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1.发明申请Apparatus and Methods for Cooling Semiconductor Integrated Circuit Package Structures 失效用于冷却半导体集成电路封装结构的装置和方法公开(公告)号：US20080042264A1
公开(公告)日：2008-02-21
申请号：US11927145
申请日：2007-10-29
申请人： Evan Colgan , Jeffrey Gelorme , Kamal Sikka , Hilton Toy , Jeffrey Zitz
发明人： Evan Colgan , Jeffrey Gelorme , Kamal Sikka , Hilton Toy , Jeffrey Zitz
IPC分类号： H01L23/36
CPC分类号： H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.
摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。
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2.发明申请Apparatus and methods for cooling semiconductor integrated circuit package structures 失效用于冷却半导体集成电路封装结构的装置和方法公开(公告)号：US20050189568A1
公开(公告)日：2005-09-01
申请号：US10789500
申请日：2004-02-27
申请人： Evan Colgan , Jeffrey Gelorme , Kamal Sikka , Hilton Toy , Jeffrey Zitz
发明人： Evan Colgan , Jeffrey Gelorme , Kamal Sikka , Hilton Toy , Jeffrey Zitz
IPC分类号： H01L23/367 , H01L29/739
CPC分类号： H01L23/367 , H01L2924/0002 , H01L2924/00
摘要： Apparatus and methods are provided for thermally coupling a semiconductor chip directly to a heat conducting device (e.g., a copper heat sink) using a thermal joint that provides increased thermal conductivity between the heat conducting device and high power density regions of the semiconductor chip, while minimizing or eliminating mechanical stress due to the relative displacement due to the difference in thermal expansion between the semiconductor chip and the heat conducting device.
摘要翻译： 提供了使用在热传导装置和半导体芯片的高功率密度区域之间提供增加的热导率的热接头将半导体芯片直接热耦合到导热装置（例如，铜散热器）的装置和方法，同时 最小化或消除由于半导体芯片和导热装置之间的热膨胀差异而导致的相对位移的机械应力。
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3.发明申请Enhanced thermo-oxidative stability thermal interface compositions and use thereof in microelectronics assembly 有权增强的热氧化稳定性热界面组合物及其在微电子组件中的应用公开(公告)号：US20070161521A1
公开(公告)日：2007-07-12
申请号：US11330922
申请日：2006-01-12
申请人： Krishna Sachdev , Mark Chace , Normand Cote , David Gardell , Jeffrey Gelorme , Sushumna Iruvanti , G. Lawson , Tuknekah Noble , Harbans Sachdev
发明人： Krishna Sachdev , Mark Chace , Normand Cote , David Gardell , Jeffrey Gelorme , Sushumna Iruvanti , G. Lawson , Tuknekah Noble , Harbans Sachdev
IPC分类号： C10M129/10 , C10M137/02
CPC分类号： C10M129/10 , C09K5/10 , C10M137/02 , C10M2205/0285 , C10M2207/024 , C10M2207/026 , C10M2215/064 , C10M2223/049 , C10N2230/08 , C10N2230/10 , C10N2240/201
摘要： Liquid compositions containing a specific hindered phenol or a hindered phenol in combination with an aromatic phosphite are provided which are used as a thermal interface between a heatsink and a chip during a test procedure for electronic components which compositions enhance the thermal conductivity between the heatsink and the chip, are easily removed from the heatsink and the chip after the test procedure without any deleterious residue and which allow the use of high temperatures for extended periods during the test procedure without any significant degradation of the composition. A method for using the compositions in electronic component test procedures such as burn-in procedures is also provided.
摘要翻译： 提供了含有特定受阻酚或受阻酚与芳族亚磷酸酯组合的液体组合物，其用于在电子部件的测试过程期间用作散热器和芯片之间的热界面，该组合物增强了散热器和 芯片，在测试程序之后容易地从散热器和芯片上移除而没有任何有害的残留物，并且允许在测试过程中长时间使用高温而没有组合物的任何显着降解。 还提供了一种在诸如老化程序的电子部件测试程序中使用组合物的方法。
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公开(公告)号：US20060197065A1
公开(公告)日：2006-09-07
申请号：US11072193
申请日：2005-03-04
IPC分类号： B32B3/00
CPC分类号： C09J163/00 , C08L63/00 , C09J9/02 , H05K1/095 , H05K3/321 , H05K3/4069 , H05K2203/122 , Y10T156/10 , Y10T428/24917
摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).
摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。 37 CFR§1.72（b）。
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公开(公告)号：US20060042358A1
公开(公告)日：2006-03-02
申请号：US10928396
申请日：2004-08-27
IPC分类号： G01M3/04
摘要： One embodiment of the present method and apparatus for detecting leaks in a fluid cooling system enables a user to rapidly detect fluid leaks in the vicinity of a microprocessor chip or other delicate item. In one embodiment, the invention comprises a detector and a border coupled to the detector and disposed peripherally about a protected item (e.g., the microprocessor chip or other delicate item). In one embodiment, the border is a layered structure that is adapted to complete an electrical circuit with the detector when the border comes into contact with fluid.
