摘要:
Provided is an MCP including a plurality chips stacked therein. Each of the chips includes a plurality of inductor pads configured to transmit power or signals, and at both sides of a reference inductor pad, a first and a second inductor pads are formed to generate magnetic fluxes in different directions from each other.
摘要:
In a particle focusing apparatus and a method for focusing particles, the particle focusing apparatus includes a channel, a fixing member, a fluid feeding portion and a power supply. The channel has first and second ends and extends substantially in a line. The fixing member includes a first fixing portion connected to and fixing the first end, and a second fixing portion connected to and fixing the second end. The fluid feeding portion feeds fluid having particles into the channel. The power supply has first and second terminals. The first terminal passes through the first fixing portion and is electrically connected to an anode of the power supply. The second terminal passes through the second fixing portion and is electrically connected to a cathode of the power supply. Thus, particles fed into the channel may be more easily and efficiently focused to a central region inside the channel.
摘要:
Methods are presented to produce duplex (DP) microstructures, nearly lamellar (NL) microstructures, and fully TMT lamellar (TMTL) microstructures in gamma titanium aluminide alloy articles. The key step for obtaining a specific type of microstructure is the post-hot work annealing treatment at a temperature in a specific range for the desired microstructure. The annealing temperatures range from Te+100° C. to T&agr;−25° C. for duplex (DP) microstructures, from T&agr;−25° C. to T&agr;−5° C. for nearly lamellar (NL) microstructures, and from T&agr; to T&agr;+60° C. for fully TMT lamellar (TMTL) microstructures, where Te is the titanium-aluminum eutectoid temperature of the alloy and T&agr; is the alpha transus temperature of the alloy. The times required for producing specific microstructures range from 2 min to 15 hours depending on microstructural type, alloy composition, annealing temperature selected, material section size, and desired grain-size. The heating rate to the post-hot work annealing treatment is critical and must be fast enough to avoid compositional segregation (in the two-phase field) and uneven grain growth. Cooling schemes and rates after the annealing treatments are determined according to the microstructural features of interest, and their stability.
摘要:
A portable computer is provided that has a monitor pivotally mounted onto a main body. The base of the main body have holes that can receive a fastener. On the sides of the main body are receptacles that are positioned near a corresponding hole in the base of the main body of the computer.An L-shaped member forms a connector that allows a strap to be attached to the portable computer to allow the computer to be more easily transported. The L shaped member has a bore on one leg and a boss on the other leg. To attach the connector the boss is inserted into a receptacle in the side of the main body and the bore of the connector is aligned over a hole in the base of the main body. Then, a fastener is inserted through the bore and into the hole in the base of the main body.On a portion of the connector is a bail shaped member that forms a chute between the member and the connector. A strap can be attached to the bail shaped member to simplify the transporting of the portable computer. Additionally, the bail shaped member can be used to tilt the portable computer up at an angle more convenient for use by a user.With the connectors of the present invention it is possible to more quickly ready a portable computer for transport and possible to eliminate the need for a separate tilting device. Additionally, by looping the strap around one's neck, a user can use the portable computer while walking without fear of dropping the computer. This design is ideal for operating the portable computer while performing multiple short distance moves. If a user is in a hurry, the strap need not be removed during use and the portable computer can simply be slung over a shoulder when quick movement is again required.
摘要:
Gamma titanium aluminide alloys having the composition Ti--(45.5-47.5)Al--(0-3.0)X--(1-5)Y--(0.05-1.0)W, where X is Cr, Mn or any combination thereof, and Y is Nb, Ta or any combination thereof (at %), are treated to provide specific microstructures. To obtain duplex microstructures, the annealing temperature (T.sub.a) range is the eutectoid temperature (T.sub.e)+100.degree. C. to the alpha transus temperature (T.sub..alpha.)-30.degree. C.; to obtain nearly lamellar microstructures, the annealing temperature range is T.sub..alpha. -20.degree. C. to T.sub..alpha. -1.degree. C.; to obtain fully lamellar microstructures, the annealing temperature range is T.sub..alpha. to T.sub..alpha. +50.degree. C. The times required for producing these microstructures range from 0.25 to 15 hours, depending on the desired microstructure, alloy composition, annealing temperature selected, material section size and grain size desired. The cooling schemes and rates after annealing depend mainly on the microstructure type and stability; for duplex and nearly lamellar microstructures, the initial cooling rate is 5.degree. to 1000.degree. C./min, while for fully lamellar microstructure, the initial cooling rate is 5.degree. to 100.degree. C./min. The article can be cooled at the initial rate directly to the aging temperature; alternatively, the article can be cooled at the initial rate down to a temperature between room temperature and the annealing temperature, then cooled to room temperature at a cooling rate between the initial rate and water quenching, after which the article is aged. Following annealing, the article is aged at a temperature in the range of 700.degree. C. to 1050.degree. C. for about 4 to 150 hours.
摘要:
A detachable device for preventing sliced food ingredients from sticking on the blade of a knife when a user slices the food ingredients. The device is attached to a kitchen knife and acts to bend food ingredients outwardly from the blade. It includes an adhesion preventing member having a predetermined length and width, and having a flat lower face. The adhesion preventing member includes a curved portion, a first inclined portion and a second inclined portion which are respectively formed on the upper part thereof. The curved portion has an arc-shaped curved surface and the first inclined portion extends downwardly from an end portion while forming a curved surface. The second inclined portion extends downwardly from the other end portion while forming a curved surface. A silicon attachment pad is joined to the lower face of the adhesion preventing member.
摘要:
A semiconductor integrated circuit includes a first voltage line to which a first ground voltage is applied, a second voltage line to which a second ground voltage is applied, a third voltage line to which a first power supply voltage is applied, and a coupling unit including a MOS transistor having a source coupled to the first voltage line, a drain coupled to the second voltage line, and a gate coupled to the third voltage line.
摘要:
A semiconductor integrated circuit apparatus includes a semiconductor substrate, a plurality of signal lines, and at least one interface member. The signal lines are disposed on the semiconductor substrate. The interface member is disposed in the semiconductor substrate between the adjacent signal lines among the signal lines to pierce the semiconductor substrate.
摘要:
In a particle focusing apparatus and a method for focusing particles, the particle focusing apparatus includes a channel, a fixing member, a fluid feeding portion and a power supply. The channel has first and second ends and extends substantially in a line. The fixing member includes a first fixing portion connected to and fixing the first end, and a second fixing portion connected to and fixing the second end. The fluid feeding portion feeds fluid having particles into the channel. The power supply has first and second terminals. The first terminal passes through the first fixing portion and is electrically connected to an anode of the power supply. The second terminal passes through the second fixing portion and is electrically connected to a cathode of the power supply. Thus, particles fed into the channel may be more easily and efficiently focused to a central region inside the channel.
摘要:
Provided are a method for fabricating a capacitor and a semiconductor device using the same. The semiconductor device includes a MOS transistor capacitor, first and second plate capacitors, and a metal interconnection. The MOS transistor capacitor is arranged between a power supply and a ground. The first and second plate capacitors are arranged between the power supply and the ground. The metal interconnection is configured to connect the first and second plate capacitors.