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1.发明授权Method for fabricating trench capacitors for large scale integrated semiconductor memories 失效用于制造用于大规模集成半导体存储器的沟槽电容器的方法公开(公告)号：US07074317B2
公开(公告)日：2006-07-11
申请号：US10436427
申请日：2003-05-12
申请人： Albert Birner , Dirk Schumann , Matthias Goldbach
发明人： Albert Birner , Dirk Schumann , Matthias Goldbach
IPC分类号： H05K3/07
CPC分类号： H01L21/3063 , C25F3/12 , H01L27/10861 , H01L28/40
摘要： An electrochemical method is provided for producing trenches for trench capacitors in p-doped silicon with a very high diameter/depth aspect ratio for large scale integrated semiconductor memories. Trenches (macropores) having a diameter of less than about 100 nm and a depth of more than 10 μm can be produced on p-doped silicon having a very low resistivity at a high etching rate.
摘要翻译： 提供电化学方法用于在p掺杂硅中制造用于大规模集成半导体存储器的非常高的直径/深度纵横比的沟槽电容器的沟槽。 可以以高蚀刻速率在具有非常低电阻率的p掺杂硅上产生直径小于约100nm且深度大于10um的沟槽（大孔）。
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2.发明授权Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor 失效用于形成SOI衬底，垂直晶体管和具有垂直晶体管的存储单元的方法公开(公告)号：US07084043B2
公开(公告)日：2006-08-01
申请号：US10792691
申请日：2004-03-05
CPC分类号： H01L27/10864 , H01L27/10867 , H01L27/1203
摘要： A method for producing a silicon-on-insulator layer structure on a silicon surface with any desired geometry can locally produce the silicon-on-insulator structure. The method includes formation of mesopores in the silicon surface region, oxidation of the mesopore surface to form silicon oxide and rib regions from silicon in single-crystal form; and execution of a selective epitaxy process that that silicon grows on the uncovered rib regions, selectively with respect to the silicon oxide regions. Rib regions remain in place between adjacent mesopores, this step being ended as soon as a predetermined minimum silicon wall thickness of the rib regions is reached, the uncovering of the rib regions, which are arranged at the end remote from the semiconductor substrate between adjacent mesopores. The method can be used to fabricate a vertical transistor and a memory cell having a select transistor of this type.
摘要翻译： 在任何期望的几何形状的硅表面上制造绝缘体上硅层结构的方法可以局部地产生绝缘体上硅结构。 该方法包括在硅表面区域形成中孔，中孔表面的氧化形成硅单晶的硅氧化物和肋状区域; 以及执行选择性外延工艺，其中硅在相对于氧化硅区域选择性地在未覆盖的肋区域上生长。 肋区域保持在相邻的中孔之间的适当位置，一旦达到肋区域的预定的最小硅壁厚度，则该步骤结束，肋区域的露出，其布置在远离半导体衬底的相邻介孔之间的端部 。 该方法可用于制造具有这种类型的选择晶体管的垂直晶体管和存储单元。
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公开(公告)号：US07192830B2
公开(公告)日：2007-03-20
申请号：US10862818
申请日：2004-06-07
IPC分类号： H01L21/336
CPC分类号： B82Y10/00 , H01L21/28273 , H01L29/42332 , H01L29/66825 , H01L29/7887
摘要： Silicon nanocrystals are applied as storage layer (6) and removed using spacer elements (11) laterally with respect to the gate electrode (5). By means of an implantation of dopant, source/drain regions (2) are fabricated in a self-aligned manner with respect to the storage layer (6). The portions of the storage layer (6) are interrupted by the gate electrode (5) and the gate dielectric (4), so that a central portion of the channel region (3) is not covered by the storage layer (6). This memory cell is suitable as a multi-bit flash memory cell in a virtual ground architecture.
摘要翻译： 将硅纳米晶体作为存储层（6）施加，并且使用间隔元件（11）相对于栅电极（5）横向去除。 通过掺杂剂的注入，源极/漏极区域（2）以相对于存储层（6）的自对准方式制造。 存储层（6）的部分被栅极（5）和栅极电介质（4）中断，使得沟道区域（3）的中心部分不被存储层（6）覆盖。 该存储单元适合作为虚拟地面架构中的多位闪存单元。
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公开(公告)号：US20050014335A1
公开(公告)日：2005-01-20
申请号：US10862818
申请日：2004-06-07
IPC分类号： H01L21/28 , H01L21/336 , H01L29/423 , H01L29/788
CPC分类号： B82Y10/00 , H01L21/28273 , H01L29/42332 , H01L29/66825 , H01L29/7887
摘要： Silicon nanocrystals are applied as storage layer (6) and removed using spacer elements (11) laterally with respect to the gate electrode (5). By means of an implantation of dopant, source/drain regions (2) are fabricated in a self-aligned manner with respect to the storage layer (6). The portions of the storage layer (6) are interrupted by the gate electrode (5) and the gate dielectric (4), so that a central portion of the channel region (3) is not covered by the storage layer (6). This memory cell is suitable as a multi-bit flash memory cell in a virtual ground architecture.
