公开(公告)号：US08767399B2

公开(公告)日：2014-07-01

申请号：US13528543

申请日：2012-06-20

申请人： Akira Goto ,  Shigemasa Sato

发明人： Akira Goto ,  Shigemasa Sato

IPC分类号： H05K7/20

CPC分类号： H05K7/20836 ,  H05K7/20209 ,  H05K7/20736

摘要： The cooling system includes: a frame; a plurality of electronic devices disposed in the frame and operating or functioning independently from each other; fans disposed in the frame and supplying cooling air to the electronic devices; a temperature acquiring portion for acquiring the temperature of the cooling air; an air-flow resistance adjusting portion for adjusting the air-flow resistance to the cooling air; and a controller for controlling the fans and the each air-flow resistance adjusting portion. The controller determines each target cooling air volume required for cooling each electronic device to a predetermined temperature based on temperature information acquired by the temperature acquiring portion and heat generation information on each electronic device, controls each air-flow resistance adjusting portion to set the volume of cooling air to each target cooling air volume, and performs the drive control of the fans to set the volume of cooling air to the minimum necessary.

摘要翻译： 冷却系统包括：框架; 设置在所述框架中并且彼此独立地操作或起作用的多个电子设备; 风扇设置在框架中并向电子设备供应冷却空气; 用于获取冷却空气的温度的温度获取部分; 用于调节对冷却空气的气流阻力的气流阻力调节部; 以及用于控制风扇和每个气流阻力调节部的控制器。 控制器基于由温度获取部获取的温度信息和每个电子设备上的发热信息确定将每个电子设备冷却到预定温度所需的每个目标冷却空气量，控制每个气流阻力调节部分，以设定 将空气冷却到每个目标冷却风量，并且执行风扇的驱动控制以将冷却空气的体积设置为必需的最小值。

公开(公告)号：US09676052B2

公开(公告)日：2017-06-13

申请号：US13375579

申请日：2010-06-02

申请人： Akira Goto ,  Yushi Aoki

发明人： Akira Goto ,  Yushi Aoki

IPC分类号： B23K11/00 ,  B23K11/31 ,  B23K11/11 ,  B23K11/36

CPC分类号： B23K11/315 ,  B23K11/115 ,  B23K11/36

摘要： A resistance welding method for welding a stack of three or more workpieces. The method includes the steps of holding a first welding tip in abutment against a first outermost workpiece, holding a second welding tip in abutment against a second outermost workpiece, and holding a pressing member in abutment against the first outermost workpiece. The method also includes the steps of gripping the stacked assembly with the first welding tip, the second welding tip, and the pressing member and passing an electric current between the first welding electrode and the second welding electrode.

公开(公告)号：US08872313B2

公开(公告)日：2014-10-28

申请号：US13322336

申请日：2009-05-26

申请人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

发明人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

IPC分类号： B65D81/113 ,  B65D5/50 ,  B65D85/38

CPC分类号： B65D5/5061 ,  B65D85/38

摘要： A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

摘要翻译： 封装装置用于封装包括形成的基板，模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括：保持单元，其具有插入槽并且用于保持功率半导体器件，插入槽各自为开口，功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中，开口的边缘形成 与模具部件和基板接触; 以及容纳盒，其包含保持单元。 插入槽被提供到保持单元，使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。

公开(公告)号：US20130153544A1

公开(公告)日：2013-06-20

申请号：US13820623

申请日：2011-09-05

申请人： Akira Goto ,  Shinichi Miyasaka ,  Tatsuro Ikeda ,  Yushi Aoki ,  Mitsutaka Igaue

发明人： Akira Goto ,  Shinichi Miyasaka ,  Tatsuro Ikeda ,  Yushi Aoki ,  Mitsutaka Igaue

IPC分类号： B23K11/00

CPC分类号： B23K11/115 ,  B23K11/314 ,  B23K11/36 ,  B23K37/0435 ,  B23K2101/18 ,  B23K2103/04 ,  B23K2103/14

摘要： A resistance welding device is provided with a lower tip and an upper tip that serve as welding tips, and pressing rods that serve as pressing members. The upper tip and the pressing rods press a stacked body, which is to be welded, from the metallic plate side, which is the outermost member of the stacked body. The lower tip presses the stacked body from the lowermost metallic plate side. In this state, and electric current is conducted from the upper tip to the lower tip.

