摘要:
There is provided a CRF receptor antagonist comprising a compound of the formula (I): A-W—Ar (I) wherein, A is a group represented by the formula (A1) or (A2): (wherein, ring Aa is a 5- or 6-membered ring which may be further substituted; ring Ab is a 5- or 6-membered ring which may be further substituted; ring Ac is a 5- or 6-membered ring which may be substituted; R1 is optionally substituted alkyl, substituted amino, substituted hydroxy, etc.; X is carbonyl, —O—, —S—, etc.; Y1, Y2 and Q are independently optionally substituted carbon or nitrogen; is a single or double bond); W is a bond, optionally substituted methylene, optionally substituted imino, —O—, —S—, etc.; Ar is optionally substituted aryl or optionally substituted heteroaryl; or a salt thereof or a prodrug thereof.
摘要:
There is provided a CRF receptor antagonist comprising a compound of the formula (I): wherein, ring A is a 5-membered ring represented by the formula (A′): wherein X is a carbon and X1 is an oxygen, a sulfur or —NR5—, or formula (A″): wherein X is a nitrogen and R6 is an optionally substituted hydrocarbyl, R1 is an amino substituted by two optionally substituted hydrocarbyl groups, R2 is an phenyl, Y1 is CR3a or a nitrogen, y2 is CR3b or a nitrogen and Y3 is CR3c or a nitrogen, provided that one or less of Y1, Y2, and Y3 is nitrogen, W is a bond, —(CH2)n-, and Z is a bond, —NR4—, etc.; or a salt thereof or a prodrug thereof.
摘要:
A refrigerator having a home bar, whose assembly efficiency and aesthetic external appearance are improved, is disclosed. The home bar includes a home bar frame tightly mounted at the inside of an opening, which is formed at a door of the refrigerator door such that the opening communicates with the inside of the refrigerator, a home bar door mounted to the home bar frame such that the home bar door can be hingedly rotated for opening and closing the opening, a coupling-and-releasing unit for coupling the home bar door to the home bar frame and releasing the home bar door from the home bar frame, and at least one hinge member having a rotary shaft movable in the inward and outward directions of the home bar door or the home bar frame such that the rotary shaft can be inserted into or separated from a hinge hole formed at the home bar frame or the home bar door.
摘要:
The present invention relates to an embedded chip printed circuit board in which a space required for embedding a chip is formed to a desired depth depending on various thicknesses of chips to be embedded, and thus, the circuit line for the electrical connection between the embedded chip and the circuit pattern layer can be formed to be relatively short, thereby maximizing space efficiency and decreasing inductance at high frequencies. In addition, a method of manufacturing such an embedded printed circuit board is also provided.
摘要:
A printed circuit board having embedded capacitors includes a double-sided copper-clad laminate including first circuit layers formed in the outer layers thereof, the first circuit layers including bottom electrodes and circuit patterns; dielectric layers formed by depositing alumina films on the first circuit layers by atomic layer deposition; second circuit layers formed on the dielectric layers and including top electrodes and circuit patterns; one-sided copper-clad laminates formed on the second circuit layers; blind via-holes and through-holes formed in predetermined portions of the one-sided copper-clad laminates; and plating layers formed in the blind via-holes and the through-holes. The manufacturing method of the printed circuit board is also disclosed.
摘要:
The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor comprises a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.
摘要:
The invention provides materials and methods for making skin care compositions that contain dried or fresh fruit particles, and also can contain suspending agents, surfactants, emollients, emulsifiers, and/or cationic polymers. The basic fruit components typically are from the pulp and peel of the fruit, which can be specially processed to retain the colors, phytochemicals and nutritive ingredients. The compositions provided herein can contain particles made from whole fruits (minus seeds, leaves, and stems) that have been subjected to drying techniques (e.g., air-drum drying or freeze drying) and then processed into small particles.
摘要:
A flat panel display device includes a gate line and a data line crossing each other to define a pixel area, a pixel electrode in the pixel area, and a thin film transistor having a gate electrode connected to the gate line, a source electrode connected to the data line, and a drain electrode connected to the pixel electrode, wherein the gate line has at least two or more separated gate line portions where the gate line crosses the data line.
摘要:
A method of fabricating a printed circuit board (PCB) including embedded chips, composed of forming a hollow portion for chip insertion through a substrate, inserting the chip into the hollow portion, fixing the chip to the substrate by use of a plating process to form a central layer having an embedded chip, and then laminating a non-cured resin layer and a circuit layer having a circuit pattern on the central layer. Also, a PCB including embedded chips fabricated using the above method is provided.
摘要:
Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.