-
公开(公告)号:US20190123686A1
公开(公告)日:2019-04-25
申请号:US15791227
申请日:2017-10-23
Applicant: ANALOG DEVICES, INC.
Inventor: Byungmoo Min , John A. Chiesa
IPC: H03B5/12
CPC classification number: H03B5/1265 , H03B5/1203 , H03B5/1231 , H03B5/1841 , H03B2200/0034 , H03B2200/004 , H03B2200/005 , H03B2200/009
Abstract: An LC tank circuit, such as an LC tank circuit of a step-tuned voltage controlled oscillator, includes an inductor and one or more capacitors. The inductor can be dog-bone shaped with a body, an extension and a chamfered joint to improve current distribution. The body and the extension can extend along different directions. The body can be narrower than the extension, and the extension can be sufficiently wide to interface with a plurality of switched capacitor circuits coupled to different parts of the extension.
-
公开(公告)号:US09929123B2
公开(公告)日:2018-03-27
申请号:US14733175
申请日:2015-06-08
Applicant: Analog Devices, Inc.
Inventor: Cemin Zhang , John A. Chiesa
CPC classification number: H01L24/81 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/15 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L2223/6627 , H01L2223/6661 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06051 , H01L2224/06135 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/17181 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/92125 , H01L2224/92163 , H01L2224/92247 , H01L2924/00014 , H01L2924/1423 , H03B5/1225 , H03B5/1243 , H03B2200/0008 , H03B2200/0076 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099
Abstract: Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.
-
公开(公告)号:US10469029B2
公开(公告)日:2019-11-05
申请号:US15791227
申请日:2017-10-23
Applicant: ANALOG DEVICES, INC.
Inventor: Byungmoo Min , John A. Chiesa
Abstract: An LC tank circuit, such as an LC tank circuit of a step-tuned voltage controlled oscillator, includes an inductor and one or more capacitors. The inductor can be dog-bone shaped with a body, an extension and a chamfered joint to improve current distribution. The body and the extension can extend along different directions. The body can be narrower than the extension, and the extension can be sufficiently wide to interface with a plurality of switched capacitor circuits coupled to different parts of the extension.
-
公开(公告)号:US10461696B2
公开(公告)日:2019-10-29
申请号:US15791250
申请日:2017-10-23
Applicant: Analog Devices, Inc.
Inventor: Byungmoo Min , John A. Chiesa
Abstract: An LC tank circuit, such as an LC tank circuit of a step-tuned voltage controlled oscillator, includes a plurality of switched capacitor banks and one or more inductors. A first switched capacitor bank switch in response to a range of control signals used to control the VCO output across a range of frequencies. A second switched capacitor bank can switch in response to a subset of the range of control signals used to control the VCO output across a subset of the range of frequencies. The control scheme for the first and second switched capacitor banks can improves the linearity of changes in the frequency of the output signal of the VCO.
-
公开(公告)号:US20190123687A1
公开(公告)日:2019-04-25
申请号:US15791250
申请日:2017-10-23
Applicant: Analog Devices, Inc.
Inventor: Byungmoo Min , John A. Chiesa
IPC: H03B5/12
CPC classification number: H03B5/1265 , H03B5/1203 , H03B5/1231 , H03B5/1841 , H03B5/1847 , H03B2200/0034 , H03B2200/004 , H03B2200/005 , H03B2200/009 , H03B2201/0266
Abstract: An LC tank circuit, such as an LC tank circuit of a step-tuned voltage controlled oscillator, includes a plurality of switched capacitor banks and one or more inductors. A first switched capacitor bank switch in response to a range of control signals used to control the VCO output across a range of frequencies. A second switched capacitor bank can switch in response to a subset of the range of control signals used to control the VCO output across a subset of the range of frequencies. The control scheme for the first and second switched capacitor banks can improves the linearity of changes in the frequency of the output signal of the VCO.
-
公开(公告)号:US09520356B1
公开(公告)日:2016-12-13
申请号:US14849395
申请日:2015-09-09
Applicant: Analog Devices, Inc.
Inventor: John A. Chiesa , Cemin Zhang , Byungmoo Min , Ekrem Oran , John N. Poelker
IPC: H01L23/522 , H01L23/552 , H01L23/498 , H01L23/66 , H03L7/24 , H01L21/48
CPC classification number: H01L23/5226 , H01L23/3121 , H01L23/3677 , H01L23/49827 , H01L23/49838 , H01L23/544 , H01L23/552 , H01L23/66 , H01L2223/5442 , H01L2223/54426 , H01L2223/54486 , H01L2223/6683 , H01L2224/16145 , H01P3/00 , H03L7/24
Abstract: A die is packaged by flip-chip mounting the die with the active side facing a low loss substrate. A ground plane is coupled to the active side of the die by vias through the low loss substrate. The ground plane is positioned to concentrate high frequency electromagnetic fields in the low loss substrate. A tuning height can be adjusted to tune the center frequency of a circuit in the die.
Abstract translation: 芯片通过倒装芯片封装,芯片的主动侧面向低损耗基板。 接地平面通过通孔穿过低损耗衬底耦合到管芯的有源侧。 地平面被定位成将高频电磁场集中在低损耗衬底中。 可以调整调谐高度以调整芯片中电路的中心频率。
-
公开(公告)号:US20160359456A1
公开(公告)日:2016-12-08
申请号:US14733175
申请日:2015-06-08
Applicant: Analog Devices, Inc.
Inventor: Cemin Zhang , John A. Chiesa
CPC classification number: H01L24/81 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/15 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L2223/6627 , H01L2223/6661 , H01L2223/6683 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05555 , H01L2224/06051 , H01L2224/06135 , H01L2224/13025 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/17181 , H01L2224/2919 , H01L2224/32145 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73204 , H01L2224/73207 , H01L2224/73265 , H01L2224/81191 , H01L2224/81192 , H01L2224/81815 , H01L2224/92125 , H01L2224/92163 , H01L2224/92247 , H01L2924/00014 , H01L2924/1423 , H03B5/1225 , H03B5/1243 , H03B2200/0008 , H03B2200/0076 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/45099
Abstract: Aspects of this disclosure relate to a first die includes an LC resonant circuit including a first capacitive element, such as a capacitor or a varactor, and an inductive element. The LC resonant circuit is configured to generate a signal having a frequency of oscillation. The first die includes bump pads electrically coupled to both ends of the first capacitive element. A second die can be flip chip mounted on the first die. Bumps can electrically connect a second capacitive element of the second die in parallel with the first capacitive element of the first die. This can increase the Q factor of the LC resonant circuit.
Abstract translation: 本公开的方面涉及第一管芯包括LC谐振电路,其包括诸如电容器或变容二极管的第一电容元件和电感元件。 LC谐振电路被配置为产生具有振荡频率的信号。 第一裸片包括电耦合到第一电容元件的两端的凸块。 可以将第二裸片倒装安装在第一裸片上。 碰撞可以将第二管芯的第二电容元件与第一管芯的第一电容元件并联电连接。 这可以增加LC谐振电路的Q因子。
-
-
-
-
-
-