公开(公告)号：US20050068739A1

公开(公告)日：2005-03-31

申请号：US10672494

申请日：2003-09-26

申请人： Amilcar Arvelo ,  Kamal Sikka ,  Hilton Toy

发明人： Amilcar Arvelo ,  Kamal Sikka ,  Hilton Toy

IPC分类号： H01L23/367 ,  H01L23/42 ,  H01L23/433 ,  H05K7/20

CPC分类号： H01L23/3675 ,  H01L23/42 ,  H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/16152

摘要： Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.

摘要翻译： 公开了一种冷却结构，其具有安装在芯片上的单独的散热器或盖。 大功率撒布机或盖帽的厚度超过了较低功率的撒布机的厚度，以确保高功率撒布机达到最高平面并与具有最小界面间隙的散热器配合。 低功率撒布机和散热器底座之间的可变和更高的间隙由可压缩的热垫或油脂材料容纳。

公开(公告)号：US20050189568A1

公开(公告)日：2005-09-01

申请号：US10789500

申请日：2004-02-27

申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

IPC分类号： H01L23/367 ,  H01L29/739

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。

公开(公告)号：US20080042264A1

公开(公告)日：2008-02-21

申请号：US11927145

申请日：2007-10-29

申请人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

发明人： Evan Colgan ,  Jeffrey Gelorme ,  Kamal Sikka ,  Hilton Toy ,  Jeffrey Zitz

IPC分类号： H01L23/36

CPC分类号： H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.

摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。

公开(公告)号：US20070236890A1

公开(公告)日：2007-10-11

申请号：US11758128

申请日：2007-06-05

申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

IPC分类号： H05K7/20 ,  B21D53/02

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US20060260784A1

公开(公告)日：2006-11-23

申请号：US10908622

申请日：2005-05-19

申请人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

发明人： Raschid Bezama ,  Govindarajan Natarajan ,  Kamal Sikka ,  Hilton Toy

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

摘要： Low-pressure drop thermal assemblies, systems and methods of making low-pressure drop thermal assemblies for use in high power flux situations. A manifold body is attached to a distributor to form a subassembly. This subassembly is in communication with a substrate surface, which has a semiconductor device in need of thermal management thereon. An enclosed cavity is formed between the target substrate surface and the subassembly, and a seal of the cavity protects critical components residing on the active surface of the semiconductor device. The distributor includes a distributed liquid impingement microjet inlet array isolated from and parallel with a distributed microjet drain array for impinging cooling fluid and removing spent heated fluid in a direction orthogonal to a target surface for maximizing the heat transfer rate, and thereby providing high cooling flux capabilities while enabling low-pressure drops.

公开(公告)号：US20060268521A1

公开(公告)日：2006-11-30

申请号：US10908796

申请日：2005-05-26

申请人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

发明人： Jeffrey Coffin ,  Michael Gaynes ,  David Questad ,  Kamal Sikka ,  Hilton Toy ,  Jamil Wakil

IPC分类号： H05K7/20

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L23/42 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/3511 ,  Y10T29/49004 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/4935

摘要： Disclosed are thermally conductive plates. Each plate is configured such that a uniform adhesive-filled gap may be achieved between the plate and a heat generating structure when the plate is bonded to the heat generating structure and subjected to a temperature within a predetermined temperature range that causes the heat generating structure to warp. Additionally, this disclosure presents the associated methods of forming the plates and of bonding the plates to a heat generating structure. In one embodiment the plate is curved and modeled to match the curved surface of a heat generating structure within the predetermined temperature range. In another embodiment the plate is a multi-layer conductive structure that is configured to undergo the same warpage under a thermal load as the heat generating structure. Thus, when the plate is bonded with the heat generating structure it is able to achieve and maintain a uniform adhesive-filled gap at any temperature.

