THERMALLY CONDUCTIVE MOLDING, PRODUCTION METHOD FOR THE SAME, STRUCTURE, AND MULTILAYER FILM

    公开(公告)号:US20220020663A1

    公开(公告)日:2022-01-20

    申请号:US17311458

    申请日:2019-12-09

    Abstract: The production method for a thermally conductive molding includes: preparing a first film that is disposed on a mold having a three-dimensional shape so as to conform to the three-dimensional shape, and that has a first layer and a second layer that is releasably adhered to the first layer on a surface opposite to the mold of the first layer; disposing a curable composition including a thermally conductive material and a (meth)acrylic monomer on the first film; disposing a second film on the curable composition and sandwiching the curable composition between the first film and the second film; radically polymerizing the (meth)acrylic monomer in the curable composition to form a cured product of the curable composition between the first film and the second film; and releasing the first layer from the second layer to obtain a thermally conductive molding including the second layer, the cured product, and the second film.

    RESIN COMPOSITION, GAP-FILLING ADHESIVE, PRODUCTION METHOD OF GAP-FILLING ADHESIVE, AND GAP FILLING METHOD

    公开(公告)号:US20210024790A1

    公开(公告)日:2021-01-28

    申请号:US16967297

    申请日:2019-02-05

    Abstract: A resin composition, including a radical-polymerizable compound, a cation-polymerizable compound, a photo radical photopolymerization initiator, and a photo cation photopolymerization initiator; wherein the resin composition has a range of wavelengths so that one of the photo radical photopolymerization initiator and the photo cation photopolymerization initiator has a molar absorption coefficient of 1 or greater, and the other has a molar absorption coefficient of 0.1 or less. A gap-filling adhesive which is a partially polymerized product of the resin composition. The gap-filling adhesive is capable of easily filling the gap in the body to be adhered.

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