摘要翻译： 电阻焊装置具有作为焊接头的下端和上端，以及用作按压构件的按压杆。 上端部和按压棒从作为层叠体的最外侧部件的金属板侧按压被焊接的层叠体。 下端从最下面的金属板侧挤压层叠体。 在这种状态下，电流从上端到下端传导。

公开(公告)号：US20130065144A1

公开(公告)日：2013-03-14

申请号：US13637793

申请日：2011-03-23

申请人： Yasushi Hashimoto ,  Akira Goto ,  Emi Imaki

发明人： Yasushi Hashimoto ,  Akira Goto ,  Emi Imaki

IPC分类号： H01M8/06 ,  B01J7/00

CPC分类号： H01M8/06 ,  B01J7/00 ,  B01J8/0465 ,  B01J8/0469 ,  B01J8/0496 ,  B01J2208/00212 ,  B01J2208/00283 ,  B01J2208/00504 ,  C01B3/38 ,  C01B3/48 ,  C01B3/583 ,  C01B2203/0233 ,  C01B2203/0288 ,  C01B2203/044 ,  C01B2203/047 ,  C01B2203/066 ,  C01B2203/0816 ,  C01B2203/0894 ,  C01B2203/127 ,  C01B2203/1294 ,  C01B2203/82 ,  H01M8/0618 ,  H01M8/0675

摘要： A hydrogen production apparatus includes a preferential oxidation unit that preferentially oxidizes carbon monoxide in a reformed gas containing hydrogen, a vaporization flow path that passes water to generate steam, and a gas flow path through which the reformed gas passes. The gas flow path is arranged between the preferential oxidation unit and the vaporization flow path. The reformed gas passes through the gas flow path and thereafter flows into the preferential oxidation unit.

摘要翻译： 氢制造装置包括：优先氧化含氢气的重整气体中的一氧化碳的优先氧化单元，通过水以产生蒸汽的蒸发流路以及重整气体通过的气体流路。 气体流路设置在优先氧化单元和蒸发流路之间。 重整气体通过气体流路，然后流入优先氧化单元。

公开(公告)号：US20120229554A1

公开(公告)日：2012-09-13

申请号：US13414064

申请日：2012-03-07

申请人： Akira Goto

发明人： Akira Goto

IPC分类号： B41J2/17

CPC分类号： B41J2/162 ,  B41J2/14024 ,  B41J2/1433 ,  B41J2/1623

摘要： A liquid discharge head includes a recording element substrate having a discharge-port surface having a discharge port discharging a liquid, side surfaces on sides of the discharge-port surface, and a back surface of the discharge-port surface having an opening of an ink supplying port supplying ink to the discharge port; a supporting member having a depression accommodating the recording element substrate, the depression including a supporting part disposed at a bottom surface of the depression and supporting the recording element substrate with an adhesive and an opening of an ink channel communicating with the ink supplying port; and an electric wiring substrate disposed on a surface of the supporting member having the depression and having an electric connecting part connecting with a side of the discharge-port surface of the recording element substrate.

摘要翻译： 液体排出头包括具有排出口的排出口表面的记录元件基底，排出口排出液体，排出口表面侧面的侧表面和具有墨水开口的排出口表面的后表面 向排出口供给墨水供给口; 具有容纳所述记录元件基板的凹部的支撑部件，所述凹部包括设置在所述凹部的底面的支撑部，并且用粘合剂支撑所述记录元件基板，并且与所述供墨口连通的墨水通道的开口; 以及布置在具有所述凹部的所述支撑构件的表面上并具有与所述记录元件基板的所述排出口表面的一侧连接的电连接部的电布线基板。

公开(公告)号：US08253056B2

公开(公告)日：2012-08-28

申请号：US12749771

申请日：2010-03-30

申请人： Akira Goto

发明人： Akira Goto

IPC分类号： B23K11/00

CPC分类号： B23K11/115 ,  B23K11/0026 ,  B23K11/30

摘要： A resistance welding apparatus includes a welding gun having a first electrode tip serving as a first welding electrode, a second electrode tip serving as a second welding electrode, and a current branching electrode. The current branching electrode has an annular shape and is disposed in surrounding relation to the first electrode tip. The first electrode tip and the current branching electrode abut against a thinnest workpiece disposed on an outermost side of a stacked assembly that is resistance-welded by the resistance welding apparatus, and have opposite polarities to each other. When an electric current is passed from the first electrode tip to the second electrode tip and through the stacked assembly, a branched electric current flows from the first electrode tip to the current branching electrode.

