公开(公告)号：US07167074B2

公开(公告)日：2007-01-23

申请号：US11034323

申请日：2005-01-12

申请人： Andreas A. Fenner ,  John V. Anderson, II ,  Mohsen Askarinya ,  Tina F. Abnoosi

发明人： Andreas A. Fenner ,  John V. Anderson, II ,  Mohsen Askarinya ,  Tina F. Abnoosi

IPC分类号： H01F5/00

CPC分类号： H01F27/2804 ,  A61N1/3956 ,  H01F2027/2819

摘要： Method and apparatus are provided for fabricating a planar transformer assembly for use in an implantable medical device. The planar transformer assembly includes a board, a first core, and a second core. The board has a first side, a second side, and an embedded winding, wherein the embedded winding includes a primary winding and a secondary winding and is at least partially embedded in the board between the first and second sides.

摘要翻译： 提供了用于制造用于可植入医疗装置的平面变压器组件的方法和装置。 平面变压器组件包括板，第一芯和第二芯。 该板具有第一面，第二面和嵌入式绕组，其中嵌入式绕组包括初级绕组和次级绕组，并且至少部分地嵌入在第一和第二侧之间的板中。

公开(公告)号：US20130335937A1

公开(公告)日：2013-12-19

申请号：US13524368

申请日：2012-06-15

申请人： Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

发明人： Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

IPC分类号： H05K1/18

CPC分类号： H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

摘要翻译： 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

公开(公告)号：US09252415B2

公开(公告)日：2016-02-02

申请号：US13524304

申请日：2012-06-15

申请人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

发明人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

IPC分类号： H01M2/10 ,  H01M2/20 ,  H01M2/24 ,  H01M2/26 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/647 ,  H01M6/40 ,  H01M6/46 ,  H01M2/22 ,  H01M10/04 ,  H01M10/0525 ,  A61N1/378 ,  A61N1/375

CPC分类号： H01M2/204 ,  A61N1/3758 ,  A61N1/378 ,  H01M2/1066 ,  H01M2/202 ,  H01M2/22 ,  H01M2/24 ,  H01M2/266 ,  H01M6/40 ,  H01M6/46 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/647 ,  Y02E60/122 ,  Y10T29/49112

摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.

摘要翻译： 平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。 在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。 在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。 如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。 如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。

公开(公告)号：US08824161B2

公开(公告)日：2014-09-02

申请号：US13524368

申请日：2012-06-15

申请人： Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

发明人： Mohsen Askarinya ,  Mark R. Boone ,  Andreas A. Fenner ,  Lejun Wang ,  Kenneth Heames

IPC分类号： H05K7/00

CPC分类号： H01L25/00 ,  A61N1/3758 ,  A61N1/3968 ,  H01F27/2804 ,  H01F2027/2819 ,  H01L23/647 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

摘要： A hybrid integrated circuit in a wafer level package for an implantable medical device includes one or more passive component windings formed, at least in part, along one or more routing layers of the package. The windings may be primary and secondary windings of a transformer, wherein all or part of a magnetic core thereof is embedded in a component layer of the wafer level package. If the core includes a part bonded to a surface of the package, that part of the core may be E-shaped with legs extending into the routing layers, and, in some cases, through the routing layers. Routing layers may be formed on both sides of the component layer to accommodate the transformer windings, in some instances.

摘要翻译： 用于可植入医疗器件的晶片级封装中的混合集成电路包括至少部分地沿着封装的一个或多个布线层形成的一个或多个无源元件绕组。 绕组可以是变压器的初级和次级绕组，其中全部或部分磁芯嵌入在晶片级封装的组件层中。 如果芯包括结合到包装表面的部分，那么芯部的该部分可以是E形的，其中腿部延伸到路线层中，并且在一些情况下，可以通过路由层。 在某些情况下，路由层可以形成在组件层的两侧以容纳变压器绕组。

公开(公告)号：US20130337313A1

公开(公告)日：2013-12-19

申请号：US13524304

申请日：2012-06-15

申请人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

发明人： Mohsen Askarinya ,  Andreas A. Fenner ,  Erik J. Herrmann ,  David A. Ruben ,  John K. Day

IPC分类号： H01M2/22 ,  H01M10/04

CPC分类号： H01M2/204 ,  A61N1/3758 ,  A61N1/378 ,  H01M2/1066 ,  H01M2/202 ,  H01M2/22 ,  H01M2/24 ,  H01M2/266 ,  H01M6/40 ,  H01M6/46 ,  H01M10/0436 ,  H01M10/0525 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/647 ,  Y02E60/122 ,  Y10T29/49112

