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    Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures
    1.
    发明申请
    Electrochemically Fabricated Hermetically Sealed Microstructures and Methods of and Apparatus for Producing Such Structures 审中-公开
    电化学制造的密封微结构，以及用于生产这种结构的方法和装置

    公开(公告)号：US20080105558A1

    公开(公告)日：2008-05-08

    申请号：US11927680

    申请日：2007-10-30

    申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

    发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

    IPC分类号： C25D5/10

    CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

    摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

    摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

    Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures
    2.
    发明申请
    Electrochemically fabricated hermetically sealed microstructures and methods of and apparatus for producing such structures 审中-公开
    电化学制造的密封微结构，以及用于生产这种结构的方法和装置

    公开(公告)号：US20070045121A1

    公开(公告)日：2007-03-01

    申请号：US11435809

    申请日：2006-05-16

    申请人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

    发明人： Adam Cohen ,  Michael Lockard ,  Dennis Smalley ,  Vacit Arat ,  Christopher Bang ,  John Dixon

    IPC分类号： C25D5/02

    CPC分类号： B81C1/00293 ,  B81B2201/042 ,  B81C1/00333 ,  B81C2201/0197 ,  B81C2203/0145 ,  C25D1/003 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H05K3/4647

    摘要： In some embodiments, multilayer structures are electrochemically fabricated from at least one structural material (e.g. nickel), at least one sacrificial material (e.g. copper), and at least one sealing material (e.g. solder). In some embodiments, the layered structure is made to have a desired configuration which is at least partially and immediately surrounded by sacrificial material which is in turn surrounded almost entirely by structural material. The surrounding structural material includes openings in the surface through which etchant can attack and remove trapped sacrificial material found within. Sealing material is located near the openings. After removal of the sacrificial material, the box is evacuated or filled with a desired gas or liquid. Thereafter, the sealing material is made to flow, seal the openings, and resolidify. In other embodiments, a post-layer formation lid or other enclosure completing structure is added.

    摘要翻译： 在一些实施例中，多层结构由至少一种结构材料（例如镍），至少一种牺牲材料（例如铜）和至少一种密封材料（例如焊料）进行电化学制造。 在一些实施例中，层状结构被制成具有至少部分地且立即被牺牲材料包围的期望构型，牺牲材料又被几乎完全由结构材料包围。 周围的结构材料包括在表面中的开口，蚀刻剂可以通过该开口攻击和去除在其内发现的被捕获的牺牲材料。 密封材料位于开口附近。 在除去牺牲材料之后，将盒子抽空或填充所需的气体或液体。 此后，使密封材料流动，密封开口并重新固化。 在其他实施例中，添加了后层形成盖或其它外壳完成结构。

    Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making
    3.
    发明申请
    Microdevices for Tissue Approximation and Retention, Methods for Using, and Methods for Making 审中-公开
    用于组织近似和保留的微型装置，使用方法和制造方法

    公开(公告)号：US20070198038A1

    公开(公告)日：2007-08-23

    申请号：US11625807

    申请日：2007-01-22

    申请人： Adam Cohen ,  Vacit Arat ,  Dennis Smalley

    发明人： Adam Cohen ,  Vacit Arat ,  Dennis Smalley

    IPC分类号： A61B17/04

    CPC分类号： A61B17/0401 ,  A61B17/0469 ,  A61B17/0482 ,  A61B17/0487 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/0462 ,  A61B2017/0488 ,  A61B2017/0496 ,  A61B2017/06052 ,  A61B2017/06176 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

    摘要： Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.

    摘要翻译： 本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。 在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀， 然后可以使得彼此移动以使两个组织区域进入更靠近的位置。 在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。

    Microprobe tips and methods for making
    5.
    发明申请
    Microprobe tips and methods for making 有权
    微型笔尖和制作方法

    公开(公告)号：US20060109016A1

    公开(公告)日：2006-05-25

    申请号：US11244817

    申请日：2005-10-06

    申请人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

    发明人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

    IPC分类号： G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

    摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

    摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

    Three-dimensional structures having feature sizes smaller than a minimum feature size and methods for fabricating
    7.
    发明申请
    Three-dimensional structures having feature sizes smaller than a minimum feature size and methods for fabricating 有权
    特征尺寸小于最小特征尺寸的三维结构和制造方法

    公开(公告)号：US20050126916A1

    公开(公告)日：2005-06-16

    申请号：US10949744

    申请日：2004-09-24

    申请人： Michael Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis Smalley

    发明人： Michael Lockard ,  Adam Cohen ,  Vacit Arat ,  Dennis Smalley

    IPC分类号： C25D1/00 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  C25D7/00 ,  H01M4/02

    CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

    摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

    摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

    Electrochemically fabricated microprobes
    9.
    发明申请
    Electrochemically fabricated microprobes 审中-公开
    电化学制造的微型纺织品

    公开(公告)号：US20080100315A1

    公开(公告)日：2008-05-01

    申请号：US11928398

    申请日：2007-10-30

    申请人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

    发明人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

    IPC分类号： G01R1/067

    CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

    摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

    摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

    Microprobe tips and methods for making
    10.
    发明申请
    Microprobe tips and methods for making 审中-公开
    微型笔尖和制作方法

    公开(公告)号：US20050104609A1

    公开(公告)日：2005-05-19

    申请号：US10772943

    申请日：2004-02-04

    申请人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel J. Kruglick ,  Richard Chen ,  Kieun Kim

    发明人： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel J. Kruglick ,  Richard Chen ,  Kieun Kim

    IPC分类号： G01R1/067 ,  G01R3/00 ,  G01R31/02

    CPC分类号： G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

    摘要： Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

    摘要翻译： 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。