Adjustable cane with memory function
    1.
    发明授权
    Adjustable cane with memory function 有权
    具有记忆功能的可调节手杖

    公开(公告)号:US09192213B2

    公开(公告)日:2015-11-24

    申请号:US13938234

    申请日:2013-07-10

    IPC分类号: A45B9/00 A45B3/12 A45B9/04

    摘要: A cane includes a tube, an extension rod telescopically mounted within one end of the tube, and a control mechanism sandwiched between the tube and the extension rod. The tube defines a first aperture and a second aperture. The extension rod defines a plurality of holes. The control mechanism is movable among a first position where the control mechanism is positioned in a selected one of the holes in the extension rod, and the tube, the extension rod and the control mechanism are prohibited from moving axially with respect to one another; a second position where the extension rod and the control mechanism together are allowed to move axially with respect to the tube; and a third position where the extension rod is allowed to move axially with respect to the control mechanism and the tube.

    摘要翻译: 手杖包括管,可伸缩地安装在管的一端的延伸杆,以及夹在管和延伸杆之间的控制机构。 管限定第一孔和第二孔。 延伸杆限定多个孔。 所述控制机构能够在所述控制机构位于所述延伸杆的选定孔中的第一位置之间移动,所述管,所述延伸杆和所述控制机构被禁止相对于彼此轴向移动; 延长杆和控制机构一起被允许相对于管轴向移动的第二位置; 以及允许延长杆相对于控制机构和管轴向移动的第三位置。

    Method for immobilizing glycoprotein
    2.
    发明授权
    Method for immobilizing glycoprotein 有权
    糖蛋白固定方法

    公开(公告)号:US08153387B2

    公开(公告)日:2012-04-10

    申请号:US12490953

    申请日:2009-06-24

    IPC分类号: G01N33/53

    摘要: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group (B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.

    摘要翻译: 公开了一种固定糖蛋白的方法。 提供一个表面。 接下来,硼酸与表面接触。 硼酸被表示为Y-R-B-(OH)2,并且包括硼酸基团(B-(OH)2),连接体R和官能团Y,其中硼酸键合到 通过官能团Y表面。糖蛋白与硼酸接触,其中碳水化合物链的两个空间上相邻的羟基与硼酸的硼酸基团形成硼酸酯以固定糖蛋白。 因此可以通过硼酸和Fc区的碳水化合物链的反应来实现位点特异性和共价蛋白固定而不干扰抗体对抗原的结合亲和力的目标。

    METHOD FOR IMMOBILIZING GLYCOPROTEIN
    3.
    发明申请
    METHOD FOR IMMOBILIZING GLYCOPROTEIN 有权
    用于固定糖蛋白的方法

    公开(公告)号:US20100190966A1

    公开(公告)日:2010-07-29

    申请号:US12490953

    申请日:2009-06-24

    IPC分类号: C07K16/00 C07K2/00

    摘要: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group(B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.

    摘要翻译: 公开了一种固定糖蛋白的方法。 提供一个表面。 接下来,硼酸与表面接触。 硼酸被表示为Y-R-B-(OH)2,并且包括硼酸基团(B-(OH)2),连接体R和官能团Y,其中硼酸键合到 通过官能团Y表面。糖蛋白与硼酸接触,其中碳水化合物链的两个空间上相邻的羟基与硼酸的硼酸基团形成硼酸酯以固定糖蛋白。 因此可以通过硼酸和Fc区的碳水化合物链的反应来实现位点特异性和共价蛋白固定而不干扰抗体对抗原的结合亲和力的目标。

    High-speed package design with suspended substrates and PCB
    4.
    发明授权
    High-speed package design with suspended substrates and PCB 有权
    高速封装设计,悬挂基板和PCB

    公开(公告)号:US06697260B1

    公开(公告)日:2004-02-24

    申请号:US10040421

    申请日:2001-10-29

    IPC分类号: H05K500

    CPC分类号: H05K5/0091

    摘要: An integrated high-speed package comprising a package housing having a housing lip and connector having a center pin abutting along a bottom surface of the housing lip. For signal registration of a first substrate to the signal lead, the substrate is “floated” up to the housing lip, which provides an alignment reference to ensure that the top surface of the first substrate is aligned and in direct registration with the signal lead. In another embodiment, the center pin to substrate registration is provided at a top surface of a housing base. The housing base preferably comprises a first portion of a first height and a second portion of a second height. Accordingly, the housing base can accommodate substrates of different thickness while allowing a top surface of the first and a second substrate to be coplanar to facilitate signal registration there between.

    摘要翻译: 一种集成的高速包装,包括具有壳体唇缘和连接器的封装壳体,所述壳体唇缘和连接器具有沿壳体唇缘的底表面邻接的中心销。 为了将第一衬底信号对准到信号引线,衬底“漂浮”到壳体唇缘,其提供对准参考,以确保第一衬底的顶表面对准并与信号引线直接对准。 在另一个实施例中,中心销到基板配准设置在壳体基座的顶表面处。 壳体基座优选地包括第一高度的第一部分和第二高度的第二部分。 因此,壳体基座可容纳不同厚度的衬底,同时允许第一和第二衬底的顶表面共面以促进其间的信号配准。

    Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages
    5.
    发明授权
    Apparatus and method for hermetically sealing and EMI shielding integrated circuits for high speed electronic packages 有权
    用于高速电子封装的气密密封和EMI屏蔽集成电路的装置和方法

    公开(公告)号:US06548893B1

    公开(公告)日:2003-04-15

    申请号:US09898567

    申请日:2001-07-03

    申请人: Yu Ju Chen Hui Wu

    发明人: Yu Ju Chen Hui Wu

    IPC分类号: H01L2312

    摘要: An apparatus and method for hermetically sealing, EMI shielding integrated circuits for high-speed electronic devices using a combination of microstrip to buried stripline interface for signal transmission from the integrated circuit. The packaging provided comprises a first plurality of microstrips interconnecting the integrated circuit to a plurality of buried striplines exposed on a surface of the main substrate. A ceramic interposer placed over the main substrate “buries” a portion of the exposed striplines on the main substrate to thereby insulate these signal paths from a hermetically sealing, and EMI shielding metal lid placed over the integrated circuit. The metal lid and the seal ring brazed over the ceramic interposer thus provide both a hermetic seal and an electric radiation block. A reduction in dispersion due to the buried striplines is also achieved, as well as improving jitter performance.

