公开(公告)号：USD1038049S1

公开(公告)日：2024-08-06

申请号：US29758812

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Designer： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

Abstract: FIG. 1 is a bottom isometric view of a cover ring for use in a semiconductor processing chamber in accordance with some embodiments.
FIG. 2 is a top plan view thereof.
FIG. 3 is a bottom plan view thereof.
FIG. 4 is a front elevation view thereof.
FIG. 5 is a back elevation view thereof.
FIG. 6 is a right side elevation view thereof; and,
FIG. 7 is a left side elevation view thereof.
The broken lines in the drawings illustrate portions of the cover ring for use in a semiconductor processing chamber that form no part of the claimed design.

公开(公告)号：US11881375B2

公开(公告)日：2024-01-23

申请号：US17232078

申请日：2021-04-15

Applicant: Applied Materials, Inc.

Inventor： Abhishek Chowdhury ,  Nataraj Bhaskar Rao ,  Siqing Lu ,  Ravikumar Patil

IPC: H01J37/08 ,  H01J37/32 ,  H01J37/24 ,  H01J37/248

CPC classification number: H01J37/08 ,  H01J37/248 ,  H01J37/32642 ,  H01J2237/24564 ,  H01J2237/3328

Abstract: Embodiments of a lift apparatus for use in a substrate processing chamber are provided herein. In some embodiments, a lift apparatus includes: a plurality of first lift pin assemblies configured to raise or lower a substrate having a given diameter when disposed thereon, wherein each of the first lift pin assemblies includes a first lift pin disposed on a first bellows assembly; a plurality of second lift pin assemblies arranged in a circle having a diameter greater than the given diameter and configured to raise or lower an annular chamber component, wherein each of the second lift pin assemblies includes a second lift pin disposed on a second bellows assembly; an actuator; and a lift assembly coupled to the actuator and configured to raise or lower each of the first lift pin assemblies and the second lift pin assemblies by movement of the actuator.

公开(公告)号：US20220285133A1

公开(公告)日：2022-09-08

申请号：US17189728

申请日：2021-03-02

Applicant: Applied Materials, Inc.

Inventor： Abhishek Chowdhury ,  Jon Christian Farr ,  Ravikumar Patil ,  Eller Juco ,  Yi Zheng ,  Siqing Lu

IPC: H01J37/32

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, an apparatus for processing a substrate comprises a top delivery gas nozzle configured to direct process gas toward a substrate support surface of a substrate support and a side delivery gas nozzle configured to direct the process gas toward a side surface of the substrate support, a first gas line connected to the top delivery gas nozzle, a second gas line connected to the side delivery gas nozzle, and a plurality of valves connected to the first gas line and the second gas line for providing process gas to the processing volume of the processing chamber, and a first orifice flow restrictor or a first needle valve connected to the first gas line or a second orifice flow restrictor or a second needle valve connected to the second gas line.

公开(公告)号：US11996315B2

公开(公告)日：2024-05-28

申请号：US16951823

申请日：2020-11-18

Applicant: APPLIED MATERIALS, INC.

Inventor： Abhishek Chowdhury ,  Harisha Sathyanarayana ,  Edwin C. Suarez ,  Siqing Lu ,  Nataraj Bhaskar Rao

IPC: H01L21/687 ,  C23C16/455 ,  C23C16/458 ,  H01L21/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/68721 ,  C23C16/45536 ,  C23C16/4582 ,  C23C16/4585 ,  H01L21/02656 ,  H01L21/67017 ,  H01L21/6833

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a cover ring for use in a process chamber includes: an annular body that includes an upper surface and a lower surface, an inner lip extending radially inward and downward from the annular body, and a plurality of protrusions extending downward from the inner lip and disposed at regular intervals along the inner lip, wherein lowermost surfaces of the plurality of protrusions together define a planar substrate contact surface.

公开(公告)号：US12100579B2

公开(公告)日：2024-09-24

申请号：US16951805

申请日：2020-11-18

Applicant: Applied Materials, Inc.

Inventor： Abhishek Chowdhury ,  Edwin C. Suarez ,  Harisha Sathyanarayana ,  Nataraj Bhaskar Rao ,  Siqing Lu

IPC: H01J37/32 ,  C23C14/00 ,  C23C14/34 ,  C23C14/35 ,  C23C14/50 ,  C23C16/458

CPC classification number: H01J37/32642 ,  C23C14/3407 ,  C23C14/35 ,  C23C14/50 ,  C23C16/4585 ,  H01J37/32715 ,  H01J2237/20235 ,  H01J2237/332

Abstract: Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.

公开(公告)号：US09685655B2

公开(公告)日：2017-06-20

申请号：US14773146

申请日：2014-03-06

Applicant: Applied Materials, Inc.

Inventor： Fei C. Wang ,  Hooman Bolandi ,  Connie P. Wang ,  Victor Pebenito ,  Siqing Lu ,  Michael C. Kutney ,  Joseph G. Gordon ,  Robert Z. Bachrach

IPC: B05B5/025 ,  H01M4/04 ,  H01M4/139 ,  H01M4/1391 ,  B05B13/02 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/1397 ,  H01M4/36

CPC classification number: H01M4/0419 ,  B05B5/025 ,  B05B13/0221 ,  H01M4/0404 ,  H01M4/139 ,  H01M4/1391 ,  H01M4/1393 ,  H01M4/1395 ,  H01M4/1397 ,  H01M4/366

Abstract: A method and apparatus for forming battery active material on a substrate are disclosed. In one embodiment, an apparatus for depositing a battery active material on a surface of a substrate includes a substrate conveyor system for transporting the substrate within the apparatus, a material spray assembly disposed above the substrate conveyor system, and a first heating element disposed adjacent to the material spray assembly above the substrate conveyor system configured to heat the substrate. The material spray assembly has a 2-D array of nozzles configured to electrospray an electrode forming solution on the surface of the substrate.