摘要翻译： 披露的是导热板。 每个板被构造成使得当板结合到发热结构并经受使得发热结构的预定温度范围内的温度时，板和发热结构之间可以实现均匀的粘合剂填充的间隙 经。 另外，本公开提供了形成板并将板结合到发热结构的相关方法。 在一个实施例中，板是弯曲的并被建模以使发热结构的弯曲表面在预定温度范围内匹配。 在另一个实施例中，板是多层导电结构，其被配置为在与热产生结构相关的热负荷下经历相同的翘曲。 因此，当板与发热结构接合时，能够在任何温度下实现和保持均匀的粘合剂填充间隙。

公开(公告)号：US20080002363A1

公开(公告)日：2008-01-03

申请号：US11427380

申请日：2006-06-29

申请人： Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

发明人： Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

IPC分类号： H05K7/20

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

摘要： A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.

摘要翻译： 提供了一种直接液体喷射冲击模块和提供这种用于冷却容纳在电子封装中的电子部件的相关方法。 模块包括具有孔的框架，该孔被放置在待冷却的部件上。 然后将歧管设置在框架上方，使得歧管开口与框架孔对准，以最终使流体冲击待冷却的部件。 歧管形成为接收用于冷却剂流动的入口和用于消除散热的出口接头。 歧管开口内还设有喷射孔板，与框架孔对准，用于将流体冷却剂流体流过待冷却的部件。

公开(公告)号：US20070222064A1

公开(公告)日：2007-09-27

申请号：US11755019

申请日：2007-05-30

申请人： David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

发明人： David Edwards ,  Sushumna Iruvanti ,  Hilton Toy ,  Wei Zou

IPC分类号： H01L23/12

CPC分类号： H01L23/04 ,  H01L23/10 ,  H01L23/3675 ,  H01L23/42 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/1616 ,  Y10S257/924

摘要： A semiconductor module structure and a method of forming the semiconductor module structure are disclosed. The structure incorporates a die mounted on a substrate and covered by a lid. A thermal compound is disposed within a thermal gap between the die and the lid. A barrier around the periphery of the die extends between the lid and the substrate, contains the thermal compound, and flexes in response to expansion and contraction of both the substrate and the lid during cycling of the semiconductor module. More particularly, either the barrier is formed of a flexible material or has a flexible connection to the substrate and/or to the lid. The barrier effectively contains the thermal compound between the die and the lid and, thereby, provides acceptable and controlled coverage of the thermal compound over the die for heat removal.

摘要翻译： 公开了半导体模块结构和形成半导体模块结构的方法。 该结构包括安装在基板上并被盖子覆盖的模具。 热化合物设置在模具和盖子之间的热间隙内。 围绕模具周边的屏障在盖和基板之间延伸，包含热化合物，并且在半导体模块循环期间响应于基板和盖的膨胀和收缩而弯曲。 更具体地，屏障由柔性材料形成或具有与基底和/或盖的柔性连接。 屏障有效地包含了模具和盖子之间的热化合物，从而提供可靠和可控的覆盖模具上的热化合物以进行散热。

公开(公告)号：US20080017223A1

公开(公告)日：2008-01-24

申请号：US11831030

申请日：2007-07-31

申请人： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

发明人： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

IPC分类号： B08B3/00

CPC分类号： H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

摘要翻译： 从用于回收或回收模块组件的可用部件，特别是高成本的半导体器件，散热器和其它模块部件的电子部件中去除固化的导电聚合物粘合剂（这里公开为热界面材料）的方法。

公开(公告)号：US20070270536A1

公开(公告)日：2007-11-22

申请号：US11831039

申请日：2007-07-31

申请人： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

发明人： Krishna Sachdev ,  Daniel Berger ,  Kelly Chioujones ,  Glenn Daves ,  Hilton Toy

IPC分类号： C08K3/08

CPC分类号： H01L24/32 ,  C08K3/08 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/29111 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K3/321 ,  Y10T428/31515 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014

摘要： A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

摘要翻译： 一种可再加工的导电粘合剂组合物，其包含环氧基导电粘合剂，其包含分散在无溶剂的杂环氧聚合物基质中的导电金属填料颗粒。