    摘要翻译: 用于密封的EMI屏蔽集成电路的EMI屏蔽集成电路,其使用微带与掩埋带状线接口的组合,用于从集成电路进行信号传输。 所提供的包装包括将集成电路互连到暴露在主衬底的表面上的多个掩埋带状线的第一多个微带。 放置在主基板上的陶瓷插入器将“暴露的带状线的一部分”埋入主基板上,从而将这些信号路径与放置在集成电路上的气密密封和EMI屏蔽金属盖绝缘。 钎焊在陶瓷插入件上的金属盖和密封环因此提供气密密封和电辐射块。 还实现了由于埋地带状线引起的色散的降低,并且提高了抖动性能。

    Directional beam steering system and method to detect location and motion
    7.
    发明授权
    Directional beam steering system and method to detect location and motion 有权
    定向波束转向系统和方法来检测位置和运动

    公开(公告)号:US08795082B2

    公开(公告)日:2014-08-05

    申请号:US13574586

    申请日:2011-01-13

    IPC分类号: A63F13/00

    摘要: A gaming system is disclosed comprising a console unit having a processor and transceiver circuitry. The transceiver circuitry couples to the processor and includes respective receiver and transmitter circuits. A first phased array antenna interface is employed to transmit and receive directional signals in response to the processor. The system employs a mobile game controller including a second phased array antenna interface to receive and redirect the directional signals back to the first phased array antenna interface. The processor generates proximity data based at least in part on a parameter associated with the directional signals, the proximity data representing the proximity of the mobile game controller with respect to the game console unit.

    摘要翻译: 公开了一种游戏系统,包括具有处理器和收发器电路的控制台单元。 收发器电路耦合到处理器并且包括相应的接收器和发射器电路。 采用第一相控阵天线接口来响应于处理器发送和接收定向信号。 该系统采用包括第二相控阵天线接口的移动游戏控制器,以将定向信号接收并重定向到第一相控阵天线接口。 处理器至少部分地基于与方向信号相关联的参数产生接近数据,邻近数据表示移动游戏控制器相对于游戏控制台单元的接近度。

    METHOD FOR ASSEMBLING HOUSING OF ELECTRONIC DEVICE AND HOUSING ASSEMBLY OF ELECTRONIC DEVICE
    8.
    发明申请
    METHOD FOR ASSEMBLING HOUSING OF ELECTRONIC DEVICE AND HOUSING ASSEMBLY OF ELECTRONIC DEVICE 审中-公开
    用于组装电子设备的外壳的方法和电子设备的外壳组件

    公开(公告)号:US20140125551A1

    公开(公告)日:2014-05-08

    申请号:US13711635

    申请日:2012-12-12

    IPC分类号: H01Q1/22

    摘要: A method for assembling a housing of an electronic device including the following steps is provided. An antenna pattern layer and an adhesive layer is provided, wherein the antenna pattern layer has a first surface opposite a second surface, and the adhesive layer is disposed on the first surface of the antenna pattern layer. A plastic frame is formed on the second surface of the antenna pattern layer by injection molding. The antenna pattern layer and the plastic frame are attached on a substrate via the adhesive layer. In addition, a housing assembly of an electronic device is also provided.

    摘要翻译: 提供一种用于组装电子设备的壳体的方法,包括以下步骤。 提供天线图案层和粘合剂层,其中天线图案层具有与第二表面相对的第一表面,并且粘合剂层设置在天线图案层的第一表面上。 通过注射成型在天线图案层的第二表面上形成塑料框架。 天线图案层和塑料框架通过粘合剂层附着在基底上。 此外,还提供了电子设备的壳体组件。

    ANTENNA-EMBEDDED ELECTRONIC DEVICE CASE
    10.
    发明申请
    ANTENNA-EMBEDDED ELECTRONIC DEVICE CASE 失效
    天线嵌入式电子设备

    公开(公告)号:US20110304514A1

    公开(公告)日:2011-12-15

    申请号:US13157328

    申请日:2011-06-10

    IPC分类号: H01Q1/24 H01P11/00

    CPC分类号: H01Q1/24 H01Q1/2266

    摘要: An antenna-embedded electronic device case includes an electrically-insulated case wall, a lower and an upper ground conductive layers, a lower and an upper electrically-insulated layer, and a continuous conductive layer. The lower ground conductive layer is in contact with the electrically-insulated case wall. The lower and upper electrically-insulated layers are sandwiched between the lower and upper ground conductive layers. The continuous conductive layer has a first portion sandwiched between the lower and upper electrically-insulated layers and a second portion protruding out to serve as an antenna radiator for transmitting or receiving electromagnetic signals.

    摘要翻译: 天线嵌入式电子设备壳体包括电绝缘壳体壁,下部和上部接地导电层,下部和上部电绝缘层以及连续导电层。 下部接地导电层与电绝缘壳体壁接触。 下部和上部电绝缘层夹在下部和上部接地导电层之间。 连续导电层具有夹在下电绝缘层和上电绝缘层之间的第一部分和突出地用作发射或接收电磁信号的天线辐射器的第二部分。