摘要翻译： 将硅纳米晶体作为存储层（6）施加，并且使用间隔元件（11）相对于栅电极（5）横向去除。 通过掺杂剂的注入，源极/漏极区域（2）以相对于存储层（6）的自对准方式制造。 存储层（6）的部分被栅极（5）和栅极电介质（4）中断，使得沟道区域（3）的中心部分不被存储层（6）覆盖。 该存储单元适合作为虚拟地面架构中的多位闪存单元。
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5.发明授权Memory cell with trench capacitor and vertical select transistor and an annular contact-making region formed between them 失效具有沟槽电容器和垂直选择晶体管的存储单元和在它们之间形成的环形接触区域公开(公告)号：US07268381B2
公开(公告)日：2007-09-11
申请号：US10486758
申请日：2002-07-12
申请人： Albert Birner , Matthias Goldbach , Till Schlösser
发明人： Albert Birner , Matthias Goldbach , Till Schlösser
IPC分类号： H01L27/108 , H01L29/76
CPC分类号： H01L27/10864 , H01L27/10867 , H01L27/10876
摘要： The upper capacitor electrode of the trench capacitor is connected to an epitaxially grown source/drain region of the select transistor by a tubular, monocrystalline Si contact-making region. The gate electrode layer has an oval peripheral contour around the transistor, the oval peripheral contours of the gate electrode layers of memory cells arranged in a row along a word line forming overlap regions in order to increase the packing density.
摘要翻译： 沟槽电容器的上电容器电极通过管状的单晶Si接触形成区域连接到选择晶体管的外延生长的源极/漏极区域。 栅极电极层在晶体管周围具有椭圆形外围轮廓，存储单元的栅极电极层的椭圆形外围轮廓沿着字线排列成一行形成重叠区域，以增加堆积密度。
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公开(公告)号：US06919255B2
公开(公告)日：2005-07-19
申请号：US10630373
申请日：2003-07-30
申请人： Albert Birner , Matthias Goldbach , Thomas Hecht , Lars Heineck , Stephan Kudelka , Jörn Lützen , Dirk Manger , Andreas Orth
发明人： Albert Birner , Matthias Goldbach , Thomas Hecht , Lars Heineck , Stephan Kudelka , Jörn Lützen , Dirk Manger , Andreas Orth
IPC分类号： H01L27/108 , H01L21/00 , H01L21/20 , H01L21/334 , H01L21/8242 , H01L29/94
CPC分类号： H01L27/1087 , H01L29/66181 , H01L29/945
摘要： A method for fabricating a semiconductor trench structure includes forming a trench in a semiconductor substrate and filling it with a filler. A first thermal process having a first maximum temperature cures the filler. Removing the filler from an upper region of the trench as far as a boundary surface defines a collar region. In a second thermal process having a second maximum temperature that is not significantly higher than the first maximum temperature, a liner is deposited on the collar region and the boundary surface. The liner is removed from the boundary surface, thereby exposing the filler. The filler is then removed from a lower region of the trench.
摘要翻译： 一种制造半导体沟槽结构的方法包括在半导体衬底中形成沟槽并用填充物填充沟槽。 具有第一最高温度的第一热处理固化填料。 从沟槽的上部区域移除填料至达边界表面限定了一个环形区域。 在具有不显着高于第一最高温度的第二最高温度的第二热处理中，衬套沉积在套环区域和边界表面上。 将衬垫从边界表面移除，从而暴露填料。 然后从沟槽的下部区域去除填料。
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7.发明授权Method for fabricating trench capacitors and semiconductor device with trench capacitors 失效制造沟槽电容器的方法和具有沟槽电容器的半导体器件公开(公告)号：US06878600B2
公开(公告)日：2005-04-12
申请号：US10436426
申请日：2003-05-12
IPC分类号： H01L21/3063 , H01L21/8242 , H01L27/108 , H01L21/20
CPC分类号： H01L27/1087
摘要： A method for fabricating trench capacitors having trenches with mesopores, the trench capacitors being suitable both for discrete capacitors and for integrated semiconductor memories, significantly increases the surface area for electrodes of the capacitors and, hence, the capacitance thereof. The mesopores, which are small woodworm-hole-like channels having diameters from approximately 2 to 50 nm, are fabricated electrochemically. It is, thus, possible to produce capacitances with a large capacitance-to-volume ratio. Growth of the mesopores stops, at the latest, when the mesopores reach a minimum distance from another mesopore or adjacent trench (self-passivation). As such, the formation of “short circuits” between two adjacent mesopores can be avoided in a self-regulated manner. Furthermore, a semiconductor device is provided including at least one trench capacitor on the front side of a semiconductor substrate fabricated by the method according to the invention.
