Method for fabricating trench capacitors for large scale integrated semiconductor memories
    1.
    发明授权
    Method for fabricating trench capacitors for large scale integrated semiconductor memories 失效
    用于制造用于大规模集成半导体存储器的沟槽电容器的方法

    公开(公告)号:US07074317B2

    公开(公告)日:2006-07-11

    申请号:US10436427

    申请日:2003-05-12

    IPC分类号: H05K3/07

    摘要: An electrochemical method is provided for producing trenches for trench capacitors in p-doped silicon with a very high diameter/depth aspect ratio for large scale integrated semiconductor memories. Trenches (macropores) having a diameter of less than about 100 nm and a depth of more than 10 μm can be produced on p-doped silicon having a very low resistivity at a high etching rate.

    摘要翻译: 提供电化学方法用于在p掺杂硅中制造用于大规模集成半导体存储器的非常高的直径/深度纵横比的沟槽电容器的沟槽。 可以以高蚀刻速率在具有非常低电阻率的p掺杂硅上产生直径小于约100nm且深度大于10um的沟槽(大孔)。

    Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor
    2.
    发明授权
    Method for forming an SOI substrate, vertical transistor and memory cell with vertical transistor 失效
    用于形成SOI衬底,垂直晶体管和具有垂直晶体管的存储单元的方法

    公开(公告)号:US07084043B2

    公开(公告)日:2006-08-01

    申请号:US10792691

    申请日:2004-03-05

    IPC分类号: H01L21/76 H01L21/31

    摘要: A method for producing a silicon-on-insulator layer structure on a silicon surface with any desired geometry can locally produce the silicon-on-insulator structure. The method includes formation of mesopores in the silicon surface region, oxidation of the mesopore surface to form silicon oxide and rib regions from silicon in single-crystal form; and execution of a selective epitaxy process that that silicon grows on the uncovered rib regions, selectively with respect to the silicon oxide regions. Rib regions remain in place between adjacent mesopores, this step being ended as soon as a predetermined minimum silicon wall thickness of the rib regions is reached, the uncovering of the rib regions, which are arranged at the end remote from the semiconductor substrate between adjacent mesopores. The method can be used to fabricate a vertical transistor and a memory cell having a select transistor of this type.

    摘要翻译: 在任何期望的几何形状的硅表面上制造绝缘体上硅层结构的方法可以局部地产生绝缘体上硅结构。 该方法包括在硅表面区域形成中孔,中孔表面的氧化形成硅单晶的硅氧化物和肋状区域; 以及执行选择性外延工艺,其中硅在相对于氧化硅区域选择性地在未覆盖的肋区域上生长。 肋区域保持在相邻的中孔之间的适当位置,一旦达到肋区域的预定的最小硅壁厚度,则该步骤结束,肋区域的露出,其布置在远离半导体衬底的相邻介孔之间的端部 。 该方法可用于制造具有这种类型的选择晶体管的垂直晶体管和存储单元。

    Method and composition for cleaning objects
    4.
    发明授权
    Method and composition for cleaning objects 有权
    清洁物品的方法和组成

    公开(公告)号:US08834643B2

    公开(公告)日:2014-09-16

    申请号:US13259536

    申请日:2010-03-22

    摘要: A method for cleaning objects made of organic or inorganic materials, wherein the relevant material is brought into contact with a composition in the form of a fluid nanophase system, comprising a) at least one water-insoluble substance having a water solubility of less than 4 grams per liter, b) at least one amphiphilic substance (NP-MCA) which has no surfactant structure, is not structure-forming on its own, the solubility of which in water or oil ranges between 4 g and 1000 g per liter and which does not preferably accumulate at the oil-water interface, c) at least one anionic, cationic, amphoteric and/or non-ionic surfactant, d) at least one polar protic solvent, in particular having hydroxy functionality, e) if necessary one or more auxiliary substance.

