INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    2.
    发明申请
    INDUCTIVE COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    电感元件及其制造方法

    公开(公告)号:US20100219925A1

    公开(公告)日:2010-09-02

    申请号:US12681703

    申请日:2008-10-28

    IPC分类号: H01F27/30 H01F41/04

    摘要: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.

    摘要翻译: 公开了一种电感元件。 该电感元件包括由绝缘材料制成的基座,埋在基座中的线圈部分和与线圈部分的端部电耦合的外部电极端子。 应力缓冲部分设置在基极和外部电极端子之间的暴露接口上,并且该应力缓冲部分可以缓解因温度变化引起的热系数差异产生的应力。 因此,上述结构允许提高电感元件相对于热冲击的可靠性。

    INDUCTANCE COMPONENT
    3.
    发明申请
    INDUCTANCE COMPONENT 有权
    电感元件

    公开(公告)号:US20100182116A1

    公开(公告)日:2010-07-22

    申请号:US11909756

    申请日:2007-03-19

    IPC分类号: H01F27/29

    摘要: In an inductance component, a stress is not locally applied even in the condition where heat is applied to entire component, such as when implementing soldering, so that high reliability is realized. For realizing this, the component includes element (5), coil (6) formed in element (5), terminals (7, 8) electrically connected to coil (6), and magnetic layers (9A, 9B) arranged so as to be substantially parallel to a winding surface of coil (6) are formed in element (5) and entire magnetic layers (9A, 9B) is covered with a material of which thermal expansion and contraction rates are constant.

    摘要翻译: 在电感部件中,即使在对整个部件施加热量的情况下,例如在实施焊接的情况下,也不局部施加应力,从而实现高可靠性。 为了实现这一点,组件包括元件(5),元件(5)中形成的线圈(6),与线圈(6)电连接的端子(7,8)和布置成 基本上平行于线圈(6)的绕组表面形成在元件(5)中,并且整个磁性层(9A,9B)被热膨胀和收缩率恒定的材料覆盖。

    Electronic component and method for manufacturing the same
    4.
    发明授权
    Electronic component and method for manufacturing the same 有权
    电子元件及其制造方法

    公开(公告)号:US07741565B2

    公开(公告)日:2010-06-22

    申请号:US11947219

    申请日:2007-11-29

    IPC分类号: H01B5/14

    摘要: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

    摘要翻译: 在具有作为结构的部件的基板的常规电子部件中,已经成为超薄型材设计的障碍。 为了解决该问题,本发明提供了一种没有基板的改进结构。 内部电极15形成为预定的线圈图案。 凸起16和凹凸17形成在部件的相对表面上,每个部件彼此难以粘附。 另一方面,没有凸块16或凹凸17的面对侧面允许安装装置具有改善的真空吸力。 这种结构化的电子部件即使在极小的尺寸下也能够容易地处理。

    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    5.
    发明申请
    ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
    电子元件及其制造方法

    公开(公告)号:US20080245550A1

    公开(公告)日:2008-10-09

    申请号:US11947219

    申请日:2007-11-29

    IPC分类号: H01B5/14 B05D5/12

    摘要: In conventional electronic components, having a substrate as a component of the structure has been an obstacle to an ultra-low profile design. To address the problem, the present invention provides an improved structure without a substrate. Internal electrode 15 is formed into a predetermined coil pattern. Bumps 16 and irregularities 17 are formed on confronting surfaces of the component, by which each component is hard-to-cling with one another. On the other hand, the confronting side-surfaces with no bumps 16 or irregularities 17 allow a mounting device to have an improved vacuum suction force. Such structured electronic component maintains easy handling even when it is extremely downsized.