摘要翻译： 用于检测流体冷却系统中的泄漏的本方法和装置的一个实施例使得用户能够快速检测微处理器芯片附近或其它微妙物品的流体泄漏。 在一个实施例中，本发明包括检测器和耦合到检测器的边界，并围绕受保护物品（例如，微处理器芯片或其它精细物品）周边设置。 在一个实施例中，边界是分层结构，其适于在边界与流体接触时与检测器完成电路。
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6.发明申请Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation 有权离心方法，用于提供具有电路形成的粉末材料的高纵横比盲孔公开(公告)号：US20060177568A1
公开(公告)日：2006-08-10
申请号：US11049846
申请日：2005-02-04
申请人： Gareth Hougham , Leena Buchwalter , Stephen Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey Gelorme , Kathleen Hinge , Anurag Jain , Sung Kang , John Knickerbocker
发明人： Gareth Hougham , Leena Buchwalter , Stephen Buchwalter , Jon Casey , Claudius Feger , Matteo Flotta , Jeffrey Gelorme , Kathleen Hinge , Anurag Jain , Sung Kang , John Knickerbocker
CPC分类号： H05K3/4053 , B05D1/002 , H01L21/486 , H01L21/76898 , H05K2201/09509 , H05K2203/1554
摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.
摘要翻译： 本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构 支撑或电子部件的保护构件。
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公开(公告)号：US20060157223A1
公开(公告)日：2006-07-20
申请号：US11037913
申请日：2005-01-18
IPC分类号： H05K7/20
CPC分类号： H01L23/3733 , H01L23/4093 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a thermal interface for coupling a heat source to a heat sink. One embodiment of the invention comprises a mesh and a liquid, e.g., a thermally conductive liquid, disposed in the mesh. The mesh and the thermally conductive liquid are adapted to contact both the heat source and the heat sink when disposed therebetween. In one embodiment, the mesh may comprise a metal or organic material compatible with the liquid. In one embodiment, the liquid may comprise liquid metal. For example, the liquid may comprise a gallium indium tin alloy. A gasket may optionally be used to seal the mesh and the liquid between the heat source and the heat sink. In one embodiment, the heat source is an integrated circuit chip.
摘要翻译： 本发明是用于将热源耦合到散热器的热界面。 本发明的一个实施例包括设置在网中的网和液体，例如导热液体。 网格和导热液体在其间设置时适于接触热源和散热器。 在一个实施方案中，网可以包含与液体相容的金属或有机材料。 在一个实施方案中，液体可以包含液态金属。 例如，液体可以包括镓铟锡合金。 可以可选地使用垫圈来密封网格和热源和散热器之间的液体。 在一个实施例中，热源是集成电路芯片。
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公开(公告)号：US20050061474A1
公开(公告)日：2005-03-24
申请号：US10665798
申请日：2003-09-18
IPC分类号： H01L23/433 , H05K7/20
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： The present invention is a thermal interface for IC chip cooling. One embodiment of the invention comprises a thermally conductive liquid or paste-like metal(s) disposed within a flexible, thermally conductive enclosure. The enclosure is adapted to be placed between an IC chip and a heat sink to enhance heat transfer from the chip to the heat sink, thereby enabling quicker and more efficient cooling of the chip than can be achieved by conventional techniques. In several embodiments, the thermal interface is held in place by mechanical pressure rather than by bonding, which further facilitates inspection and repair of the IC device.
摘要翻译： 本发明是用于IC芯片冷却的热界面。 本发明的一个实施例包括设置在柔性导热外壳内的导热液体或糊状金属。 壳体适于放置在IC芯片和散热器之间，以增强从芯片到散热片的热传递，从而比通过常规技术可以实现的更快和更有效地冷却芯片。 在几个实施例中，热界面通过机械压力而不是通过粘合保持在适当位置，这进一步便于IC器件的检查和修理。
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9.发明申请Method and apparatus for chip cooling using a liquid metal thermal interface 审中-公开使用液态金属热界面进行芯片冷却的方法和装置公开(公告)号：US20060131738A1
公开(公告)日：2006-06-22
申请号：US11220825
申请日：2005-09-06
申请人： Bruce Furman , Jeffrey Gelorme , Nancy LaBianca , Yves Martin , Da Shih , Theodore Van Kessel
发明人： Bruce Furman , Jeffrey Gelorme , Nancy LaBianca , Yves Martin , Da Shih , Theodore Van Kessel
IPC分类号： H01L23/34
CPC分类号： H01L23/3737 , H01L23/3736 , H01L23/42 , H01L2924/0002 , H01L2924/00
摘要： In one embodiment, the present invention is a method and apparatus for chip cooling using a liquid metal thermal interface. One embodiment of an inventive thermal interface for facilitating thermal contact between opposing surfaces of an integrated circuit chip and a heat sink the thermal interface includes a liquid metal layer comprising a thermally conductive liquid metal material. A first barrier layer bonds the liquid metal layer to the surface of the integrated circuit chip, and a second barrier layer bonds the liquid metal layer to the surface of the heat sink.
摘要翻译： 在一个实施例中，本发明是一种使用液态金属热界面进行芯片冷却的方法和装置。 用于促进集成电路芯片和散热器的相对表面之间的热接触的本发明热界面的一个实施例，热界面包括包含导热液体金属材料的液态金属层。 第一阻挡层将液态金属层结合到集成电路芯片的表面，并且第二阻挡层将液态金属层结合到散热器的表面。
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10.发明申请公开(公告)号：US20060112857A1
公开(公告)日：2006-06-01
申请号：US10986665
申请日：2004-11-12
申请人： Gareth Hougham , Paul Lauro , Brian Sundlof , Jeffrey Gelorme
发明人： Gareth Hougham , Paul Lauro , Brian Sundlof , Jeffrey Gelorme
IPC分类号： C09C1/44
CPC分类号： H01L23/3733 , B82Y30/00 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , Y10S977/788 , Y10T156/10 , Y10T428/24994 , H01L2224/0401
摘要： The present invention relates generally to thermally-conductive pastes for use with integrated circuits, and particularly, but not by way of limitation, to self-orienting microplates of graphite.
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