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    Backlight assembly having current detection circuit and display apparatus having the same
    1.
    发明授权
    Backlight assembly having current detection circuit and display apparatus having the same 有权
    具有电流检测电路的背光组件和具有该背光组件的显示装置

    公开(公告)号：US08917230B2

    公开(公告)日：2014-12-23

    申请号：US12909239

    申请日：2010-10-21

    申请人： Ho-Sik Shin ,  Seokhyun Nam ,  Young-Min Park ,  Yu-Dong Kim ,  Jung-Hyun Yang

    发明人： Ho-Sik Shin ,  Seokhyun Nam ,  Young-Min Park ,  Yu-Dong Kim ,  Jung-Hyun Yang

    IPC分类号： G09G3/36 ,  H05B33/08

    CPC分类号： H05B33/0851 ,  H05B33/0815

    摘要： A backlight assembly includes; a plurality of light source strings which receive a driving voltage to generate a light, a driving circuit including a channel terminal commonly connected to output terminals of the plurality of light source strings and which receives a feedback voltage through the channel terminal to control the driving voltage according to the feedback voltage, and a current detection circuit connected to the output terminals of the plurality of light source strings to receive currents from the plurality of light source strings and which turns off the driving circuit when at least one of the received currents is larger than a predetermined reference current.

    摘要翻译： 背光组件包括： 多个光源串，其接收用于产生光的驱动电压;驱动电路，包括共同连接到所述多个光源串的输出端的通道端子，并且通过所述通道端子接收反馈电压以控制所述驱动电压 以及连接到所述多个光源串的输出端的电流检测电路，以接收来自所述多个光源串的电流，并且当所述接收电流中的至少一个较大时，所述电流检测电路截止所述驱动电路 比预定的参考电流。

    Light emitting device package including UV light emitting diode
    2.
    发明授权
    Light emitting device package including UV light emitting diode 有权
    发光器件封装包括紫外发光二极管

    公开(公告)号：US08669581B2

    公开(公告)日：2014-03-11

    申请号：US13350258

    申请日：2012-01-13

    申请人： Jung Su Jung ,  Byung Mok Kim ,  Yu Dong Kim ,  Gun Kyo Lee

    发明人： Jung Su Jung ,  Byung Mok Kim ,  Yu Dong Kim ,  Gun Kyo Lee

    IPC分类号： H01L33/00

    CPC分类号： H01L33/486 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    摘要： Provided is a light emitting device package, which includes a ceramic body, an ultraviolet light emitting diode, a support member, and a glass film. The ceramic body defines a cavity. The ultraviolet light emitting diode is disposed within the cavity. The support member is disposed on the body, and surrounds the cavity. The glass film is coupled to the support member, and covers the cavity. Since the light emitting device package includes the ceramic body to efficiently dissipate heat, and the glass film is directly attached to the ceramic body to decrease the number of components, thereby simplifying the manufacturing process thereof, and reducing the manufacturing costs thereof.

    摘要翻译： 提供了一种发光器件封装，其包括陶瓷体，紫外发光二极管，支撑构件和玻璃膜。 陶瓷体定义一个空腔。 紫外线发光二极管设置在腔内。 支撑构件设置在主体上并围绕空腔。 玻璃膜与支撑构件连接，并且覆盖空腔。 由于发光器件封装包括陶瓷体以有效地散热，并且玻璃膜直接附着到陶瓷体上以减少部件数量，从而简化了其制造工艺，并降低了其制造成本。

    BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME
    3.
    发明申请
    BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME 有权
    背光组件和显示装置

    公开(公告)号：US20110181625A1

    公开(公告)日：2011-07-28

    申请号：US12909239

    申请日：2010-10-21

    申请人： Ho-Sik SHIN ,  Seokhyun NAM ,  Young-Min PARK ,  Yu-Dong KIM ,  Jung-Hyun YANG

    发明人： Ho-Sik SHIN ,  Seokhyun NAM ,  Young-Min PARK ,  Yu-Dong KIM ,  Jung-Hyun YANG

    IPC分类号： G09G5/10 ,  H05B37/02 ,  H05B37/04

    CPC分类号： H05B33/0851 ,  H05B33/0815

    摘要： A backlight assembly includes; a plurality of light source strings which receive a driving voltage to generate a light, a driving circuit including a channel terminal commonly connected to output terminals of the plurality of light source strings and which receives a feedback voltage through the channel terminal to control the driving voltage according to the feedback voltage, and a current detection circuit connected to the output terminals of the plurality of light source strings to receive currents from the plurality of light source strings and which turns off the driving circuit when at least one of the received currents is larger than a predetermined reference current.

