公开(公告)号：US08319482B2

公开(公告)日：2012-11-27

申请号：US12716133

申请日：2010-03-02

申请人： Yoshihiko Matsuo ,  Takeshi Kimura ,  Osamu Takahashi

发明人： Yoshihiko Matsuo ,  Takeshi Kimura ,  Osamu Takahashi

IPC分类号： G05F1/613

CPC分类号： H02M3/1588 ,  Y02B70/1466

摘要： A power supply includes a first switch and a second switch coupled in series between an input voltage terminal to which an input voltage is applied and a reference voltage terminal to which a reference voltage lower than the input voltage is applied, an inductor disposed between a junction coupling the first and second switches and an output terminal from which an output voltage is output, and a controller controlling the first and second switches to be alternately switched at a given switching cycle depending on an error of the output voltage with respect to a target voltage, wherein the controller changes the switching cycle from a first cycle to a second cycle longer than the first cycle, depending on a voltage at the junction when the second switch is in a turned-on state.

摘要翻译： 电源包括串联耦合在施加输入电压的输入电压端子与施加了低于输入电压的参考电压的参考电压端子之间的第一开关和第二开关，设置在连接点之间的电感器 耦合第一和第二开关以及从其输出输出电压的输出端子，以及控制器，用于根据输出电压相对于目标电压的误差控制第一和第二开关以给定开关周期交替切换 其中，当所述第二开关处于导通状态时，所述控制器将所述开关周期从第一周期改变为比所述第一周期长的第二周期。

公开(公告)号：US07211891B2

公开(公告)日：2007-05-01

申请号：US10996457

申请日：2004-11-26

申请人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

发明人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

IPC分类号： H01L23/34 ,  H01L31/058 ,  H01L29/06 ,  H01L23/495 ,  H01L23/10

CPC分类号： H01S5/02407 ,  F25B21/00 ,  F25B2321/003 ,  G11B7/126 ,  H01L23/38 ,  H01L37/00 ,  H01L2924/0002 ,  H01S5/02208 ,  H01S5/02415 ,  H01S5/06808 ,  Y02B30/66 ,  Y10S257/93 ,  H01L2924/00

摘要： There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

摘要翻译： 提供了一种小型电子热泵装置，其功耗低，并且在不使用附加电路的情况下确保真空间隙。 电子热泵装置包括发射器1和集电器2。 在集电体2的半导体基板20中，一体地形成有用于保持空间的绝热隔离部分5，即发射电极11和集电极21之间的真空间隙G恒定，这使得可以保持真空间隙 成为规定的空间，同时以简单的结构防止组件的数量减少的热回流。

公开(公告)号：US20050104185A1

公开(公告)日：2005-05-19

申请号：US10984979

申请日：2004-11-10

申请人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

发明人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

IPC分类号： F25B21/00 ,  F25B30/00 ,  H01J45/00 ,  H01L35/32 ,  H01L23/02 ,  H01L21/48

CPC分类号： H01J45/00 ,  F25B21/00 ,  F25B2321/003 ,  F25D2331/805 ,  F25D2331/809 ,  H01L35/32 ,  H01L2924/0002 ,  Y02B30/66 ,  Y10S438/979 ,  H01L2924/00

摘要： An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member for maintaining a vacuum between the stems. The emitter has a first semiconductor substrate and an emitter electrode, while the collector has a second semiconductor substrate and a collector electrode. The emitter electrode and the collector electrode are disposed so as to be opposed to each other with a space interposed therebetween. At least one of the first and second semiconductor substrates is integrally formed with electrically and thermally insulative spacers that keep the space between the emitter electrode and the collector electrode constant.

摘要翻译： 电子热泵装置具有发射器和收集器，支撑这些部件的杆，用于保持杆之间的间隔恒定的间隔保持构件和用于保持杆之间的真空的密封构件。 发射极具有第一半导体衬底和发射极，而集电极具有第二半导体衬底和集电极。 发射电极和集电极配置成彼此相对，间隔开。 第一和第二半导体衬底中的至少一个半导体衬底一体地形成有保持发射电极和集电极之间的空间恒定的电绝缘和隔热隔离物。

