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公开(公告)号：US09117860B2
公开(公告)日：2015-08-25
申请号：US11639752
申请日：2006-12-15
申请人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin W. Mooring , John Parks , William Thie , Fritz C. Redeker , Arthur M. Howald , Alan Schoepp , David Hemker , Carl Woods , Hyungsuk Alexander Yoon , Aleksander Owczarz
发明人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin W. Mooring , John Parks , William Thie , Fritz C. Redeker , Arthur M. Howald , Alan Schoepp , David Hemker , Carl Woods , Hyungsuk Alexander Yoon , Aleksander Owczarz
IPC分类号： H05H1/24 , C23C16/00 , H01L21/67 , H01L21/288 , H01L21/768
CPC分类号： H01L21/67225 , H01L21/288 , H01L21/6704 , H01L21/67167 , H01L21/67184 , H01L21/6723 , H01L21/76849
摘要： A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.
摘要翻译： 公开了用于处理衬底的簇结构和方法。 集群架构包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。 实验室环境控制传递模块和一个或多个湿式衬底处理模块被配置为管理第一环境环境。 还提供耦合到实验室环境受控传输模块和一个或多个等离子体处理模块的真空传输模块。 真空转移模块和一个或多个等离子体处理模块被配置成管理第二周边环境。 并且，还包括耦合到真空传输模块和一个或多个环境处理模块的受控环境转移模块。 受控环境传输模块和一个或多个环境处理模块被配置为管理第三环境环境。 因此，集群架构使得能够在第一，第二或第三环境环境中以及在相关联的转换期间对衬底进行受控处理。
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公开(公告)号：US20080057182A1
公开(公告)日：2008-03-06
申请号：US11611758
申请日：2006-12-15
申请人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin Mooring , John Parks , William Thie , Fritz Redeker , Arthur Howald , Alan Schoepp , David Hemker
发明人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin Mooring , John Parks , William Thie , Fritz Redeker , Arthur Howald , Alan Schoepp , David Hemker
CPC分类号： H01L21/67207 , H01L21/76843 , H01L21/76877
摘要： A method for filling a trench of a substrate in a controlled environment is provided. The method initiates with etching a trench in the substrate in a first chamber of a cluster tool. A barrier layer configured to prevent electromigration is deposited over an exposed surface of the trench in a second chamber of the cluster tool and the trench is filled with a gap fill material deposited directly onto the barrier layer in the cluster tool. A semiconductor device fabricated by the method is also provided.
摘要翻译： 提供了一种用于在受控环境中填充衬底的沟槽的方法。 该方法通过在簇工具的第一室中蚀刻衬底中的沟槽来启动。 构造成防止电迁移的阻挡层沉积在簇工具的第二腔中的沟槽的暴露表面上，并且沟槽填充有直接沉积在簇工具中的阻挡层上的间隙填充材料。 还提供了通过该方法制造的半导体器件。
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公开(公告)号：US20080057221A1
公开(公告)日：2008-03-06
申请号：US11639752
申请日：2006-12-15
申请人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin Mooring , John Parks , William Thie , Fritz Redeker , Arthur Howald , Alan Schoepp , David Hemker
发明人： John Boyd , Yezdi Dordi , Tiruchirapalli Arunagiri , Benjamin Mooring , John Parks , William Thie , Fritz Redeker , Arthur Howald , Alan Schoepp , David Hemker
CPC分类号： H01L21/67225 , H01L21/288 , H01L21/6704 , H01L21/67167 , H01L21/67184 , H01L21/6723 , H01L21/76849
摘要： A cluster architecture and methods for processing a substrate are disclosed. The cluster architecture includes a lab-ambient controlled transfer module that is coupled to one or more wet substrate processing modules. The lab-ambient controlled transfer module and the one or more wet substrate processing modules are configured to manage a first ambient environment. A vacuum transfer module that is coupled to the lab-ambient controlled transfer module and one or more plasma processing modules is also provided. The vacuum transfer module and the one or more plasma processing modules are configured to manage a second ambient environment. And, a controlled ambient transfer module that is coupled to the vacuum transfer module and one or more ambient processing modules is also included. The controlled ambient transfer module and the one or more ambient processing modules are configured to manage a third ambient environment. The cluster architecture therefore enables controlled processing of the substrate in either the first, second or third ambient environments, as well as during associated transitions.