    摘要翻译： 背光组件包括： 多个光源串，其接收用于产生光的驱动电压;驱动电路，包括共同连接到所述多个光源串的输出端的通道端子，并且通过所述通道端子接收反馈电压以控制所述驱动电压 以及连接到所述多个光源串的输出端的电流检测电路，以接收来自所述多个光源串的电流，并且当所述接收电流中的至少一个较大时，所述电流检测电路截止所述驱动电路 比预定的参考电流。

    LIGHT EMITTING DEVICE AND BACKLIGHT UNIT INCLUDING THE SAME
    4.
    发明申请
    LIGHT EMITTING DEVICE AND BACKLIGHT UNIT INCLUDING THE SAME 失效
    发光装置和背光单元，包括它们

    公开(公告)号：US20100014279A1

    公开(公告)日：2010-01-21

    申请号：US12276250

    申请日：2008-11-21

    申请人： Tomio Inoue ,  Yu Dong Kim ,  Jae Woo Cho ,  Ok Hee Shin

    发明人： Tomio Inoue ,  Yu Dong Kim ,  Jae Woo Cho ,  Ok Hee Shin

    IPC分类号： H01L33/00 ,  G02F1/13357

    CPC分类号： H01L33/486 ,  G02F1/133615 ,  H01L33/54 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/1815 ,  H01L2924/3025 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

    摘要： There are provided a light emitting device and a backlight unit including the same. The light emitting device includes a package body having opposing first and second main surfaces and side surfaces, and formed of a curable resin; first and second external terminal blocks opposing each other and each having first and second surfaces formed on the first and second main surfaces and side surfaces, the first and second external terminal blocks each including a connecting part having a bonding portion located inside the package body and a terminal portion connected to the bonding portion and exposed outward; and an LED chip including an electrode forming surface where first and second electrodes are formed and a light emitting surface located opposite to the electrode forming surface, the LED chip having the first and second electrodes electrically connected to the bonding portions of the first and second external terminal blocks, respectively.

    摘要翻译： 提供了一种发光器件和包括该发光器件的背光单元。 发光器件包括：具有相对的第一和第二主表面和侧表面的封装体，并由可固化树脂形成; 第一和第二外部端子块彼此相对并且每个具有形成在第一和第二主表面和侧表面上的第一和第二表面，每个包括具有位于封装体内部的接合部分的连接部分的第一和第二外部接线端子， 连接到所述接合部并向外露出的端子部; 以及包括形成第一和第二电极的电极形成表面和与电极形成表面相对的发光表面的LED芯片，所述LED芯片具有电连接到第一和第二外部的接合部分的第一和第二电极 端子块。

    Light emitting device chip, light emitting device package
    9.
    发明授权
    Light emitting device chip, light emitting device package 有权
    发光器件芯片，发光器件封装

    公开(公告)号：US09136445B2

    公开(公告)日：2015-09-15

    申请号：US13006097

    申请日：2011-01-13

    申请人： Yu Dong Kim ,  Kyoung Woo Jo

    发明人： Yu Dong Kim ,  Kyoung Woo Jo

    IPC分类号： H01L33/00 ,  H01J1/62 ,  H01L33/50 ,  H01L33/64

    CPC分类号： H01L33/508 ,  H01L33/507 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： Disclosed are a light emitting device chip, a light emitting device package, and a lighting system. The light emitting device chip includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer interposed between the first and second conductive semiconductor layers; a transmittive layer on the light emitting structure; and a luminescence material layer on the transmittive layer, wherein the luminescence material layer includes a pattern, which does not expose the transmittive layer, partially exposes the transmittive layer or partially exposes the transmittive layer and the light emitting structure.

    摘要翻译： 公开了一种发光器件芯片，发光器件封装和照明系统。 发光器件芯片包括发光结构，其包括第一导电半导体层，第二导电半导体层和介于第一和第二导电半导体层之间的有源层; 在发光结构上的透射层; 以及透射层上的发光材料层，其中发光材料层包括不暴露透射层的图案，部分地暴露透射层或部分地暴露透射层和发光结构。