摘要翻译： 一种用于制造具有中孔的沟槽的沟槽电容器的方法，所述沟槽电容器适用于分立电容器和集成半导体存储器，显着增加了电容器的电极的表面积，并因此显着增加了其电容。 电化学地制造直径为约2〜50nm的小木蛾孔状通道的中孔。 因此，可以产生具有大的电容容积比的电容。 当介孔达到与另一个中孔或相邻沟槽的最小距离（自钝化）时，介孔的生长最终停止。 因此，可以以自我调节的方式避免在两个相邻介孔之间形成“短路”。 此外，提供一种半导体器件，其包括通过根据本发明的方法制造的半导体衬底的前侧上的至少一个沟槽电容器。
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公开(公告)号：US07081384B2
公开(公告)日：2006-07-25
申请号：US10823607
申请日：2004-04-14
申请人： Albert Birner , Matthias Goldbach , Irene Sperl
发明人： Albert Birner , Matthias Goldbach , Irene Sperl
IPC分类号： H01L21/8242
CPC分类号： H01L27/1087 , H01L21/02238 , H01L21/02255 , H01L21/02299 , H01L21/3063 , H01L21/31662 , H01L27/10832 , Y10S438/964
摘要： The present invention refers to a method of forming a silicon dioxide layer by thermally oxidizing at least one monocrystalline silicon surface region on a semiconductor substrate. The silicon surface region has a curved surface. The method can include providing a semiconductor substrate having at least one monocrystalline silicon surface region having a curved surface, roughening the surface of the at least one monocrystalline silicon surface region to produce a layer of porous silicon, and thermally oxidizing the at least one roughened monocrystalline silicon surface.
摘要翻译： 本发明涉及通过热氧化半导体衬底上的至少一个单晶硅表面区域来形成二氧化硅层的方法。 硅表面区域具有曲面。 该方法可以包括提供具有至少一个具有弯曲表面的单晶硅表面区域的半导体衬底，使至少一个单晶硅表面区域的表面粗糙化以产生多孔硅层，并热氧化至少一个粗糙化单晶 硅表面。
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公开(公告)号：US20070034927A1
公开(公告)日：2007-02-15
申请号：US11272038
申请日：2005-11-14
IPC分类号： H01L29/94
CPC分类号： H01L27/1087 , H01L27/10829 , H01L29/945
摘要： A trench storage capacitor includes a buried plate that is lengthened by a doped silicon layer to right over the collar insulating layer. The conductor layer of the trench storage capacitor is preferably applied to a “buried” collar insulating layer and masked with the aid of a protective layer fabricated by ALD. In an exemplary embodiment, the conductor layer is composed of amorphous silicon, which is used as an HSG layer in a lower trench region.
摘要翻译： 沟槽存储电容器包括一掩埋板，其被掺杂的硅层延伸到芯套绝缘层的正上方。 沟槽存储电容器的导体层优选地应用于“埋入”的轴环绝缘层，并借助于由ALD制成的保护层进行掩模。 在示例性实施例中，导体层由非晶硅组成，其被用作下沟槽区域中的HSG层。
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10.发明授权公开(公告)号：US06863769B2
公开(公告)日：2005-03-08
申请号：US10661340
申请日：2003-09-12
IPC分类号： H01L21/00 , H01L21/306
CPC分类号： H01L21/67086 , H01L2924/0002 , H01L2924/00
摘要： A base body is provided, on which a first sealing ring and a second sealing ring are disposed. A substrate is disposed on the sealing rings in such a way that a cavity is formed between the first sealing ring, the second sealing ring, the base body and the substrate. An etching substance can be introduced into the cavity in order to etch clear a conductive layer that has been applied to the substrate. When a conductive layer that has been applied to the substrate back surface has been uncovered, an electrolyte can be introduced into the cavity, making contact with the conductive layer and therefore the substrate back surface.
摘要翻译： 设置有基体，其上设置有第一密封环和第二密封环。 基板被设置在密封环上，使得在第一密封环，第二密封环，基体和基底之间形成空腔。 可以将蚀刻物质引入到空腔中，以便对已经施加到基底上的导电层进行蚀刻。 当已经施加到基板背面的导电层未被覆盖时，可以将电解质引入空腔中，与导电层接触，从而与基板背面接触。
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