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公开(公告)号：US20050077081A1
公开(公告)日：2005-04-14
申请号：US10681554
申请日：2003-10-08
申请人： Anand Govind , Zafer Kutlu , Farshad Ghahghahi
发明人： Anand Govind , Zafer Kutlu , Farshad Ghahghahi
IPC分类号： H01L23/498 , H05K1/11
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal traces. A high stress area associated with the corner of the dies is defined. Preferably the high stress area is defined as two ball pitches away from the corner of the die. Signal traces are routed away from the high stress area and in particular signal traces are routed away from the ball pads associated with the high stress to eliminate the cracks in the routed traces.
摘要翻译： 一种具有改善热循环可靠性的模具的半导体封装。 包装的第一层提供分散在其中的球垫。 封装的第二层提供信号迹线。 定义了与模具角部相关联的高应力区域。 优选地，高应力区域被定义为远离模具角部的两个球距。 信号迹线远离高应力区域，特别是信号迹线远离与高应力相关联的球垫，以消除路线迹线中的裂纹。
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公开(公告)号：US07345245B2
公开(公告)日：2008-03-18
申请号：US10681554
申请日：2003-10-08
申请人： Anand Govind , Zafer Kutlu , Farshad Ghahghahi
发明人： Anand Govind , Zafer Kutlu , Farshad Ghahghahi
IPC分类号： H05K1/16
CPC分类号： H01L23/49838 , H01L23/49816 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor package for a die with improved thermal cycling reliability. A first layer of the package provides ball pads dispersed throughout. A second layer of the package provides signal traces. A high stress area associated with the corner of the dies is defined. Preferably the high stress area is defined as two ball pitches away from the corner of the die. Signal traces are routed away from the high stress area and in particular signal traces are routed away from the ball pads associated with the high stress to eliminate the cracks in the routed traces.
摘要翻译： 一种具有改善热循环可靠性的模具的半导体封装。 包装的第一层提供分散在其中的球垫。 封装的第二层提供信号迹线。 定义了与模具角部相关联的高应力区域。 优选地，高应力区域被定义为远离模具角部的两个球距。 信号迹线远离高应力区域，特别是信号迹线远离与高应力相关的球垫，以消除路由迹线中的裂纹。
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公开(公告)号：US07081672B1
公开(公告)日：2006-07-25
申请号：US11073802
申请日：2005-03-07
IPC分类号： H01L23/34
CPC分类号： H01L23/49827 , H01L23/49838 , H01L23/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/01078 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011 , H05K1/0219 , H05K1/0222 , H05K1/0254 , H05K1/0263 , H05K1/0366 , H05K1/115 , H05K3/4602 , H05K2201/029 , H05K2201/09536 , H05K2201/09609 , H01L2924/00 , H01L2224/0401
摘要： A substrate is provided, which has a pattern of voltage supply vias extending through at least a portion of the substrate. Each of a plurality of the voltage supply vias is surrounded by four of the voltage supply vias of a same polarity in four orthogonal directions and by four voltage supply vias of an opposite polarity in four diagonal directions.
摘要翻译： 提供了一种衬底，其具有延伸通过衬底的至少一部分的电压供给通孔的图案。 多个电压供给通路中的每一个由四个正交方向上的相同极性的四个电压供给通孔和四个对角线方向上具有相反极性的四个电压供给通路围绕。
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4.发明授权Measurement of package interconnect impedance using tester and supporting tester 失效使用测试仪和支持测试仪测量封装互连阻抗公开(公告)号：US06946866B2
公开(公告)日：2005-09-20
申请号：US10620057
申请日：2003-07-15
CPC分类号： G01R31/2886
摘要： A tester head from a tester is used to mount a probe card. A DUT/load board has a socket which is configured to hold a substrate. Probe pins from the probe card make contact with bump pads on the substrate. Signal wires from the DUT/load board are fed to the tester, and the tester is connected to a DSO with a fast rise time signal head. During testing, a signal is launched using the DSO into a coaxial cable which is connected to the test head. The launched signal and the reflected signal are captured back by the DSO, and then fed into the tester. Using this data, post processing software is used to obtain the interconnect impedance versus time for the device (i.e., package) under test. The method and apparatus can be used in connection with both Flip Chip and Wire bonded products.