公开(公告)号：USD271845S

公开(公告)日：1983-12-20

申请号：US257201

申请日：1981-04-24

申请人： Yoshihiko Matsuo ,  Takeshi Shohoji

设计人： Yoshihiko Matsuo ,  Takeshi Shohoji

公开(公告)号：US20100225292A1

公开(公告)日：2010-09-09

申请号：US12717681

申请日：2010-03-04

申请人： Eiji NISHIMORI ,  Yoshihiko MATSUO ,  Osamu TAKAHASHI ,  Takeshi KIMURA

发明人： Eiji NISHIMORI ,  Yoshihiko MATSUO ,  Osamu TAKAHASHI ,  Takeshi KIMURA

IPC分类号： G05F1/10

CPC分类号： H02M3/156

摘要： A DC-DC converter control circuit includes: a slope signal generation circuit that generates a reference voltage by superimposing a slope voltage onto a standard voltage; a comparator that performs comparison of the reference voltage with an output voltage and generates a signal according to a result of the comparison; an oscillator that generates a pulse signal with a substantially constant cycle; and a control signal generation circuit that generates a control signal that turns on a switch based on a comparator output signal and turns off the switch based on the pulse signal.

摘要翻译： DC-DC转换器控制电路包括：斜率信号产生电路，通过将斜率电压叠加在标准电压上来产生参考电压; 比较器，执行参考电压与输出电压的比较，并根据比较结果生成信号; 产生具有基本恒定周期的脉冲信号的振荡器; 以及控制信号生成电路，其基于比较器输出信号生成接通开关的控制信号，并根据脉冲信号关断开关。

公开(公告)号：US20050042868A1

公开(公告)日：2005-02-24

申请号：US10944863

申请日：2004-09-21

申请人： Yoshihiko Matsuo ,  Ryukichi Ikeda ,  Kimihiko Yoshida ,  Fumio Okuda

发明人： Yoshihiko Matsuo ,  Ryukichi Ikeda ,  Kimihiko Yoshida ,  Fumio Okuda

IPC分类号： C25D5/48 ,  B32B15/01 ,  C22C13/00 ,  C25D3/60 ,  C25D5/18 ,  C25D5/34 ,  C25D7/00 ,  C25D21/00 ,  C25D21/12 ,  H01L21/288 ,  H01L23/495 ,  H01L23/50 ,  H05K3/24 ,  H01L21/44

CPC分类号： H05K3/244 ,  B32B15/01 ,  C22C13/00 ,  C25D3/60 ,  C25D5/18 ,  C25D5/34 ,  H01L21/2885 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2203/1476 ,  Y10S428/926 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/12646 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12951 ,  Y10T428/12993 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

摘要翻译： 一种形成镀膜的方法，包括以下步骤：在具有能够改变电流的阴极和阳极的电镀浴中，将第一电流密度下的电镀膜施加到预定时间段上的镀膜; 并且以比第一电流密度低的第二电流密度来保持待镀物体。 根据本发明，可以通过简单的方法提高常规无铅焊料的镀膜的可焊性，从而可以进一步提高生产率，从而降低生产成本。

公开(公告)号：US06590232B2

公开(公告)日：2003-07-08

申请号：US09939766

申请日：2001-08-28

申请人： Yoshihiko Matsuo

发明人： Yoshihiko Matsuo

IPC分类号： H01L2715

CPC分类号： H01L31/02322 ,  H01L31/0203 ,  H01L31/173 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An object of the invention is to raise and stabilize the efficiency of light transmission between a light-emitting device and a light-receiving device. A light-transmissive resin projection has a constant height over the extent from the light-emitting device to the light-receiving device and is shaped triangular in section. Since an outer package is white-colored, the interface between the light-transmissive resin projection and the outer package is also white-colored and, hence, the light reflectivity of the interface is high. Accordingly, light emitted from the light-emitting device is reflected at faces of the light-transmissive resin projection, gathered to the vertex portion, guided to the light-receiving device, and received by the light-receiving device. At this time, light is transmitted from the light-emitting device to the light-receiving device without being dispersed within the light-transmissive resin projection. Further, since the light transmission distance is short, the light transmission efficiency is high and is stabilized.

公开(公告)号：US07327026B2

公开(公告)日：2008-02-05

申请号：US10984979

申请日：2004-11-10

申请人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

发明人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

IPC分类号： H01L23/34 ,  H01L23/02

CPC分类号： H01J45/00 ,  F25B21/00 ,  F25B2321/003 ,  F25D2331/805 ,  F25D2331/809 ,  H01L35/32 ,  H01L2924/0002 ,  Y02B30/66 ,  Y10S438/979 ,  H01L2924/00

摘要： An electronic heat pump device has an emitter and a collector, stems supporting these components, a spacing retention member for keeping a spacing between the stems constant, and a sealing member for maintaining a vacuum between the stems. The emitter has a first semiconductor substrate and an emitter electrode, while the collector has a second semiconductor substrate and a collector electrode. The emitter electrode and the collector electrode are disposed so as to be opposed to each other with a space interposed therebetween. At least one of the first and second semiconductor substrates is integrally formed with electrically and thermally insulative spacers that keep the space between the emitter electrode and the collector electrode constant.