摘要翻译： 公开了用于处理衬底的簇结构和方法。 集群架构包括耦合到一个或多个湿式衬底处理模块的实验室环境受控传输模块。 实验室环境控制传递模块和一个或多个湿式衬底处理模块被配置为管理第一环境环境。 还提供耦合到实验室环境受控传输模块和一个或多个等离子体处理模块的真空传输模块。 真空转移模块和一个或多个等离子体处理模块被配置成管理第二周边环境。 并且，还包括耦合到真空传输模块和一个或多个环境处理模块的受控环境转移模块。 受控环境传输模块和一个或多个环境处理模块被配置为管理第三环境环境。 因此，集群架构使得能够在第一，第二或第三环境环境中以及在相关联的转换期间对衬底进行受控处理。
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公开(公告)号：US07542134B2
公开(公告)日：2009-06-02
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
IPC分类号： G01N21/00
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。
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公开(公告)号：US20080273195A1
公开(公告)日：2008-11-06
申请号：US12131909
申请日：2008-06-02
申请人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw W. Winniczek , Luai Nasser , Alan Schoepp , Fred C. Redeker , Erik Edelberg
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
摘要翻译： 用于检查基板的系统包括照相机和光源。 相机朝向视场。 该视场包括该基板的第一表面的至少第一部分。 光源相对于衬底的第一表面以第一角度β朝向视场定向。 也包括检查基板的方法。
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公开(公告)号：US20060139450A1
公开(公告)日：2006-06-29
申请号：US11016022
申请日：2004-12-17
申请人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
发明人： Aleksander Owczarz , Jaroslaw Winniczek , Luai Nasser , Alan Schoepp , Fred Redeker , Erik Edelberg
CPC分类号： G01N21/9501 , G01N2021/8822
摘要： A system for inspecting a substrate includes a camera and a light source. The camera is oriented toward a field of view. The field of view encompasses at least a first portion of a first surface of the substrate. The light source is oriented toward the field of view at a first angle β relative to the first surface of the substrate. A method for inspecting a substrate is also included.
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公开(公告)号：US20090000044A1
公开(公告)日：2009-01-01
申请号：US12210198
申请日：2008-09-14
CPC分类号： B08B3/003 , H01L21/67028 , H01L21/67046 , Y10S134/902
摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.
摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。
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公开(公告)号：US07441299B2
公开(公告)日：2008-10-28
申请号：US10816337
申请日：2004-03-31
IPC分类号： B08B11/02
CPC分类号： B08B3/003 , H01L21/67028 , H01L21/67046 , Y10S134/902
摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.
摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。
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公开(公告)号：US20050133061A1
公开(公告)日：2005-06-23
申请号：US10816337
申请日：2004-03-31
CPC分类号： B08B3/003 , H01L21/67028 , H01L21/67046 , Y10S134/902
摘要： An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.
摘要翻译： 用于处理衬底的装置包括在一定长度上延伸的刷子外壳。 电刷外壳被配置为设置在基板的表面上方，并且具有被配置为设置在基板附近的开放区域。 开放区域在刷子外壳的长度上延伸，并使来自刷子外壳内的泡沫能够接触基板的表面。 还描述了用于清洁衬底的衬底清洁系统和方法。
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公开(公告)号：US07625452B2
公开(公告)日：2009-12-01
申请号：US12210198
申请日：2008-09-14
CPC分类号： B08B3/003 , H01L21/67028 , H01L21/67046 , Y10S134/902
摘要： A method for cleaning a substrate is provided. The method includes providing foam to a surface of the substrate, brush scrubbing the surface of the substrate, providing pressure to the foam, and channeling the pressured foam to produce jammed foam, the channeling including channeling the pressured foam into a gap, the gap being defined by a space between a surface of a brush enclosure and the surface of the substrate. The brush scrubbing of the surface of the substrate and the channeling of the pressured foam across the surface of the substrate facilitate particle removal from the surface of the substrate.
摘要翻译： 提供一种清洗基板的方法。 该方法包括向基材的表面提供泡沫，刷洗基材的表面，向泡沫提供压力，以及引导加压的泡沫以产生堵塞的泡沫，所述通道包括将加压泡沫引导到间隙中，所述间隙为 由刷子壳体的表面和基板的表面之间的空间限定。 衬底表面刷毛洗涤和挤压泡沫穿过衬底的表面有助于颗粒从衬底表面移除。
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