公开(公告)号：US20060139450A1

公开(公告)日：2006-06-29

申请号：US11016022

申请日：2004-12-17

申请人： Aleksander Owczarz ,  Jaroslaw Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred Redeker ,  Erik Edelberg

IPC分类号： H04N7/18 ,  H04N9/47

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

公开(公告)号：US07542134B2

公开(公告)日：2009-06-02

申请号：US12131909

申请日：2008-06-02

申请人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

IPC分类号： G01N21/00

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。

公开(公告)号：US20080273195A1

公开(公告)日：2008-11-06

申请号：US12131909

申请日：2008-06-02

申请人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

IPC分类号： G01N21/00 ,  H01L21/66

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。

公开(公告)号：US07397555B2

公开(公告)日：2008-07-08

申请号：US11016022

申请日：2004-12-17

申请人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

发明人： Aleksander Owczarz ,  Jaroslaw W. Winniczek ,  Luai Nasser ,  Alan Schoepp ,  Fred C. Redeker ,  Erik Edelberg

IPC分类号： G01N21/00

CPC分类号： G01N21/9501 ,  G01N2021/8822

摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.

摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。

公开(公告)号：US09117860B2

公开(公告)日：2015-08-25

申请号：US11639752

申请日：2006-12-15

申请人： John Boyd ,  Yezdi Dordi ,  Tiruchirapalli Arunagiri ,  Benjamin W. Mooring ,  John Parks ,  William Thie ,  Fritz C. Redeker ,  Arthur M. Howald ,  Alan Schoepp ,  David Hemker ,  Carl Woods ,  Hyungsuk Alexander Yoon ,  Aleksander Owczarz

发明人： John Boyd ,  Yezdi Dordi ,  Tiruchirapalli Arunagiri ,  Benjamin W. Mooring ,  John Parks ,  William Thie ,  Fritz C. Redeker ,  Arthur M. Howald ,  Alan Schoepp ,  David Hemker ,  Carl Woods ,  Hyungsuk Alexander Yoon ,  Aleksander Owczarz

IPC分类号： H05H1/24 ,  C23C16/00 ,  H01L21/67 ,  H01L21/288 ,  H01L21/768

CPC分类号： H01L21/67225 ,  H01L21/288 ,  H01L21/6704 ,  H01L21/67167 ,  H01L21/67184 ,  H01L21/6723 ,  H01L21/76849

摘要： A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.

摘要翻译： 公开了用于处理衬底的簇结构和方法。 集群架构包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。 实验室环境控制传递模块和一个或多个湿式衬底处理模块被配置为管理第一环境环境。 还提供耦合到实验室环境受控传输模块和一个或多个等离子体处理模块的真空传输模块。 真空转移模块和一个或多个等离子体处理模块被配置成管理第二周边环境。 并且，还包括耦合到真空传输模块和一个或多个环境处理模块的受控环境转移模块。 受控环境传输模块和一个或多个环境处理模块被配置为管理第三环境环境。 因此，集群架构使得能够在第一，第二或第三环境环境中以及在相关联的转换期间对衬底进行受控处理。

公开(公告)号：US07625452B2

公开(公告)日：2009-12-01

申请号：US12210198

申请日：2008-09-14

申请人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B1/02 ,  B08B3/00 ,  B08B9/20 ,  A47L25/00 ,  A47L15/00

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： A method for cleaning a substrate is provided. The method includes providing foam to a surface of the substrate, brush scrubbing the surface of the substrate, providing pressure to the foam, and channeling the pressured foam to produce jammed foam, the channeling including channeling the pressured foam into a gap, the gap being defined by a space between a surface of a brush enclosure and the surface of the substrate. The brush scrubbing of the surface of the substrate and the channeling of the pressured foam across the surface of the substrate facilitate particle removal from the surface of the substrate.

摘要翻译： 提供一种清洗基板的方法。 该方法包括向基材的表面提供泡沫，刷洗基材的表面，向泡沫提供压力，以及引导加压的泡沫以产生堵塞的泡沫，所述通道包括将加压泡沫引导到间隙中，所述间隙为 由刷子壳体的表面和基板的表面之间的空间限定。 衬底表面刷毛洗涤和挤压泡沫穿过衬底的表面有助于颗粒从衬底表面移除。

公开(公告)号：US20090000044A1

公开(公告)日：2009-01-01

申请号：US12210198

申请日：2008-09-14

申请人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B3/08 ,  B08B1/02 ,  B08B1/04

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.

摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。

公开(公告)号：US07441299B2

公开(公告)日：2008-10-28

申请号：US10816337

申请日：2004-03-31

申请人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John M. de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B11/02

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.

摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。

公开(公告)号：US20050133061A1

公开(公告)日：2005-06-23

申请号：US10816337

申请日：2004-03-31

申请人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

发明人： John de Larios ,  Aleksander Owczarz ,  Alan Schoepp ,  Fritz Redeker

IPC分类号： B08B3/00 ,  H01L21/00 ,  B08B1/02

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.

摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。

公开(公告)号：US08535451B2

公开(公告)日：2013-09-17

申请号：US12240300

申请日：2008-09-29

申请人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

发明人： John M. de Larios ,  Mike Ravkin ,  Jeffrey Farber ,  Mikhail Korolik ,  Fritz Redeker ,  Aleksander Owczarz

IPC分类号： B08B1/04

CPC分类号： B08B3/003 ,  H01L21/67028 ,  H01L21/67046 ,  Y10S134/902

摘要： An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer. such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer. is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.

摘要翻译： 公开了一种装置和方法，其中具有含有污染物的表面的半导体衬底被清洁或以其它方式用泡沫进行化学处理。 半导体晶片被支撑在刚性支撑件（或泡沫层）上，并且在半导体晶片被支撑的同时在半导体晶片的相对表面上提供泡沫。 接触半导体晶片的泡沫使用形式加压以产生卡住的泡沫。 形式与半导体晶圆之间的相对移动。 例如平行于和/或垂直于半导体晶片的顶表面的振荡。 然后在卡住的泡沫与半导体晶片接触的同时引发，以除去不期望的污染物和/或以其它方式化学处理使用泡沫的半导体晶片的表面。