摘要翻译： 电子热泵装置具有发射器和收集器，支撑这些部件的杆，用于保持杆之间的间隔恒定的间隔保持构件和用于保持杆之间的真空的密封构件。 发射极具有第一半导体衬底和发射极，而集电极具有第二半导体衬底和集电极。 发射电极和集电极配置成彼此相对，间隔开。 第一和第二半导体衬底中的至少一个半导体衬底一体地形成有保持发射电极和集电极之间的空间恒定的电绝缘和隔热隔离物。

公开(公告)号：US07087315B2

公开(公告)日：2006-08-08

申请号：US10944863

申请日：2004-09-21

申请人： Yoshihiko Matsuo ,  Ryukichi Ikeda ,  Kimihiko Yoshida ,  Fumio Okuda

发明人： Yoshihiko Matsuo ,  Ryukichi Ikeda ,  Kimihiko Yoshida ,  Fumio Okuda

IPC分类号： B32B15/01 ,  C25D5/48

CPC分类号： H05K3/244 ,  B32B15/01 ,  C22C13/00 ,  C25D3/60 ,  C25D5/18 ,  C25D5/34 ,  H01L21/2885 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/01028 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/1576 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K2203/1476 ,  Y10S428/926 ,  Y10T428/12014 ,  Y10T428/12493 ,  Y10T428/12646 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/12785 ,  Y10T428/12792 ,  Y10T428/12875 ,  Y10T428/12882 ,  Y10T428/12889 ,  Y10T428/12896 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12917 ,  Y10T428/12951 ,  Y10T428/12993 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for forming a plating film, comprising the steps of: applying a plating film onto an object to be plated at a first current density for a predetermined period in a plating bath having a cathode capable of varying current and an anode and; and maintaining the object to be plated at a second current density lower than the first current density. According to the present invention, it is possible to improve solderability of a plating film for conventional lead-free solder by a simple method, which allows the productivity to further enhanced, resulting in a plating film with reduced production costs.

摘要翻译： 一种形成镀膜的方法，包括以下步骤：在具有能够改变电流的阴极和阳极的电镀浴中，将第一电流密度下的电镀膜施加到预定时间段上的镀膜; 并且以比第一电流密度低的第二电流密度来保持待镀物体。 根据本发明，可以通过简单的方法提高常规无铅焊料的镀膜的可焊性，从而可以进一步提高生产率，从而降低生产成本。

公开(公告)号：US20050110099A1

公开(公告)日：2005-05-26

申请号：US10996457

申请日：2004-11-26

申请人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

发明人： Kenji Shimogishi ,  Yoshihiko Matsuo ,  Yoichi Tsuda

IPC分类号： F25B21/00 ,  G11B7/125 ,  H01L23/38 ,  H01L29/76 ,  H01L37/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H02N3/00

CPC分类号： H01S5/02407 ,  F25B21/00 ,  F25B2321/003 ,  G11B7/126 ,  H01L23/38 ,  H01L37/00 ,  H01L2924/0002 ,  H01S5/02208 ,  H01S5/02415 ,  H01S5/06808 ,  Y02B30/66 ,  Y10S257/93 ,  H01L2924/00

摘要： There is provided a small-size electronic heat pump device which is low in power consumption and which secures a vacuum gap without use of an additional circuit. The electronic heat pump device includes an emitter 1 and a collector 2. An electrically and thermally insulative spacer section 5 for keeping a space, i.e. vacuum gap G between an emitter electrode 11 and a collector electrode 21 constant is integrally formed in a semiconductor substrate 20 of the collector 2, which makes it possible to maintain the vacuum gap to be a specified space while a back flow of heat is prevented in a simple structure with a reduced number of component parts.

摘要翻译： 提供了一种小型电子热泵装置，其功耗低，并且在不使用附加电路的情况下确保真空间隙。 电子热泵装置包括发射器1和集电器2。 在集电体2的半导体基板20中，一体地形成有用于保持空间的绝热隔离部分5，即发射电极11和集电极21之间的真空间隙G恒定，这使得可以保持真空间隙 成为规定的空间，同时以简单的结构防止组件的数量减少的热回流。