摘要翻译： 电阻焊接装置包括具有作为第一焊接电极的第一电极端头，作为第二焊接电极的第二电极端子和电流分支电极的焊枪。 当前的分支电极具有环形形状并且围绕第一电极尖端设置。 第一电极端和电流分支电极抵靠设置在由电阻焊接装置进行电阻焊接的层叠组件的最外侧的最薄的工件，并且彼此具有相反的极性。 当电流从第一电极尖端通过第二电极尖端并通过堆叠组件时，分支电流从第一电极尖端流到电流分支电极。

公开(公告)号：US08226865B2

公开(公告)日：2012-07-24

申请号：US12581307

申请日：2009-10-19

申请人： Yoshimasa Kobayashi ,  Akira Goto ,  Yuji Katsuda ,  Naohito Yamada

发明人： Yoshimasa Kobayashi ,  Akira Goto ,  Yuji Katsuda ,  Naohito Yamada

IPC分类号： B29C67/00

CPC分类号： C04B35/581 ,  C04B35/62815 ,  C04B35/645 ,  C04B37/001 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3865 ,  C04B2235/445 ,  C04B2235/656 ,  C04B2235/72 ,  C04B2235/77 ,  C04B2235/786 ,  C04B2235/80 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2235/9692 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/366 ,  H01L21/316 ,  H01L21/318

摘要： The aluminum-nitride-based composite material according to the present invention is an aluminum-nitride-based composite material that is highly pure with the content ratios of transition metals, alkali metals, and boron, respectively as low as 1000 ppm or lower, has AlN and MgO constitutional phases, and additionally contains at least one selected from the group consisting of a rare earth metal oxide, a rare earth metal-aluminum complex oxide, an alkali earth metal-aluminum complex oxide, a rare earth metal oxyfluoride, calcium oxide, and calcium fluoride, wherein the heat conductivity is in the range of 40 to 150 W/mK, the thermal expansion coefficient is in the range of 7.3 to 8.4 ppm/° C., and the volume resistivity is 1×1014 Ω·cm or higher.

公开(公告)号：US20120074543A1

公开(公告)日：2012-03-29

申请号：US13322336

申请日：2009-05-26

申请人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

发明人： Takayuki Ushio ,  Yoshihisa Oguri ,  Akira Goto ,  Jyunya Kanazawa

IPC分类号： H01L23/552

CPC分类号： B65D5/5061 ,  B65D85/38

摘要： A package apparatus is for packaging a power semiconductor device that includes a substrate formed, a mold part molded on the substrate, and electrode terminals extended from the mold part to a side opposite from the substrate by a predetermined length; includes: a holding unit that has insertion slots and is to holding the power semiconductor device, the insertion slots each being an opening into which the power semiconductor device is insertable in a direction perpendicular to extending direction of the electrode, edges of the opening being formed to make contact with the mold part and the substrate; and a container box that contains the holding unit. The insertion slots are provided to the holding unit so that an interval between the insertion slots in an extending direction of the electrode terminals of the power semiconductor device inserted is greater than the extending length of the electrode terminals.

摘要翻译： 封装装置用于封装包括形成的基板，模制在基板上的模具部件和从模具部件延伸到与基板相对的一侧预定长度的电极端子的功率半导体器件; 包括：保持单元，其具有插入槽并且用于保持功率半导体器件，插入槽各自为开口，功率半导体器件可以沿着与电极的延伸方向垂直的方向插入到其中，开口的边缘形成 与模具部件和基板接触; 以及容纳盒，其包含保持单元。 插入槽被提供到保持单元，使得插入的功率半导体器件的电极端子的延伸方向上的插入槽之间的间隔大于电极端子的延伸长度。

公开(公告)号：US08087749B2

公开(公告)日：2012-01-03

申请号：US11916755

申请日：2007-04-23

申请人： Akira Goto ,  Minoru Nozawa ,  Yoshiyuki Toge ,  Tadayoshi Inamoto

发明人： Akira Goto ,  Minoru Nozawa ,  Yoshiyuki Toge ,  Tadayoshi Inamoto

IPC分类号： B41J2/14 ,  B41J2/04

CPC分类号： B41J2/1753 ,  B41J2/17536 ,  B41J2/17553 ,  B41J2/17559

摘要： An ink jet recording head has an array of ink ejection outlets in an ejection outlet forming surface, to which a protection tape is adhered during transportation. The ejection outlet forming surface has an outside area which is outside of each of opposite ends of the array with respect to a direction of the array, and the outside area has a peel resistance, provided by surface modification, which resistance is higher than in another portion of the ejection outlet forming surface.

摘要翻译： 喷墨记录头在喷射出口形成表面中具有喷墨出口阵列，在运输期间保护带被粘附到喷墨口形成表面上。 喷射出口形成表面具有相对于阵列的方向在阵列的每个相对端的外侧的外部区域，并且外部区域具有通过表面改性提供的抗剥离性，该电阻高于另一个 喷射出口形成表面的一部分。