    摘要翻译: 一种用于清洁由有机或无机材料制成的物体的方法,其中所述相关材料与流体纳米相系统形式的组合物接触,所述组合物包含:a)至少一种具有小于4的水溶性的水不溶性物质 克/升,b)至少一种不具有表面活性剂结构的两亲物质(NP-MCA)本身不是结构形成的,其在水或油中的溶解度范围为4g至1000g / l,其中 不优选在油 - 水界面处积聚,c)至少一种阴离子,阳离子,两性和/或非离子表面活性剂,d)至少一种极性质子溶剂,特别是具有羟基官能团,e) 更多辅助物质。

    Apparatus for setting the spacing of a free standing range from a floor
    7.
    发明申请
    Apparatus for setting the spacing of a free standing range from a floor 有权
    用于从地板设定自由站立距离的间隔的装置

    公开(公告)号:US20060102815A1

    公开(公告)日:2006-05-18

    申请号:US10988247

    申请日:2004-11-12

    IPC分类号: F16M11/24

    摘要: An apparatus for setting the spacing of a free standing range relative to a floor includes a base component for contacting the floor, a threaded element, and a winding follower. The winding follower extends into the helical recess of the threaded element such that the winding follower travels progressively further along the helical recess of the threaded element. A blocking member engages the winding follower during travel of the winding follower along the helical recess of the threaded element to resist a disengagement movement.

    摘要翻译: 用于设定相对于地板的自由站立范围的间隔的装置包括用于接触地板的基座部件,螺纹元件和绕组从动件。 绕组从动件延伸到螺纹元件的螺旋凹槽中,使得绕组从动件沿螺纹元件的螺旋凹槽进一步进一步移动。 在绕线从动件沿着螺纹元件的螺旋凹槽行进期间,阻挡构件接合绕组从动件以抵抗分离运动。

    Trench capacitor and method for fabricating the trench capacitor
    8.
    发明授权
    Trench capacitor and method for fabricating the trench capacitor 失效
    沟槽电容器和制造沟槽电容器的方法

    公开(公告)号:US06987295B2

    公开(公告)日:2006-01-17

    申请号:US10650817

    申请日:2003-08-28

    IPC分类号: H01L27/108

    CPC分类号: H01L27/10861 H01L27/1203

    摘要: A trench capacitor for use in a DRAM memory cell contains a lower capacitor electrode, a storage dielectric, and an upper capacitor electrode, which are at least partially disposed in a trench. The lower capacitor electrode adjoins, in a lower trench region, a wall of the trench, while in the upper trench region there is a spacer layer that adjoins a wall of the trench and is made from an insulating material. The upper electrode contains at least three layers, a first layer disposed in the trench on the storage dielectric and containing doped polysilicon, a second layer disposed on the first layer and containing metal-silicide, and a third layer disposed on the second layer and containing doped polysilicon. The layers of the upper electrode in each case extending along the walls and the base of the trench up to at least the upper edge of the spacer layer.

    摘要翻译: 用于DRAM存储单元的沟槽电容器包括至少部分地设置在沟槽中的下电容器电极,存储电介质和上电容器电极。 下部电容器电极在下部沟槽区域中邻接沟槽的壁,而在上部沟槽区域中存在间隔层,该间隔层邻接沟槽的壁并由绝缘材料制成。 上电极包含至少三层,第一层设置在存储电介质上的沟槽中并含有掺杂多晶硅,第二层设置在第一层上并含有金属硅化物,第三层设置在第二层上并含有 掺杂多晶硅。 每个壳体中的上电极的层沿着沟槽的壁和基底延伸到至少间隔层的上边缘。

    Method for producing a CMOS circuit
    9.
    发明授权
    Method for producing a CMOS circuit 失效
    CMOS电路的制造方法

    公开(公告)号:US5913115A

    公开(公告)日:1999-06-15

    申请号:US67766

    申请日:1998-04-29

    摘要: In producing a CMOS circuit, an n-channel MOS transistor and a p-channel MOS transistor are formed in a semiconductor substrate. In situ p-doped, monocrystalline silicon structures are formed by epitaxial growth selectively with respect to insulating material and with respect to n-doped silicon, such silicon structures being suitable as a diffusion source for forming source/drain regions of the p-channel MOS transistor. The source/drain regions of the n-channel MOS transistor are produced beforehand by means of implantation or diffusion. Owing to the selectivity of the epitaxy that is used, it is not necessary to cover the n-doped source/drain regions of the n-channel MOS transistor during the production of the p-channel MOS transistor.

    摘要翻译: 在制造CMOS电路时,在半导体衬底中形成n沟道MOS晶体管和p沟道MOS晶体管。 原位p掺杂的单晶硅结构通过相对于绝缘材料选择性地外延生长而形成,并且对于n掺杂的硅,这种硅结构适合作为用于形成p沟道MOS的源极/漏极区的扩散源 晶体管。 n沟道MOS晶体管的源极/漏极区域通过注入或扩散预先产生。 由于使用的外延的选择性,在制造p沟道MOS晶体管期间不需要覆盖n沟道MOS晶体管的n掺杂源极/漏极区域。