That is, the method provides a terminal device that connects to a voice call with a step-based service menu through voice information, receives selection information of the terminal device based on the step-based service menu, through the voice call, and displays, in the terminal, a service screen configured based on the selection information of the terminal device that is received through the voice call, in parallel with reception of the voice information, and thereby improving understanding and convenience of the guidance service for a user.

    Abstract translation: 本发明提供一种引导服务方法及其装置。 也就是说，该方法通过语音信息提供通过基于步骤的服务菜单连接到语音呼叫的终端设备，通过语音呼叫接收基于步骤的服务菜单的终端设备的选择信息， 在终端中，基于通过语音呼叫接收到的终端装置的选择信息配置的服务屏幕，与语音信息的接收并行，从而提高对用户的指导服务的理解和方便。

    Semiconductor heterostructure and transistor of HEMT type, in particular for low-frequency low-noise cryogenic applications
    8.
    发明授权
    Semiconductor heterostructure and transistor of HEMT type, in particular for low-frequency low-noise cryogenic applications 有权
    半导体异质结构和HEMT型晶体管，特别适用于低频低噪声低温应用

    公开(公告)号：US08987783B2

    公开(公告)日：2015-03-24

    申请号：US13878948

    申请日：2011-10-07

    Applicant: Yong Jin ,  Ulf Gennser ,  Antonella Cavanna

    Inventor： Yong Jin ,  Ulf Gennser ,  Antonella Cavanna

    IPC: H01L31/072 ,  H01L29/20 ,  H01L29/778

    CPC classification number: H01L29/20 ,  H01L29/778 ,  H01L29/7785

    Abstract: A semiconductor heterostructure having: a substrate (SS); a buffer layer (h); a spacer layer (d, e, f); a barrier layer (b, c); and which may also include a cover layer (a) is provided. The barrier layer is doped (DS); and the barrier and spacer layers are made of one or more semiconductors having wider bandgaps than the one or more materials forming the buffer layer, the heterostructure being characterized in that: the barrier layer comprises a first barrier sublayer (c) in contact with the spacer layer, and a second barrier sublayer (b), distant from the spacer layer; and in that the second barrier sublayer has a wider bandgap than the first barrier sublayer. The invention also relates to a HEMT transistor produced using such a heterostructure and to the use of such a transistor at cryogenic temperatures.

    Abstract translation: 一种半导体异质结构，具有：基板（SS）; 缓冲层（h）; 间隔层（d，e，f）; 阻挡层（b，c）; 并且还可以包括覆盖层（a）。 阻挡层掺杂（DS）; 并且所述阻挡层和间隔层由一个或多个具有比形成所述缓冲层的所述一种或多种材料的带隙更宽的半导体制成，所述异质结构的特征在于：所述阻挡层包括与间隔物接触的第一阻挡子层（c） 层和远离间隔层的第二屏障子层（b）; 并且第二阻挡子层具有比第一势垒子层更宽的带隙。 本发明还涉及使用这种异质结构制造的HEMT晶体管以及在低温下使用这种晶体管。

    PROCESS MODULE, FABRICATING METHOD THEREOF AND SUBSTRATE PROCESSING METHOD USING THE PROCESS MODULE
    9.
    发明申请
    PROCESS MODULE, FABRICATING METHOD THEREOF AND SUBSTRATE PROCESSING METHOD USING THE PROCESS MODULE 审中-公开
    工艺模块，其制造方法及使用工艺模块的基板处理方法

    公开(公告)号：US20150053336A1

    公开(公告)日：2015-02-26

    申请号：US14346366

    申请日：2014-02-19

    Applicant: Yong Jin Lim ,  Jae Jeong Kwak

    Inventor： Yong Jin Lim ,  Jae Jeong Kwak

    IPC: B32B38/10 ,  B32B37/12

    CPC classification number: G06F3/044 ,  B32B2457/20 ,  B32B2457/208 ,  G06F2203/04103 ,  Y10T156/10 ,  Y10T156/17

    Abstract: Disclosed are a process module, a fabrication method thereof, and a substrate processing method using the process module. The process module includes a structure in which cell substrates are fixed on a carrier member by an adhesive according to a preset alignment standard. The fabrication method includes aligning the cell substrates according to a preset alignment standard, applying an adhesive to at least one of surfaces facing each other between the cell substrates and the carrier member, and attaching the cell substrates to the carrier member by using the adhesive. The substrate processing method includes performing the substrate processing process of the cell substrates at the same time by using the process module integrated with the cell substrates. The substrate processing method selectively includes calibrating the alignment standard for the cell substrates in the substrate processing process to an alignment state of the cell substrates in the process module.

    Abstract translation: 公开了一种处理模块及其制造方法，以及使用该处理模块的基板处理方法。 处理模块包括根据预设的对准标准，通过粘合剂将单元基板固定在载体构件上的结构。 制造方法包括根据预设的对准标准对准单元基板，将粘合剂施加到单元基板和载体构件之间彼此相对的表面中的至少一个表面，并且通过使用粘合剂将单元基板附接到载体构件。 基板处理方法包括通过使用与单元基板一体化的处理模块同时执行单元基板的基板处理处理。 基板处理方法选择性地包括将基板处理工艺中的单元基板的对准标准校准为处理模块中的单元基板的对准状态。

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