摘要翻译： 来自测试仪的测试仪头用于安装探针卡。 DUT /负载板具有被配置为保持衬底的插座。 探针卡的探头引脚与基板上的凸点焊盘接触。 来自DUT /负载板的信号线馈送到测试仪，测试仪连接到具有快速上升时间信号头的DSO。 在测试期间，使用DSO将信号发射到连接到测试头的同轴电缆。 发射信号和反射信号由DSO捕获，然后送入测试仪。 使用该数据，后处理软件用于获得被测器件（即，封装）的互连阻抗与时间的关系。 该方法和设备可以与倒装芯片和线接合产品一起使用。
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公开(公告)号：US20050110167A1
公开(公告)日：2005-05-26
申请号：US10720958
申请日：2003-11-24
IPC分类号： H01L23/498 , H01L23/48
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2224/73253 , H01L2924/15173 , H01L2924/15192 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011
摘要： A flip chip substrate is provided, which includes a plurality of conductive layers, including a top layer and a bottom layer. A first plurality of contacts, including first and second contacts corresponding to a differential signal pair, are arranged on the top layer within a die bonding area. A second plurality of contacts, including third and fourth contacts corresponding to the differential signal pair, are arranged on the bottom layer. First and second traces are routed between the first and third contacts and between the second and fourth contacts, respectively, wherein the second trace is routed out of the die bonding area on a different layer than the first trace. The traces are routed in a manner that reduces the length difference between the traces.
摘要翻译： 提供了倒装芯片基板，其包括多个导电层，包括顶层和底层。 包括对应于差分信号对的第一和第二触点的第一多个触点布置在芯片粘接区域内的顶层上。 包括对应于差分信号对的第三和第四触点的第二多个触点布置在底层上。 第一和第二迹线分别在第一和第三触点之间以及第二和第四触点之间布线，其中第二迹线在与第一迹线不同的层上被引导出芯片粘合区域外。 迹线以减少迹线之间的长度差的方式布线。
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公开(公告)号：US06825066B2
公开(公告)日：2004-11-30
申请号：US10308310
申请日：2002-12-03
申请人： Yogendra Ranade , Anand Govind , Kumar Nagarajan , Farshad Ghahghahi , Aritharan Thurairajaratnam
发明人： Yogendra Ranade , Anand Govind , Kumar Nagarajan , Farshad Ghahghahi , Aritharan Thurairajaratnam
IPC分类号： H01L2144
CPC分类号： H01L23/04 , H01L23/50 , H01L25/165 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： A stiffener for reinforcing a package integrated circuit. The stiffener includes a rigid planar element having a first surface for bonding to a package substrate. The rigid planar element forms a major interior aperture for receiving and surrounding an integrated circuit on all sides of the integrated circuit. The rigid planar element also forms a minor interior aperture for receiving and surrounding a secondary circuit structure on at least three sides of the secondary circuit structure. In this manner, the stiffener provides structural support to the integrated circuit package, which reduces and preferably eliminates twisting and warping of the substrate package as it heats and is subjected to other stresses. Because the major interior apertures does not need to be large enough to fit both the monolithic integrated circuit and the secondary circuit structure, there is more stiffener material available to provide structural support than there would be if the major interior aperture was large enough to fit both the monolithic integrated circuit and the secondary circuit structure.
摘要翻译： 用于加强封装集成电路的加强件。 加强件包括刚性平面元件，其具有用于结合到封装基板的第一表面。 刚性平面元件形成用于在集成电路的所有侧面上接收和围绕集成电路的主要内部孔。 刚性平面元件还形成次要内孔，用于在次级电路结构的至少三侧上接收和围绕次级电路结构。 以这种方式，加强件提供对集成电路封装的结构支撑，其降低并优选地消除了衬底封装在其加热并经受其它应力时的扭曲和翘曲。 因为主要内部孔径不需要足够大以适合单片集成电路和次级电路结构，所以有更多的加强材料可用于提供结构支撑，如果主要内部孔径足够大以适合于两者 单片集成电路和二次电路结构。
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公开(公告)号：US07105926B2
公开(公告)日：2006-09-12
申请号：US10720958
申请日：2003-11-24
IPC分类号： H01L29/40
CPC分类号： H01L23/49827 , H01L23/49838 , H01L2224/16 , H01L2224/73253 , H01L2924/15173 , H01L2924/15192 , H01L2924/15311 , H01L2924/16195 , H01L2924/3011
摘要： A flip chip substrate is provided, which includes a plurality of conductive layers, including a top layer and a bottom layer. A first plurality of contacts, including first and second contacts corresponding to a differential signal pair, are arranged on the top layer within a die bonding area. A second plurality of contacts, including third and fourth contacts corresponding to the differential signal pair, are arranged on the bottom layer. First and second traces are routed between the first and third contacts and between the second and fourth contacts, respectively, wherein the second trace is routed out of the die bonding area on a different layer than the first trace. The traces are routed in a manner that reduces the length difference between the traces.
