摘要:
A bumper beam assembly for a vehicle comprises a bumper beam having at least two round pipes, a bracket, first and second support members, first and second side frames, and a bracket formed into a rounded shape to match the external shape of the round pipes. The round pipes are arranged vertically and the sum of the diameters of the round pipes is smaller than the height of the bumper beam. The first and second support members have arc-shaped recesses which conform to the external shape of the round pipes and support the round pipes to connect the side frame to the round pipes, and one of the round pipes is positioned below a central point of the first and second side frames, and one of the round pipes is positioned above the central point.
摘要:
There is provided a mounting structure of a bumper beam in which the weight is decreased while a sufficient strength is ensured. In a mounting structure of a bumper beam for mounting the bumper beam to at least one of a front part or a rear part of a side frame which is provided on both sides in the vehicle width direction and extends in the longitudinal direction of vehicle, the bumper beam has two or more pipes each having a length at least equal to a distance between the side frames, the pipes being arranged horizontally one above another so that the outside surfaces of the pipes are located at the same position in the longitudinal direction of the vehicle, and a central position in the height direction of the bumper beam approximately coincides with a central position in the height direction of the side frame.
摘要:
A magnetic body is provided to improve heat transport capability and heat transport efficiency. A magnetic body arranged plate has magnetic body units each including magnetic members. Low-temperature side and high-temperature side heat exchange units are disposed at ends of each magnetic body unit. Permanent magnets and heat conductive members are arranged on a magnet/heat conductive member arranged plate. When the magnetic body arranged plate and the magnet/heat conductive member arranged plate are moved relative to each other, the permanent magnets apply magnetism separately to the magnetic members of each magnetic body unit. The magnet/heat conductive member arranged plate creates a temperature difference and conducts heat in one direction between the magnetic members, the low-temperature side heat exchange unit, and the high-temperature side heat exchange unit.
摘要:
A magnetic structure has a magnetocaloric material the temperature of which changes with application or removal of a magnetic field, and a high thermal conduction member which is in contact with the magnetocaloric material and has higher thermal conductivity than the magnetocaloric material. Further, this magnetic air-conditioning and heating device is provided with multiple of the aforementioned magnetic structures, a thermal switch which is arranged between magnetic structures and transmits or insulates heat, and a magnetic field varying unit which applies or removes a magnetic field to each of the magnetic structures. By providing in the magnetic structures a high thermal conduction member with higher thermal conductivity than the magnetocaloric material, some or all of the heat generated in the magnetocaloric material can be quickly conducted in the magnetic bodies.
摘要:
A solid-state image pickup apparatus includes a reading unit having a plurality of pixels connected thereto, holding signals from the pixels, and a control unit capable of controlling operations of the pixels and reading unit. The control unit controls the pixels and reading unit in a first operation mode without addition, in a second operation mode in which signals from aa of the pixels are added, aa being an integer greater than one, and in a third operation mode in which signals from bb of the pixels are added, bb being an integer greater than aa. The reading unit includes a holding unit having a capacitance value of C, and the holding unit includes a first capacitor having a capacitance value of C/bb and a second capacitor having a capacitance value of C/p, p being a common multiple of aa and bb.
摘要:
A low cost and high speed AF sensor is realized by increasing AF speed without providing a sensor dedicated for a large de-focusing AF. The AF sensor has two sensors each including a plurality of photoelectric conversion elements and detects a focus based on signals read from the sensors. The two sensors each includes a plurality of linear sensors 11 to 13. The two sensors each has a plurality of accumulation controlling circuits (PB detection circuits 14 to 16 and accumulation decision circuits 17 to 19) for controlling the accumulation time of the photoelectric conversion elements and a plurality of scanning circuits (shift registers 21 to 23) for reading out output signals from the photoelectric conversion elements. The AF sensor has a first mode in which the accumulation time of each linear sensor in the two sensors is independently controlled to independently read a signal output and a second mode in which the accumulation time of the linear sensors in the two sensors is collectively controlled to read a signal output.
摘要:
The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that is capable of raising a reliability of mounting on a wiring substrate. One feature of the present invention is to bond a semiconductor element formed on a substrate having isolation to a member that a conductive film is formed via a medium having an anisotropic conductivity.
摘要:
Techniques are provided for obtaining a photoelectric conversion device having a favorable spectral sensitivity characteristic and reduced variation in output current without a contamination substance mixed into a photoelectric conversion layer or a transistor, and for obtaining a highly reliable semiconductor device including a photoelectric conversion device. A semiconductor device may include, over an insulating surface, a first electrode; a second electrode; a color filter between the first electrode and the second electrode; an overcoat layer covering the color filter; and a photoelectric conversion layer over the overcoat layer, where one end portion of the photoelectric conversion layer is in contact with the first electrode, and where an end portion of the color filter lies inside the other end portion of the photoelectric conversion layer.
摘要:
A solid-state imaging apparatus includes: a pixel region including a plurality of pixels, each including a photoelectric conversion element, arranged in matrix, and a reset switch for discharging electric charge of the photoelectric conversion element; and a first scanning circuit for supplying a reset control signal for controlling an operation of the reset switch, the pixel region and the first scanning circuit being formed on a semiconductor substrate, in which the pixel region includes a first pixel region and a second pixel region, and the first scanning circuit includes a first decoder for controlling the operation of the reset switch arranged in the first pixel region, and a second decoder for controlling the operation of the reset switch arranged in the second pixel region.
摘要:
Paper embedded with a semiconductor device capable of communicating wirelessly is realized, whose unevenness of a portion including the semiconductor device does not stand out and the paper is thin with a thickness of less than or equal to 130 μm. A semiconductor device is provided with a circuit portion and an antenna, and the circuit portion includes a thin film transistor. The circuit portion and the antenna are separated from a substrate used during manufacturing, and are interposed between a flexible base and a sealing layer and protected. The semiconductor device can be bent, and the thickness of the semiconductor device itself is less than or equal to 30 μm. The semiconductor device is embedded in a paper in a papermaking process.