公开(公告)号：US11996315B2

公开(公告)日：2024-05-28

申请号：US16951823

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68721 ,  C23C16/45536 ,  C23C16/4582 ,  C23C16/4585 ,  H01L21/02656 ,  H01L21/67017 ,  H01L21/6833

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

公开(公告)号：USD1059312S1

公开(公告)日：2025-01-28

申请号：US29848747

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Designer： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Diego Ramiro Puente Sotomayor ,  Qanit Takmeel ,  Mohammad Kamruzzaman Chowdhury ,  Arun Chakravarthy Chakravarthy

公开(公告)号：US12100579B2

公开(公告)日：2024-09-24

申请号：US16951805

申请日：2020-11-18

Applicant: Applied Materials, Inc.

Inventor： Abhishek Chowdhury ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Nataraj Bhaskar Rao ,  Siqing Lu

IPC: H01J37/32 ,  C23C14/00 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C16/458

CPC classification number: H01J37/32642 ,  C23C14/3407 ,  C23C14/35 ,  C23C14/50 ,  C23C16/4585 ,  H01J37/32715 ,  H01J2237/20235 ,  H01J2237/332

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.

公开(公告)号：USD1069863S1

公开(公告)日：2025-04-08

申请号：US29848746

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Designer： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Diego Ramiro Puente Sotomayor ,  Qanit Takmeel ,  Mohammad Kamruzzaman Chowdhury ,  Arun Chakravarthy Chakravarthy

公开(公告)号：USD1064005S1

公开(公告)日：2025-02-25

申请号：US29848745

申请日：2022-08-04

Applicant: Applied Materials, Inc.

Designer： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Diego Ramiro Puente Sotomayor ,  Qanit Takmeel ,  Mohammad Kamruzzaman Chowdhury ,  Arun Chakravarthy Chakravarthy

公开(公告)号：USD1038049S1

公开(公告)日：2024-08-06

申请号：US29758812

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Designer： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

Abstract: FIG. 1 is a bottom isometric view of a cover ring for use in a semiconductor processing chamber in accordance with some embodiments.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines in the drawings illustrate portions of the cover ring for use in a semiconductor processing chamber that form no part of the claimed design.

公开(公告)号：US11881375B2

公开(公告)日：2024-01-23

申请号：US17232078

申请日：2021-04-15

Applicant: Applied Materials, Inc.

Inventor： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Siqing Lu ,  Ravikumar Patil

IPC: H01J37/08 ,  H01J37/32 ,  H01J37/24 ,  H01J37/248

CPC classification number: H01J37/08 ,  H01J37/248 ,  H01J37/32642 ,  H01J2237/24564 ,  H01J2237/3328

Abstract: Embodiments of a lift apparatus for use in a substrate processing chamber are provided herein. In some embodiments, a lift apparatus includes: a plurality of first lift pin assemblies configured to raise or lower a substrate having a given diameter when disposed thereon, wherein each of the first lift pin assemblies includes a first lift pin disposed on a first bellows assembly; a plurality of second lift pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber component, wherein each of the second lift pin assemblies includes a second lift pin disposed on a second bellows assembly; an actuator; and a lift assembly coupled to the actuator and configured to raise or lower each of the first lift pin assemblies and the second lift pin assemblies by movement of the actuator.