摘要翻译： 提供了倒装芯片基板，其包括多个导电层，包括顶层和底层。 包括对应于差分信号对的第一和第二触点的第一多个触点布置在芯片粘接区域内的顶层上。 包括对应于差分信号对的第三和第四触点的第二多个触点布置在底层上。 第一和第二迹线分别在第一和第三触点之间以及第二和第四触点之间布线，其中第二迹线在与第一迹线不同的层上被引导出芯片粘合区域外。 迹线以减少迹线之间的长度差的方式布线。
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公开(公告)号：US06531932B1
公开(公告)日：2003-03-11
申请号：US09894210
申请日：2001-06-27
IPC分类号： H01P308
CPC分类号： H01P3/084 , H01L2224/16225 , H01L2224/32225 , H01L2224/73253 , H01L2924/15311 , H01P3/088
摘要： A method for fabricating a microstrip package to optimize signal trace impedance control is disclosed. The method includes patterning a plurality of signal traces on a multilayer substrate, and patterning a plurality of guard traces on the multilayer substrate, that are interspersed alternately among the signal traces to provide noise shielding between the signal traces. In a further embodiment, the traces are patterned on the substrate with a width that is adjusted at different locations based on the presence the guard traces to enable the package to meet a particular impedance requirement.
摘要翻译： 公开了一种用于制造微带封装以优化信号迹线阻抗控制的方法。 该方法包括在多层衬底上图形化多条信号迹线，以及对多层衬底上的多条保护迹线进行构图，其中交替地在信号迹线之间散布以提供信号迹线之间的噪声屏蔽。 在另一个实施例中，迹线在衬底上被图案化，其宽度基于保护迹线的存在而被调整到不同的位置，以使封装能够满足特定的阻抗要求。
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公开(公告)号：US06534968B1
公开(公告)日：2003-03-18
申请号：US09928071
申请日：2001-08-10
IPC分类号： G01R3100
CPC分类号： G01R31/04 , G01R31/2853 , G01R31/31716 , H05K1/0268 , H05K3/3436
摘要： An apparatus for detecting failures in electrical connections between an integrated circuit package substrate and a circuit board. The substrate has substrate electrical contacts that are electrically connected one to another in first sets in a first region of the substrate. The circuit board has circuit board electrical contacts that are electrically connected one to another in second sets in a second region of the circuit board. The substrate electrical contacts align with and make electrical contact with the circuit board electrical contacts. The first region of the substrate aligns with the second region of the circuit board when the substrate electrical contacts make electrical contact with the circuit board electrical contacts. The first sets of substrate electrical contacts form chains of electrical contacts with the second sets of circuit board electrical contacts. The chains of electrical contacts loop back and forth electrically between the substrate and the circuit board.
摘要翻译： 一种用于检测集成电路封装衬底和电路板之间的电连接故障的装置。 衬底具有在衬底的第一区域中的第一组中彼此电连接的衬底电触点。 电路板具有在电路板的第二区域中在第二组中彼此电连接的电路板电触点。 基板电触点与电路板电触点对齐并与之电接触。 当基板电触头与电路板电触点电接触时，基板的第一区域与电路板的第二区域对齐。 第一组基板电触点与第二组电路板电触点形成电触点链。 电触头链在基板和电路板之间电连接。
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10.发明授权Transmission equalization system and an integrated circuit package employing the same 有权传输均衡系统和采用该系统的集成电路封装公开(公告)号：US06496081B1
公开(公告)日：2002-12-17
申请号：US09967195
申请日：2001-09-28
IPC分类号： H04B314
摘要： The present invention provides a transmission equalization system for use with an integrated circuit package employing a substrate. In one embodiment, the transmission equalization system includes a signal transmission subsystem having a pair of transmission line conductors located in the substrate and employing a differential electrical signal. The transmission equalization system also includes an equalization subsystem located proximate the pair of transmission line conductors that employs at least one aperture positioned and oriented to provide a substantially equivalent transmission environment for each of the pair of transmission line conductors.
摘要翻译： 本发明提供一种与使用基板的集成电路封装一起使用的传输均衡系统。 在一个实施例中，传输均衡系统包括信号传输子系统，其具有位于衬底中的一对传输线导体并采用差分电信号。 传输均衡系统还包括位于该对传输线路导体附近的均衡子系统，该均衡子系统使用至少一个定位和定向的孔径，以为该对传输线路导体中的每一个提供基本相等的传输环境。
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