Abstract:
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured to preferentially absorb radiation having the given wavelength; wherein the absorbing and reflective regions are arranged to form a patterned radiation beam reflected from the marker when illuminated with radiation, and wherein the reflective regions comprise a roughened reflective surface, the roughened reflective surface being configured to diffuse radiation reflected from the reflective regions, and wherein the roughened reflective surface has a root mean squared roughness of about an eighth of the given wavelength or more.
Abstract:
A method including obtaining calculated wavefront phase information caused by a three-dimensional topography of a pattern of a lithographic patterning device, and computing, using a computer processor, an imaging effect of the three-dimensional topography of the patterning device pattern based on the calculated wavefront information.
Abstract:
A method including obtaining wavefront phase information caused by a three-dimensional topography of a pattern of a lithographic patterning device, and based on the wavefront phase information, adjusting a physical parameter of the pattern.
Abstract:
A method including, for an illumination by radiation of a pattern of a lithographic patterning device, obtaining calculated wavefront phase information caused by three-dimensional topography of the pattern, and based on the wavefront phase information, adjusting a parameter of the illumination and/or adjusting a parameter of the pattern.
Abstract:
A method of forming a plurality of regularly spaced lithography features, e.g. contact holes, including: providing a trench on a substrate, the trench having opposing side-walls and a base, with the side-walls having a width therebetween, wherein the trench is formed by photolithography including exposing the substrate using off-axis illumination whereby a modulation is provided to the side-walls of the trench; providing a self-assemblable block copolymer having first and second blocks in the trench; causing the self-assemblable block copolymer to self-assemble into an ordered layer in the trench, the layer having first domains of the first block and second domains of the second block; and selectively removing the first domain to form at least one regularly spaced row of lithography features having the second domain along the trench.
Abstract:
A method of lithography in a lithographic apparatus configured to transfer a pattern from a patterning device onto a substrate, the method including: determining a dose sensitivity of at least part of the pattern at a plurality of values of a dose, wherein the dose sensitivity is not a monotonically increasing or monotonically decreasing function of the dose. A computer product including a processor, a memory and a storage device, wherein the storage device at least stores values of, or a function describing, a dose sensitivity of at least part of a lithographic pattern at a plurality of values of dose, wherein the dose sensitivity is not a monotonically increasing or monotonically decreasing function of the dose.
Abstract:
A lithographic mask has a substrate substantially transmissive for radiation of a certain wavelength, the substrate having a radiation absorbing material in an arrangement, the arrangement configured to apply a pattern to a cross-section of a radiation beam of the certain wavelength, wherein the absorbing material has a thickness which is substantially equal to the certain wavelength divided by a refractive index of the absorbing material.
Abstract:
In an immersion lithography apparatus or device manufacturing method, the position of focus of the projected image is changed during imaging to increase focus latitude. In an embodiment, the focus may be varied using the liquid supply system of the immersion lithographic apparatus.
Abstract:
A patterning device comprising a reflective marker, wherein the marker comprises: a plurality of reflective regions configured to preferentially reflect radiation having a given wavelength; and a plurality of absorbing regions configured to preferentially absorb radiation having the given wavelength; wherein the absorbing and reflective regions are arranged to form a patterned radiation beam reflected from the marker when illuminated with radiation, and wherein the reflective regions comprise a roughened reflective surface, the roughened reflective surface being configured to diffuse radiation reflected from the reflective regions, and wherein the roughened reflective surface has a root mean squared roughness of about an eighth of the given wavelength or more.
Abstract:
A method includes measuring properties of a three-dimensional topography of a lithographic patterning device, the patterning device including a pattern and being constructed and arranged to produce a pattern in a cross section of a projection beam of radiation in a lithographic projection system, calculating wavefront phase effects resulting from the measured properties, incorporating the calculated wavefront phase effects into a lithographic model of the lithographic projection system, and determining, based on the lithographic model incorporating the calculated wavefront phase effects, parameters for use in an imaging operation using the lithographic projection system.