    摘要翻译: 在具有作为结构的部件的基板的常规电子部件中,已经成为超薄型材设计的障碍。 为了解决该问题,本发明提供了一种没有基板的改进结构。 内部电极15形成为预定的线圈图案。 凸起16和凹凸17形成在部件的相对表面上,每个部件彼此难以粘附。 另一方面,没有凸块16或凹凸17的面对侧面允许安装装置具有改善的真空吸力。 这种结构化的电子部件即使在极小的尺寸下也能够容易地处理。

    INDUCTANCE COMPONENT
    6.
    发明申请
    INDUCTANCE COMPONENT 有权
    电感元件

    公开(公告)号:US20080186125A1

    公开(公告)日:2008-08-07

    申请号:US12016653

    申请日:2008-01-18

    IPC分类号: H01F5/00

    摘要: The inductance component has a base material, a coil formed in the base material and an electrode electrically connected to the coil. In addition, an impact-absorption layer is disposed between the electrode and the base material. Forming impact-absorption layer between the base material and the electrode allows the base material to have flexibility even if an impact is given on the base material, providing the component with high impact-resistance.

    摘要翻译: 电感部件具有基材,形成在基材中的线圈和与线圈电连接的电极。 此外,在电极和基材之间设置有冲击吸收层。 在基材和电极之间形成冲击吸收层允许基材具有灵活性,即使对基材施加冲击,为该组分提供高抗冲击性。

    Inductive component and method for manufacturing the same
    8.
    发明授权
    Inductive component and method for manufacturing the same 有权
    感应元件及其制造方法

    公开(公告)号:US08284005B2

    公开(公告)日:2012-10-09

    申请号:US12681703

    申请日:2008-10-28

    IPC分类号: H01F27/02

    摘要: An inductance component is disclosed. This inductance component includes base made of insulating material, coil section buried in base, and external electrode terminals electrically coupled to the ends of coil section. Stress buffering section is provided on the exposed interface between base and external electrode terminals, and this stress buffering section can ease the stress produced by the difference in thermal coefficients due to temperature changes. The foregoing structure thus allows improving the reliability of the inductance component with respect to a thermal shock.

    摘要翻译: 公开了一种电感元件。 该电感元件包括由绝缘材料制成的基座,埋在基座中的线圈部分和与线圈部分的端部电耦合的外部电极端子。 应力缓冲部分设置在基极和外部电极端子之间的暴露接口上,并且该应力缓冲部分可以缓解因温度变化引起的热系数差异产生的应力。 因此,上述结构允许提高电感元件相对于热冲击的可靠性。

    Optical waveguide device for connections without optical axis adjustment
    10.
    发明授权
    Optical waveguide device for connections without optical axis adjustment 失效
    用于无光轴调节连接的光波导器件

    公开(公告)号:US6052500A

    公开(公告)日:2000-04-18

    申请号:US980815

    申请日:1997-12-01

    摘要: An optical device which can be fabricated without any axial alignment by optical measurement and can therefore be produced at a remarkably decreased cost, and which is composed of an optical waveguide part (1) obtained by perpendicularly cutting an optically-transparent polymer film having a glass substrate attached thereto and having a refractive index distribution formed, in a predetermined position measured from the position of the refractive index distribution as a reference, and a holder part (2) for holding the optical waveguide part (1) in a predetermined position, the holder part (2) having a horizontal guide surface (2H) and a vertical guide surface (2V), the optical waveguide part (1) having a glass substrate surface or a polymer film surface coherently attached to the horizontal guide surface (2H) of the holder part (2), and the optical waveguide part (1) having a perpendicularly cut surface coherently attached to the vertical guide surface (2V) of the holder part (2).

    摘要翻译: 一种光学装置,其可以通过光学测量而无需轴向对准,因此可以以显着降低的成本制造,并且由通过垂直切割具有玻璃的光学透明的聚合物膜获得的光波导部分(1) 在从作为基准的折射率分布的位置测定的预定位置上形成有折射率分布的基板,以及用于将光波导部分(1)保持在预定位置的保持部(2), 具有水平引导表面(2H)和垂直引导表面(2V)的保持器部分(2),光波导部分(1)具有玻璃衬底表面或聚合物膜表面,其相干地附接到水平引导表面(2H) 所述保持器部分(2)和所述光波导部分(1)具有相干地附接到所述保持器部分(2)的垂直引导表面(2V)的垂直切割表面。