摘要： Arrays of planar solid state batteries are stacked in an aligned arrangement for subsequent separation into individual battery stacks. Prior to stacking, a redistribution layer (RDL) is formed over a surface of each wafer that contains an array; each RDL includes first and second groups of conductive traces, each of the first extending laterally from a corresponding positive battery contact, and each of the second extending laterally from a corresponding negative battery contact. Conductive vias, formed before or after stacking, ultimately couple together corresponding contacts of aligned batteries. If before, each via extends through a corresponding battery contact of each wafer and is coupled to a corresponding conductive layer that is included in another RDL formed over an opposite surface of each wafer. If after, each via extends through corresponding aligned conductive traces and, upon separation of individual battery stacks, becomes an exposed conductive channel of a corresponding battery stack.

摘要翻译： 平面固态电池的阵列以对准的布置堆叠，以便随后分离成单独的电池堆叠。 在堆叠之前，在包含阵列的每个晶片的表面上形成重分布层（RDL）; 每个RDL包括第一和第二组导电迹线，每个导体迹线首先从对应的正电池触点横向延伸，并且每个第二组从相应的负电池触点横向延伸。 在堆叠之前或之后形成的导电通孔最终将对准的电池的相应触点耦合在一起。 如果之前，每个通孔延伸穿过每个晶片的对应的电池触点并且耦合到相应的导电层，该导电层被包括在形成于每个晶片的相对表面上的另一个RDL中。 如果之后，每个通孔延伸通过对应的对准的导电迹线，并且在单独的电池堆分离时，成为相应电池堆的暴露的导电通道。

公开(公告)号：US11213690B2

公开(公告)日：2022-01-04

申请号：US13524253

申请日：2012-06-15

申请人： Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

发明人： Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

IPC分类号： H01L23/48 ,  A61N1/39 ,  H01L23/495 ,  H01L25/16

摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

公开(公告)号：US09168384B2

公开(公告)日：2015-10-27

申请号：US13113720

申请日：2011-05-23

申请人： Mohsen Askarinya ,  Erik J. Herrmann

发明人： Mohsen Askarinya ,  Erik J. Herrmann

IPC分类号： A61N1/00 ,  A61N1/375

CPC分类号： A61N1/375 ,  A61N1/3754 ,  A61N1/3756 ,  Y10T29/49204

摘要： An IMD may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, an electrical feedthrough extending through the LCP outer housing to the outer surface, and an electrode structure disposed on the outer surface. The electrode structure may include a LCP substrate defining a first major surface and a second major surface substantially opposite the first major surface, a contact pad disposed on the first major surface, and an electrode disposed on the second major surface. The LCP substrate may be attached to the LCP outer housing and the contact pad may be electrically coupled to the electrical feedthrough.

摘要翻译： IMD可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，延伸穿过LCP外壳到外表面的电馈通，以及设置在外表面上的电极结构。 电极结构可以包括限定第一主表面的LCP衬底和与第一主表面大致相对的第二主表面，设置在第一主表面上的接触垫和设置在第二主表面上的电极。 LCP衬底可以附接到LCP外壳，并且接触焊盘可以电耦合到电馈通。

公开(公告)号：US20120300421A1

公开(公告)日：2012-11-29

申请号：US13113685

申请日：2011-05-23

申请人： Mohsen Askarinya ,  Erik J. Herrmann

发明人： Mohsen Askarinya ,  Erik J. Herrmann

IPC分类号： H05K5/00 ,  H05K3/32 ,  H05K7/02 ,  H05K13/04

CPC分类号： A61M5/14276 ,  A61M2205/02 ,  A61M2205/0244 ,  A61M2205/04 ,  A61M2205/8243 ,  H05K3/284 ,  Y10T29/49117 ,  Y10T29/49124

摘要： An implantable medical device (IMD) may include a liquid crystal polymer (LCP) outer housing defining an outer surface of the IMD, circuitry disposed within the LCP outer housing, and an electrical feedthrough extending from a first end proximate the circuitry to a second end proximate to the outer surface. The electrical feedthrough may define a major axis extending between the first end and the second end, wherein the electrical feedthrough comprises non-uniform width measured in a direction along a plane substantially orthogonal to the major axis.

