公开(公告)号：US20050068739A1

公开(公告)日：2005-03-31

申请号：US10672494

申请日：2003-09-26

申请人： Amilcar Arvelo ,  Kamal Sikka ,  Hilton Toy

发明人： Amilcar Arvelo ,  Kamal Sikka ,  Hilton Toy

IPC分类号： H01L23/367 ,  H01L23/42 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152

摘要： Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.

摘要翻译： 公开了一种冷却结构，其具有安装在芯片上的单独的散热器或盖。 大功率撒布机或盖帽的厚度超过了较低功率的撒布机的厚度，以确保高功率撒布机达到最高平面并与具有最小界面间隙的散热器配合。 低功率撒布机和散热器底座之间的可变和更高的间隙由可压缩的热垫或油脂材料容纳。

公开(公告)号：US20080042264A1

公开(公告)日：2008-02-21

申请号：US11927145

申请日：2007-10-29

申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。

公开(公告)号：US20070236890A1

公开(公告)日：2007-10-11

申请号：US11758128

申请日：2007-06-05

申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

IPC分类号： H05K7/20 ,  B21D53/02

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US20060260784A1

公开(公告)日：2006-11-23

申请号：US10908622

申请日：2005-05-19

申请人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

发明人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

公开(公告)号：US20050189568A1

公开(公告)日：2005-09-01

申请号：US10789500

申请日：2004-02-27

申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

IPC分类号： H01L23/367 ,  H01L29/739

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。

公开(公告)号：US20060268521A1

公开(公告)日：2006-11-30

申请号：US10908796

申请日：2005-05-26

申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

IPC分类号： H05K7/20

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US08794079B2

公开(公告)日：2014-08-05

申请号：US13289121

申请日：2011-11-04

申请人： Paul F. Bodenweber ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

发明人： Paul F. Bodenweber ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

IPC分类号： G01N3/08

CPC分类号： G01L5/0038 ,  G01L5/0057 ,  G01L5/0076 ,  G01N3/08 ,  G01N27/22 ,  G01N2203/0617 ,  G01N2203/0629 ,  G01N2203/0682

摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

摘要翻译： 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

公开(公告)号：US20060261467A1

公开(公告)日：2006-11-23

申请号：US10908615

申请日：2005-05-19

申请人： Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

发明人： Evan Colgan ,  David Edwards ,  Benjamin Fasano ,  Kamal Sikka ,  Jeffrey Zitz ,  Wei Zou

IPC分类号： H01L23/34

CPC分类号： H01L23/04 ,  H01L23/3675 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

摘要： A chip package including a chip extension for containing thermal interface material (TIM) and improves chip cooling, and a related method, are disclosed. In particular, the chip package includes a chip, a cooling structure coupled to the chip via a TIM, and a chip extension may be thermally coupled to an outer edge of the chip. A TIM placed between the chip and the cooling structure is contained during thermal cycling by the chip extension such that void formation at the edge of the chip, which can move between the chip and cooling structure, is suppressed. The chip extension also improves lateral heat dissipation by providing a greater thermal contact area between the cooling structure and the chip and, if needed, the substrate at a much lower cost than using larger die with lower production unit output from a wafer.

摘要翻译： 公开了一种包括用于包含热界面材料（TIM）并提高芯片冷却的芯片延伸的芯片封装以及相关方法。 特别地，芯片封装包括芯片，经由TIM耦合到芯片的冷却结构，并且芯片延伸部可热耦合到芯片的外边缘。 放置在芯片和冷却结构之间的TIM被芯片延伸部的热循环期间包含，从而可以抑制可在芯片和冷却结构之间移动的芯片边缘处的空隙形成。 芯片延伸还通过在冷却结构和芯片之间提供更大的热接触面积，并且如果需要，以比使用具有较低的晶片生产单位输出的较大模具的成本低得多的成本来改善侧向散热。

公开(公告)号：US20130112006A1

公开(公告)日：2013-05-09

申请号：US13289121

申请日：2011-11-04

申请人： PAUL F. BODENWEBER ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

发明人： PAUL F. BODENWEBER ,  Virendra R. Jadhav ,  Steven P. Ostrander ,  Kamal Sikka ,  Jiantao Zheng ,  Jeffrey A. Zitz

IPC分类号： G01N3/08

CPC分类号： G01L5/0038 ,  G01L5/0057 ,  G01L5/0076 ,  G01N3/08 ,  G01N27/22 ,  G01N2203/0617 ,  G01N2203/0629 ,  G01N2203/0682

摘要： An apparatus for determining a magnitude of a compressive load applied to a piston including a compliant film disposed between first and second elements is provided. The apparatus includes a first part movable with the first element in a movement direction along which the magnitude of the compressive load is to be determined, a second part movable with the second element in the movement direction and a sensor to measure a distance between the first and second parts in the movement direction, the measured distance being related to a deformation of the compliant film as the compressive load is applied.

摘要翻译： 提供一种用于确定施加到包括设置在第一和第二元件之间的柔性膜的活塞的压缩载荷的大小的装置。 该装置包括第一部分，该第一部分沿着移动方向可移动地沿着移动方向移动，沿该运动方向确定压缩载荷的大小，第二部分，可沿着运动方向与第二部件移动;以及传感器，用于测量第一 和运动方向上的第二部分，所测量的距离与施加压缩载荷时柔顺膜的变形有关。

公开(公告)号：US06294408B1

公开(公告)日：2001-09-25

申请号：US09409246

申请日：1999-09-30

申请人： David L. Edwards ,  Michael J. Emmett ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Kamal Sikka ,  Hilton T. Toy

发明人： David L. Edwards ,  Michael J. Emmett ,  Sushumna Iruvanti ,  Raed A. Sherif ,  Kamal Sikka ,  Hilton T. Toy

IPC分类号： H01L2148

CPC分类号： H01L23/10 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/19105 ,  H01L2224/0401

摘要： A method and apparatus for electronic chip assembly maintains a thin gap spacing between the chip and the lid or heat sink and provides for the electronic chip to operate at a relatively cool temperature. The thermal performance is enhanced by a thermal interface material provided in the thin gap and maintained at a minimal thickness as a result of the structure and assembly process. A thin thermal interface material layer may be achieved with a compression step to compress the thermal interface material before the sealant is cured. In addition, a vent hole is provided in the assembly to prevent pressure build-up inside the module during sealant cure. As the sealant is cured, the gap spacing is maintained, further compression of the thermal interface material is not required, and seal defects are prevented.

摘要翻译： 用于电子芯片组件的方法和装置在芯片和盖子或散热器之间保持薄的间隙，并且使电子芯片在相对较冷的温度下工作。 通过设置在薄间隙中的热界面材料来增强热性能，并且由于结构和组装过程而保持在最小厚度。 可以通过压缩步骤来实现薄的热界面材料层，以在密封剂固化之前压缩热界面材料。 此外，在组件中设置通气孔，以防止密封剂固化期间模块内的压力积聚。 当密封剂固化时，保持间隙间隔，不需要进一步压缩热界面材料，并且防止密封缺陷。