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12 条记录 (耗时 0.032 秒)

    Nanoimprint resist
    1.
    发明授权
    Nanoimprint resist 有权
    纳米抗蚀剂

    公开(公告)号：US07431858B2

    公开(公告)日：2008-10-07

    申请号：US10511402

    申请日：2003-04-09

    申请人： Walter Spiess ,  Fumio Kita ,  Michael Meier ,  Andreas Gier ,  Martin Mennig ,  Peter W Oliveira ,  Helmut Schmidt

    发明人： Walter Spiess ,  Fumio Kita ,  Michael Meier ,  Andreas Gier ,  Martin Mennig ,  Peter W Oliveira ,  Helmut Schmidt

    IPC分类号： B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00

    CPC分类号： G03F7/0757 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  G03F7/0047

    摘要： The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.

    摘要翻译： 本发明涉及一种用于微结构化电子部件的方法，其以良好的纵横比产生高分辨率（<= 200nm），同时显着地低于光刻方法。 本发明的方法包括以下步骤：i）制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii）制备由底涂层（b）和载体（c）组成的靶基材; iii）在步骤i）中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii）中获得的底涂层（b） iv）涂覆的溶胶膜材料硬化; v）分离转印压花印模，由此获得作为顶涂层（a）的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤：vi）纳米复合溶胶膜的剩余层被等离子体蚀刻，优选地具有CHF 3 O 2 / O 2等离子体 ; vii）底涂层被等离子体蚀刻，优选为O 2等离子体; viii）蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。

    Nanoimprint resist
    2.
    发明申请
    Nanoimprint resist 有权
    纳米抗蚀剂

    公开(公告)号：US20050224452A1

    公开(公告)日：2005-10-13

    申请号：US10511402

    申请日：2003-04-09

    申请人： Walter Spiess ,  Fumio Kita ,  Michael Meier ,  Andreas Gier ,  Martin Mennig ,  Helmut Schmidt

    发明人： Walter Spiess ,  Fumio Kita ,  Michael Meier ,  Andreas Gier ,  Martin Mennig ,  Helmut Schmidt

    IPC分类号： G03F7/20 ,  B81C1/00 ,  G03F7/00 ,  G03F7/004 ,  G03F7/075 ,  H01L21/027 ,  H01L21/3065 ,  C23F1/00 ,  B05D5/00 ,  B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  G03G15/00 ,  H01L21/311 ,  H01L29/06

    CPC分类号： G03F7/0757 ,  B82Y10/00 ,  B82Y40/00 ,  G03F7/0002 ,  G03F7/0017 ,  G03F7/0047

    摘要： The invention relates to a method for microstructuring electronic components, which yields high resolutions (≦200 nm) at a good aspect ratio while being significantly less expensive than photolithographic methods. The inventive method comprises the following steps: i) a planar unhardened sol film of a nanocomposite composition according to claim 1 is produced; ii) a target substrate consisting of a bottom coat (b) and a support (c) is produced; iii) sol film material obtained in step i) is applied to the bottom coat (b) obtained in step ii) by means of a microstructured transfer embossing stamp; iv) the applied sol film material is hardened; v) the transfer embossing stamp is separated, whereby an embossed microstructure is obtained as a top coat (a). The method for producing a microstructured semiconductor material comprises the following additional steps: vi) the remaining layer of the nanocomposite sol film is plasma etched, preferably with CHF3/O2 plasma; vii) the bottom coat is plasma etched, preferably with O2 plasma; viii) the semiconductor material is etched or the semiconductor material is doped in the etched areas.

    摘要翻译： 本发明涉及一种用于微结构化电子部件的方法，其以良好的纵横比产生高分辨率（<= 200nm），同时显着地低于光刻方法。 本发明的方法包括以下步骤：i）制备根据权利要求1的纳米复合组合物的平面未硬化溶胶膜; ii）制备由底涂层（b）和载体（c）组成的靶基材; iii）在步骤i）中获得的溶胶膜材料通过微结构转印压花印刷施加到在步骤ii）中获得的底涂层（b） iv）涂覆的溶胶膜材料硬化; v）分离转印压花印模，由此获得作为顶涂层（a）的压花微结构。 制造微结构化半导体材料的方法包括以下附加步骤：vi）纳米复合溶胶膜的剩余层被等离子体蚀刻，优选地具有CHF 3 O 2 / O 2等离子体 ; vii）底涂层被等离子体蚀刻，优选为O 2等离子体; viii）蚀刻半导体材料或者在蚀刻区域中掺杂半导体材料。

    Coating composition, based on organically modified inorganic condensates
    4.
    发明授权
    Coating composition, based on organically modified inorganic condensates 失效
    涂料组合物，基于有机改性无机缩合物

    公开(公告)号：US06790532B1

    公开(公告)日：2004-09-14

    申请号：US10111175

    申请日：2002-04-18

    申请人： Andreas Gier ,  Martin Mennig ,  Helmut Schmidt

    发明人： Andreas Gier ,  Martin Mennig ,  Helmut Schmidt

    IPC分类号： B32B904

    CPC分类号： C09D183/08 ,  C03C17/30 ,  C09D183/14 ,  Y10T428/31663

    摘要： A coating composition comprises a polycondensate obtained by reacting a prehydrolysate based on at least on epoxide-containing hydrolysable silane; at least one amine component selected from a prehydrolysate based on at least one amino-containing hydrolysable silane and an amine compound containing at least two amino groups; and an amino group protective reagent. The coating composition is particulary suitable for coating glass, glass ceramic, ceramic, and plastic, and permits an increase in strength and protection against damage.

    摘要翻译： 涂料组合物包含通过基于至少含有环氧化物的可水解硅烷使预水解产物反应获得的缩聚物; 至少一种胺组分，其选自基于至少一种含氨基的可水解硅烷的预水解产物和含有至少两个氨基的胺化合物; 和氨基保护试剂。 涂料组合物特别适用于涂覆玻璃，玻璃陶瓷，陶瓷和塑料，并且允许增加强度和防止损坏。

    Process for Functionalizing Hard Material Particles
    6.
    发明申请
    Process for Functionalizing Hard Material Particles 审中-公开
    功能化硬质材料颗粒的方法

    公开(公告)号：US20110020656A1

    公开(公告)日：2011-01-27

    申请号：US12747622

    申请日：2008-12-12

    申请人： Andreas Gier ,  Ralf Sczepan

    发明人： Andreas Gier ,  Ralf Sczepan

    IPC分类号： B32B21/04 ,  C08G59/00

    CPC分类号： C09C1/407 ,  C08K3/22 ,  C08K9/06 ,  C09C3/12 ,  C09D7/62 ,  Y10T428/31663

    摘要： A process for functionalizing hard material includes reacting at least one anchor molecule with at least one hard material particle, where an anchor molecule has at least one silane bonding group and at least one polymerizable group. A functionalized hard material, in particular a-alumina, and surface coatings containing functionalized hard material, and a workpiece, in particular a wood material panel, an abrasive or a clutch disc, which is in each case provided with a surface coating containing functionalized hard material are described.

    摘要翻译： 用于官能化硬质材料的方法包括使至少一种锚定分子与至少一种硬质材料颗粒反应，其中锚分子具有至少一个硅烷键合基团和至少一个可聚合基团。 功能化的硬质材料，特别是α-氧化铝，以及包含官能化硬质材料的表面涂层，以及工件，特别是木质材料板，磨料或离合器盘，其每一种都具有包含官能化硬的表面涂层 描述材料。