摘要翻译： 可植入医疗装置（IMD）可以包括限定IMD的外表面的液晶聚合物（LCP）外壳，设置在LCP外壳内的电路，以及从靠近电路的第一端延伸到第二端的电馈通 靠近外表面。 电馈通可以限定在第一端和第二端之间延伸的长轴，其中电馈通包括在沿着与主轴正交的平面的方向上测量的不均匀宽度。

公开(公告)号：US20100249576A1

公开(公告)日：2010-09-30

申请号：US12413112

申请日：2009-03-27

申请人： Mohsen Askarinya ,  Richard Lee Brown

发明人： Mohsen Askarinya ,  Richard Lee Brown

IPC分类号： A61B5/05

CPC分类号： A61B5/062 ,  A61B5/06 ,  A61B5/064 ,  A61B5/1114 ,  A61B5/1126 ,  A61B5/1127 ,  A61B5/4528 ,  A61B5/6846 ,  A61B5/6861 ,  A61B34/20 ,  A61B2034/2051 ,  A61B2090/3916 ,  A61B2090/3983 ,  A61B2562/0219

摘要： Devices, systems, and methods of tracking one or more anatomical features of a patient are disclosed. In one embodiment, a method of tracking anatomical features of a patient includes introducing a first implantable magnetic source into a patient's body, fixedly securing the magnetic source to a first anatomical feature, and monitoring the magnetic field generated by the magnetic source with a magnetic sensing system positioned outside the patient's body in order to track a position of the magnetic source. In another embodiment, a method of tracking anatomical features of a patient includes introducing a first implantable magnetic sensor into a patient's body, fixedly securing the sensor to a first anatomical feature of the patient, and monitoring a strength of a magnetic field generated by a magnetic source positioned outside the patient's body with the sensor in order to track a position of the sensor relative to the magnetic source.

摘要翻译： 公开了跟踪患者的一个或多个解剖特征的装置，系统和方法。 在一个实施例中，跟踪患者的解剖特征的方法包括将第一可植入磁源引入患者体内，将磁源固定地固定在第一解剖特征上，并用磁感应监测由磁源产生的磁场 系统位于患者身体外部，以便跟踪磁源的位置。 在另一个实施例中，跟踪患者解剖特征的方法包括将第一可植入磁性传感器引入患者体内，将传感器固定地固定在患者的第一解剖特征上，并且监测由磁性产生的磁场的强度 源位于患者身体外部的传感器，以便跟踪传感器相对于磁源的位置。

公开(公告)号：US20130334680A1

公开(公告)日：2013-12-19

申请号：US13524253

申请日：2012-06-15

申请人： Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

发明人： Mark R. Boone ,  Mohsen Askarinya ,  Randolph E. Crutchfield ,  Erik J. Herrmann ,  Mark S. Ricotta ,  Lejun Wang

IPC分类号： H01L23/498 ,  H01L21/56

CPC分类号： A61N1/3956 ,  F04C2270/041 ,  H01L23/49548 ,  H01L23/49575 ,  H01L25/16 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multi-chip modular wafer level package of a high voltage unit for an implantable cardiac defibrillator includes one or more high voltage (HV) component chips encapsulated with other components thereof in a polymer mold compound of a single reconstituted wafer, wherein all interconnect segments are preferably located on a single side of the wafer. To electrically couple a contact surface of each HV chip, located on a side of the chip opposite the interconnect side of the wafer, the reconstituted wafer may include conductive through polymer vias; alternately, either wire bonds or layers of conductive polymer are formed to couple the aforementioned contact surface to the corresponding interconnect, prior to encapsulation of the HV chips. In some cases one or more of the components encapsulated in the reconstituted wafer of the package are reconstituted chips.

摘要翻译： 用于可植入心脏除颤器的高电压单元的多芯片模块化晶片级封装包括在单个重构晶片的聚合物模具化合物中与其他组分封装的一个或多个高电压（HV）组件芯片，其中所有互连部分 优选地位于晶片的单侧上。 为了电耦合位于与晶片的互连侧相对的芯片侧的每个HV芯片的接触表面，重构的晶片可以包括导电的通过聚合物通孔; 交替地，在封装HV芯片之前，形成导线或者导电聚合物层以将上述接触表面耦合到相应的互连。 在一些情况下，封装在包装的重构晶片中的一种或多种组分是重组芯片。